公开(公告)号：KR102257234B1

公开(公告)日：2021-05-26

申请号：KR1020200177737

申请日：2020-12-17

Applicant: 테사 소시에타스 유로파에아

Inventor： 크라빈켈,토르스텐 ,  푈스,얀-올레

IPC: C09J7/38 ,  C09J5/08 ,  C09J153/02 ,  C09J109/02 ,  C09J7/21 ,  C09J7/22

Abstract: 본발명은적어도하나의접착제층 및선택적으로적어도하나의추가층으로제조된발포된접착테이프를구조화하는공정으로서, 적어도하나의접착제층이발포되어있으며, 본공정에서, 접착테이프는롤의도움으로라이너를통해엠보싱되는구조에의해표면상에구조화되는공정에관한것이다.

公开(公告)号：KR102017568B1

公开(公告)日：2019-09-06

申请号：KR1020180169852

申请日：2018-12-26

Applicant: 명성티엔에스주식회사

Inventor： 김영진 ,  이용진

IPC: H01M2/16 ,  H01M2/14 ,  C08F214/22 ,  C08L27/16 ,  C09D127/20 ,  C09D127/16 ,  C09D133/00 ,  C09D109/06 ,  C09D109/02 ,  C09D109/00 ,  C09D129/04 ,  C09D7/61 ,  C09D7/40 ,  C09J127/16 ,  C09J127/20 ,  C09J133/00 ,  C09J109/06 ,  C09J109/02 ,  C09J109/00

公开(公告)号：KR20180034406A

公开(公告)日：2018-04-04

申请号：KR20187001761

申请日：2016-07-28

IPC: C08F279/02 ,  C08F2/44 ,  C08L51/04 ,  C09J11/06 ,  C09J109/02

CPC classification number: C08F2/44 ,  C09J11/00 ,  C09J109/02 ,  C09J157/04

Abstract: 저온에서의박리강도가우수하고강한충격에도견딜수 있는 (메타)아크릴계접착제조성물의제공. (1) 중합성비닐모노머, (2) 중합개시제, (3) 환원제, (4) 말단에중합성불포화이중결합을가지지않고 (메타)아크릴로니트릴함유량이 10~30몰%인엘라스토머를함유하여이루어지는조성물. (1) 중합성비닐모노머, (2) 중합개시제, (3) 환원제, (4) 말단에중합성불포화이중결합을가지고 (메타)아크릴로니트릴함유량이 10~30몰%인엘라스토머, (5) 말단에중합성불포화이중결합을가지지않는엘라스토머를함유하여이루어지는조성물.

Abstract translation: （甲基）丙烯酸类粘合剂组合物，其在低温下的剥离强度优异并且能够承受强烈的冲击。 （1）聚合性乙烯基单体，（2）聚合引发剂，（3）还原剂，（4）（甲基）丙烯腈含量为10〜30摩尔％ 等等。 （1）聚合性乙烯基单体，（2）聚合引发剂，（3）还原剂，（4）（甲基）丙烯腈含量为10〜30摩尔％ 并且没有末端多不饱和双键的弹性体。

公开(公告)号：KR1020140100952A

公开(公告)日：2014-08-18

申请号：KR1020147015453

申请日：2012-11-09

Applicant: 정저우 종위안 어플라이드 테크놀로지 리서치 앤드 디벨롭먼트 컴퍼니 리미티드

Inventor： 장더헝 ,  쿵쥔스 ,  리원리 ,  우환 ,  양야쥐안

IPC: C09J109/02 ,  C09J163/02 ,  C09J181/04

CPC classification number: C09J147/00 ,  B29C47/0066 ,  C08K3/013 ,  C08L9/02 ,  C08L23/20 ,  C08L63/00 ,  C08L81/04 ,  C09J109/02 ,  C09J163/00 ,  C08K3/0033

Abstract: 본 발명은 자동차내 리어 뷰 미러 베이스에 사용되는 구조용 접착시트 및 그 제조방법에 관한 것으로, 상기 구조용 접착시트는 니트릴 부타디엔 고무 20∼100중량부, 일부분이 경화된 폴리설파이드 접착제 10∼70중량부, 비스페놀 A형 에폭시 수지 5∼40중량부, 가교제 0.1∼2.5중량부, 연화제 0.2∼2.5중량부, 경화제 3∼20중량부, 촉진제 1∼10중량부, 무기충전제 20∼100중량부 및 실란커플링제 0.1∼3.0중량부를 포함한다. 상기 성분들은 혼련 및 압출제막 공정을 거쳐 본 발명의 구조용 접착시트로 제조된다. 상기 구조용 접착시트는 제막성능이 우수하고 경화공정이 간단하며 경화후의 강도가 높으며 인성, 내열성 및 내한성이 우수하다.

公开(公告)号：KR101401162B1

公开(公告)日：2014-05-29

申请号：KR1020127023214

申请日：2011-03-23

Applicant: 가부시키가이샤 도모에가와 세이시쇼

Inventor： 시미즈유키 ,  이와부치다츠루 ,  도치히라준

IPC: C09J109/02 ,  C09J7/02 ,  C09J11/04 ,  H01L21/60

CPC classification number: H01L24/29 ,  C08K5/3415 ,  C08L61/04 ,  C08L61/06 ,  C08L2666/16 ,  C09J7/22 ,  C09J7/30 ,  C09J109/02 ,  C09J113/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2409/00 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2479/086 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: 유기용매 중에 성분 (a) 아크릴로니트릴-부타디엔 공중합체, 성분 (b) 페놀 수지, 성분 (c) 말레이미드기를 2개 이상 함유하는 화합물을 용해한 액상 접착제이며, 상기 성분 (c)는 식 (1)로 표시되는 화합물, 및 하기 (2)로 표시되는 화합물을 포함하는 것을 특징으로 하는 전자 부품용 액상 접착제.

