公开(公告)号：JP2011176377A

公开(公告)日：2011-09-08

申请号：JP2011132244

申请日：2011-06-14

Applicant: Jumatech Gmbh ,  ユマテック ゲーエムベーハー

Inventor： WOELFEL MARKUS

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: PROBLEM TO BE SOLVED: To simplify wiring of a wire-printed circuit board to prevent overheating.
SOLUTION: A wire-printed circuit board includes a strip conductor wired on a circuit board; and a conductor adjacent to or combined with the strip conductor and wired inside the circuit board. A wire-printed circuit board includes a strip conductor wired on a surface of a circuit board; and a conductor wired inside the circuit board, and the conductor is wired so as to be positioned on a back face of the strip conductor along the strip conductor.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了简化线印刷电路板的布线，以防止过热。 解决方案：线路电路板包括布线在电路板上的带状导体; 以及邻近或与带状导体组合并且布线在电路板内的导体。 线印刷电路板包括布线在电路板的表面上的带状导体; 以及布线在电路板内部的导体，并且导体被布线以沿着带状导体定位在带状导体的背面上。 版权所有（C）2011，JPO＆INPIT