摘要:
모니터 장치(20)에 있어서, 표시부로서의 액정 디스플레이(25)와, 액정 디스플레이(25)를 제어하기 위한 구동 기판(30)과, 구동 기판(30)에 간극을 두고 대향배치된 모니터 기판(29)과, 구동 기판(30) 및 모니터 기판(29) 사이의 간극에 배치되고 또한 액정 디스플레이(25)를 유지하는 수지제의 홀더(28)와, 구동 기판(30)과 모니터 기판(29)을 전기적으로 접속하는 플랫 케이블(35)을 구비하고, 홀더(28)에는 플랫 케이블(35)을 삽통하는 케이블 삽통구(62)가 형성되고, 케이블 삽통구(62) 내에는 삽통되는 상기 플랫 케이블의 폭 방향으로 평행하고 또한 상기 케이블의 길이 방향으로 이간된 제 1, 제 2 구속부(63, 64)가 설치되어 있다.
摘要:
The present invention relates to a display device. Particularly, the technical object of the present invention is to provide a display device and a manufacturing method thereof, capable of reducing a bezel width. The display device according to the present invention includes a display panel which includes a display unit on which a plurality of pixels are formed, a bending part which is formed on one side of the display unit, a first substrate which includes a pad unit which is formed on the end of the bending part and a second substrate which is boned to the first substrate to face the first substrate, a back film which is attached on a region corresponding to the display unit and the pad unit on the lower side of the first substrate, and a support member which supports the back film which is attached to the region corresponding to the display unit and is formed to guide the bending part.
摘要:
The present invention relates to a printed circuit board structure in which a plurality of printed circuit boards is bonded and a manufacturing method thereof. The structure with a wide area for mounting an element has a low manufacturing coast and a simple manufacturing process and ensures a high reliability. The printed circuit board structure according to the present invention comprises a first circuit board; a second circuit board which forms a cavity as the upper surface of the second circuit board is partially bonded to the lower surface of the first circuit board and which has at least one pad on the lower surface; a plurality of elements which is mounted on the upper surface of the first circuit board and in the cavity; filler which is filled between the first circuit board and the second circuit board; and a molding member which seals the element mounted on the upper surface of the first circuit board.