Composite repair method and composite
    3.
    发明专利
    Composite repair method and composite 有权
    复合修复方法和复合材料

    公开(公告)号:JP2014100847A

    公开(公告)日:2014-06-05

    申请号:JP2012253983

    申请日:2012-11-20

    Abstract: PROBLEM TO BE SOLVED: To provide, in a case where a composite is damaged over the entire thickness direction thereof, a repair method based on access from one side thereof.SOLUTION: In a repair method of the present invention, a frustum-shaped range of a composite 10 is removed, and the composite 10 is adhered to a repair material 20 by performing a vacuum draw. The method of the present invention includes a removal step S2 of removing a damaged portion 11 from the front surface 10A side by punching through the thickness direction thereof in a state where a support wall 14 abutting inward along the diametrical direction from the peripheral edge of the vertex plane 32 of the frustum remains, a rear surface side sealing step S3 of sealing the rear surface 10B side by installing, on the support wall 14, a sealing plate 15 inserted, from the front surface 10A side, into a through-hole 12 formed as a result of removal, a repair material configuration step S5 of configuring, via an interposing adhesive AD, the repair material 20 on the composite 10 from which the frustum-shaped range thereof has been removed, and a vacuum draw step S6 of sealing and vacuum-drawing the front surface 10A side.

    Abstract translation: 要解决的问题:在复合材料在其整个厚度方向上损坏的情况下,提供一种基于从其一侧进入的修复方法。解决方案:在本发明的修补方法中,截头锥形范围 去除复合材料10,并通过进行真空拉伸将复合材料10粘附到修补材料20上。 本发明的方法包括一个去除步骤S2,该步骤S2是从沿着直径方向的内侧沿着直径方向从外侧边缘抵接的支撑壁14的状态,通过其厚度方向冲压而从前表面10A侧移除受损部分11 截头锥体的顶面32保持,后表面侧密封步骤S3通过在支撑壁14上安装从前表面10A侧插入到通孔12中的密封板15来密封后表面10B侧 作为去除的结果形成的修复材料配置步骤S5,通过中间粘合剂AD将修复材料20配置在去除其截头圆锥形范围的复合材料10上,以及密封 并真空拉伸前表面10A侧。

    Carbon fiber-reinforced plastic molded body and method of producing the same
    4.
    发明专利
    Carbon fiber-reinforced plastic molded body and method of producing the same 有权
    碳纤维增强塑料成型体及其制造方法

    公开(公告)号:JP2011110796A

    公开(公告)日:2011-06-09

    申请号:JP2009268845

    申请日:2009-11-26

    Abstract: PROBLEM TO BE SOLVED: To provide a carbon fiber-reinforced plastic molded body and a method of producing the carbon fiber-reinforced plastic molded body, capable of improving an interlayer toughness. SOLUTION: The carbon fiber-reinforced plastic molded body (CFRP molded body) 1 includes: a plurality of carbon fiber layers 2 comprising carbon fibes; resin bodies 3 into which the carbon fiber layers 2 are embedded; and pins 5 which are inserted into a plurality of holes 4 formed on the resin bodies 3 to be laid between the carbon fiber layers 2 and are fixed. In the CFRP molded body 1, the pins 5 are inserted into the plurality of holes 4 formed on the resin bodies 3 to be laid between the carbon fiber layers 2, are fixed and, as the result, the interlayer toughness of the CFRP molded body 1 can be improved. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 待解决的问题:提供一种能够提高层间韧性的碳纤维增强塑料成型体和碳纤维增强塑料成形体的制造方法。 解决方案:碳纤维增强塑料成型体(CFRP成型体)1包括:碳纤维的多个碳纤维层2; 嵌入碳纤维层2的树脂体3; 以及插入到形成在树脂体3上的多个孔4中以被放置在碳纤维层2之间并固定的销5。 在CFRP成型体1中,销5被插入形成在树脂体3上的多个孔4中,以铺设在碳纤维层2之间,固定,结果,CFRP成型体的层间韧性 1可以改进。 版权所有(C)2011,JPO&INPIT

    Mems device and its assembly method
    6.
    发明专利
    Mems device and its assembly method 审中-公开
    MEMS器件及其组装方法

    公开(公告)号:JP2008068396A

    公开(公告)日:2008-03-27

    申请号:JP2007236247

    申请日:2007-09-12

    Abstract: PROBLEM TO BE SOLVED: To improve flatness of a MEMS device so that mating faces of the MEMS device and substrate are joined by using an adhesive. SOLUTION: A method for gluing the MEMS device to the substrate in order to form a MEMS device assembly comprises the steps of: measuring at least one of a thickness profile S100a of the MEMS device and flatness S100b of the mating face of the substrate; S110 applying the adhesive on at least one of the mating face of the MEMS device and mating face of the substrate; and S120 joining the mating faces of the MEMS device and substrate so that the adhesive makes the MEMS device and substrate glue. An amount of the adhesive applied on one of two mating faces or both mating faces is selected so as to compensate the thickness profile of the MEMS device and the locally fluctuated flatness of the mating face of the substrate. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:为了提高MEMS器件的平坦度,使得通过使用粘合剂将MEMS器件和衬底的配合面接合。 解决方案:用于将MEMS器件胶合到衬底以形成MEMS器件组件的方法包括以下步骤:测量MEMS器件的厚度分布S100a和配对面的平坦度S100b中的至少一个 基质; S110将粘合剂施加到MEMS装置的配合面和基板的配合面中的至少一个上; 和S120连接MEMS器件和衬底的配合面,使得粘合剂使得MEMS器件和衬底胶合。 选择施加在两个配合面中的一个或两个配合面上的粘合剂的量,以补偿MEMS装置的厚度分布和基板的配合面的局部波动的平坦度。 版权所有(C)2008,JPO&INPIT

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