Abstract:
PROBLEM TO BE SOLVED: To suppress decrease in on-state current in a semiconductor device using an oxide semiconductor film.SOLUTION: A transistor using an oxide semiconductor film comprises: a gate electrode; a gate insulating film covering the gate electrode and containing oxide containing silicon; the oxide semiconductor film provided in contact with the gate insulating film and in a region overlapping with at least the gate electrode; and a source electrode and a drain electrode electrically connected to the oxide semiconductor film. In the oxide semiconductor film, a first region with thickness less than or equal to 5 nm from an interface with the gate insulating film has silicon concentration lower than or equal to 1.0 atom%, and concentration of the silicon contained in a region other than the first region of the oxide semiconductor film is lower than the concentration of the silicon contained in the first region.
Abstract:
PROBLEM TO BE SOLVED: To provide an oxide semiconductor film with more stable electric conductivity, and to provide a semiconductor device with high reliability by giving stable electrical characteristics to the semiconductor device with use of the oxide semiconductor film.SOLUTION: The oxide semiconductor film comprises a region having crystal characteristics, and consists of a crystal where, in the region having the crystal characteristics, an a-b plane is approximately parallel to a film surface and a c-axis is approximately perpendicular to the film surface. The oxide semiconductor film comprises structure more electrically stable against irradiation such as visible light or UV light. By using the oxide semiconductor film as a transistor, the highly reliable semiconductor device with stable electric characteristics can be provided.
Abstract:
PROBLEM TO BE SOLVED: To improve the electric characteristics of a transistor by adjusting the physical property value of an oxide semiconductor layer by solving the problem in which: the correlation between the electric characteristics of a transistor including an oxide semiconductor layer and the physical property value of the oxide semiconductor layer are not yet clarified because the field of the oxide semiconductor has started to attract attention in recent years.SOLUTION: A semiconductor device includes at least a gate electrode, an oxide semiconductor layer, and a gate insulation layer held between the gate electrode and the oxide semiconductor layer. The oxide semiconductor layer has a dielectric constant of 13 or more (or 14 or more).
Abstract:
PROBLEM TO BE SOLVED: To suppress decrease in on-state current in a semiconductor device including an oxide semiconductor.SOLUTION: A transistor based on an oxide semiconductor film comprises: a gate electrode; a gate insulating film which covers the gate electrode and includes an oxide containing silicon; the oxide semiconductor film provided in a region which is in contact with the gate insulating film and overlaps with at least the gate electrode; and a source electrode and a drain electrode electrically connected to the oxide semiconductor film. In the oxide semiconductor film, a first region, which is in contact with the interface with the gate insulating film and has a thickness less than or equal to 5 nm, has a silicon concentration less than or equal to 1.0 atom%, and regions in the oxide semiconductor film other than the first region have lower silicon concentrations than the first region.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which can suppress a cost without complicating a manufacturing process by forming a thin-film transistor using an oxide semiconductor film represented by zinc oxide, and to provide a manufacturing method of the semiconductor device.SOLUTION: In a semiconductor device in which a gate electrode is formed on a substrate, a gate insulating film is formed to cover the gate electrode, an oxide semiconductor film is formed on the gate insulating film, and a first conductive film and a second conductive film are formed on the oxide semiconductor film, the oxide semiconductor film has at least a region crystallized in a channel forming region.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing an oxide semiconductor film with high crystallinity, and a method of manufacturing a transistor having a high field-effect mobility.SOLUTION: In the method of manufacturing the oxide semiconductor film, an oxide semiconductor film is formed in an atmosphere in which no oxygen is intentionally contained on a substrate, and is thermally treated in the atmosphere containing oxygen, so that the oxide semiconductor film is crystallized. In the method of manufacturing a transistor, a gate electrode is formed on a substrate, and a gate insulating film is formed on the gate electrode. The oxide semiconductor film is formed in such atmosphere as no oxygen is intentionally contained on the gate insulating film, and it is subjected to a first thermal treatment in the atmosphere containing oxygen, so that an oxide semiconductor is crystallized. A source electrode and a drain electrode are formed on the oxide semiconductor film that has been crystallized. An insulating film containing oxygen atoms is formed on the oxide semiconductor film that has been crystallized, the source electrode, and the drain electrode, and then the oxide semiconductor film having been crystallized is subjected to a second thermal treatment for oxidation.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device whose manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. SOLUTION: For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a novel method of evaluating an oxide semiconductor since principles of the oxide semiconductor are still unclear and therefore there are no established methods of evaluating an oxide semiconductor although many principles of a silicon semiconductor have been explained. SOLUTION: By the evaluation method, the amount of carrier density is evaluated, and the amount of a hydrogen concentration is also evaluated. Specifically, a MOS capacitor (diode (A) or triode (B)) is manufactured, and the CV characteristics of the MOS capacitor are obtained. Then, the carrier density is estimated from the CV characteristics which are thus obtained. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing complication in manufacturing processes and moreover achieving reduction in cost by forming a thin film transistor with use of an oxide semiconductor film represented by zinc oxide, and to provide a method of manufacturing the same. SOLUTION: In the semiconductor device, a gate electrode 303 is formed on a substrate 301, a gate insulation film 304 is formed covering the gate electrode 303, an oxide semiconductor film 305 is formed on the gate insulation film 304, and a first conductor film 306 and a second conductor film 307 are formed on the oxide semiconductor film 305. The oxide semiconductor film includes a region 308 crystallized at least with heat treatment process LRTA in a channel forming region. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a technique for controlling a decrease in the luminance of electroluminescence elements due to deterioration of the electroluminescence elements without decreasing the amount of current which flows into these elements when the elements emit light. SOLUTION: Charge corresponding to a potential difference between electrodes of an electroluminescence element is accumulated in a period in which the electroluminescence element emits light, the potential difference is detected from the charges and a reference potential of the electroluminescence element is changed based on the detected potential difference so that the luminance of the electroluminescence element is compensated. COPYRIGHT: (C)2010,JPO&INPIT