반도체 장치의 제작 방법
    3.
    发明公开
    반도체 장치의 제작 방법 审中-实审
    半导体器件的制造方法

    公开(公告)号:KR1020120016586A

    公开(公告)日:2012-02-24

    申请号:KR1020110078910

    申请日:2011-08-09

    Abstract: PURPOSE: A method for manufacturing a semiconductor device is provided to reduce oxygen deficit which is included in an oxide semiconductor film by heating a part of oxygen included in an oxide insulation film and diffusing the oxygen to the oxide semiconductor film. CONSTITUTION: An oxide insulation film(53) is formed on the substrate(51). An oxide semiconductor film(57) is formed on the oxide insulation film. An oxide semiconductor film(59) of an island shape is formed by etching a part of the oxide semiconductor film. A pair of electrodes(61) is formed on the oxide semiconductor film of the island shape. A gate insulating layer(63) is formed on the oxide semiconductor film of the island shape and a pair of electrodes. A gate electrode overlapped with the oxide semiconductor film of the island shape is formed.

    Abstract translation: 目的:提供一种用于制造半导体器件的方法,通过加热包含在氧化物绝缘膜中的氧的一部分并将氧扩散到氧化物半导体膜来减少包含在氧化物半导体膜中的氧缺陷。 构成:在基板(51)上形成氧化物绝缘膜(53)。 氧化物半导体膜(57)形成在氧化物绝缘膜上。 通过蚀刻氧化物半导体膜的一部分来形成岛状氧化物半导体膜(59)。 在岛状氧化物半导体膜上形成一对电极(61)。 在岛状氧化物半导体膜上形成栅极绝缘层(63)和一对电极。 形成与岛状氧化物半导体膜重叠的栅电极。

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