Abstract translation: 一种用于电子部件的液体粘合剂，其由含有（a）丙烯腈/丁二烯共聚物，（b）酚醛树脂的有机溶剂溶液和（c）由各自含有两个或多个马来酰亚胺基的化合物组成的组分组成，其特征在于 组分（c）含有通式（1）表示的化合物和通式（2）表示的化合物。

公开(公告)号：KR1020120124479A

公开(公告)日：2012-11-13

申请号：KR1020127023214

申请日：2011-03-23

Applicant: 가부시키가이샤 도모에가와 세이시쇼

Inventor： 시미즈유키 ,  이와부치다츠루 ,  도치히라준

IPC: C09J109/02 ,  C09J7/02 ,  C09J11/04 ,  H01L21/60

CPC classification number: H01L24/29 ,  C08K5/3415 ,  C08L61/04 ,  C08L61/06 ,  C08L2666/16 ,  C09J7/22 ,  C09J7/30 ,  C09J109/02 ,  C09J113/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2409/00 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2479/086 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  C09J11/04

Abstract: 유기용매 중에 성분 (a) 아크릴로니트릴-부타디엔 공중합체, 성분 (b) 페놀 수지, 성분 (c) 말레이미드기를 2개 이상 함유하는 화합물을 용해한 액상 접착제이며, 상기 성분 (c)는 식 (1)로 표시되는 화합물, 및 하기 (2)로 표시되는 화합물을 포함하는 것을 특징으로 하는 전자 부품용 액상 접착제.

Abstract translation: 一种用于电子部件的液体粘合剂，其由含有（a）丙烯腈/丁二烯共聚物，（b）酚醛树脂的有机溶剂溶液和（c）由各自含有两个或多个马来酰亚胺基的化合物组成的组分组成，其特征在于 组分（c）含有通式（1）表示的化合物和通式（2）表示的化合物。

公开(公告)号：KR20120044199A

公开(公告)日：2012-05-07

申请号：KR20100105634

申请日：2010-10-27

Applicant: TORAY ADVANCED MAT KOREA INC

Inventor： KIM SANG PILL ,  MOON KI JEONG ,  KIM WOO SUK ,  HWANG NAM ICK

IPC: C09J163/00 ,  C09J7/02 ,  C09J109/02 ,  C09J161/10

CPC classification number: C09J163/00 ,  C09J7/22 ,  C09J7/25 ,  C09J7/35 ,  C09J109/02 ,  C09J161/06 ,  C09J2201/128 ,  C09J2201/61 ,  C09J2201/622 ,  C09J2203/326

Abstract: PURPOSE: An adhesive composition is provided to have excellent adhesion and flowability, thereby not needing high temperatures attaching process, and decrease failure ratio due to stress of high temperature attaching process. CONSTITUTION: An adhesive tape comprises material(1), and adhesive layer(2), which is formed on one side or both sides of the substrate, of which glass transition temperature(Tg) is 40-80 °C. The adhesive layer is formed from an adhesive composition. The adhesive composition comprises 100.0 parts by weight of epoxy resin and 1-5,000 parts by weight of phenol resin. The epoxy equivalent of the epoxy resin is 155-300 g/eq, and the hydroxy equivalent is 95-300 g/eq.

Abstract translation: 目的：提供粘合剂组合物以具有优异的粘合性和流动性，从而不需要高温附着工艺，并且由于高温附着工艺的应力而降低失效率。 构成：粘合带包括材料（1）和粘合剂层（2），其形成在基材的一侧或两侧，其玻璃化转变温度（Tg）为40-80℃。 粘合剂层由粘合剂组合物形成。 粘合剂组合物包含100.0重量份的环氧树脂和1-5,000重量份的酚醛树脂。 环氧树脂的环氧当量为155-300g / eq，羟基当量为95-300g / eq。

公开(公告)号：KR1020100082181A

公开(公告)日：2010-07-16

申请号：KR1020090001545

申请日：2009-01-08

Applicant: 도레이첨단소재 주식회사

Inventor： 신현민 ,  전해상 ,  문기정 ,  김우석

IPC: C09J109/02 ,  C09J163/00

Abstract: PURPOSE: A heat resistant adhesive composition is provided to have excellent adhesive force and workability, to obtain enough heat resistance when electronic parts are combined on a lead frame of a semiconductor device, and to obtain high reliability at a high temperature. CONSTITUTION: A heat resistant adhesive composition includes 1-400 parts by weight of an epoxy resin, 1-200 parts by weight of a phenolic resin, 0.01-50 parts by weight of an antioxidant, 0.01-10 parts by weight of an anticorrosive agent, 0.01-50 parts by weight of a hardener, and 0.001-10 parts by weight of a curing accelerator. The acrylonitrile butadiene rubber has the content of a carboxylic group of 0.1-10.0 weight%.

Abstract translation: 目的：提供耐热粘合剂组合物以具有优异的粘合力和可加工性，以在电子部件组合在半导体器件的引线框架上时获得足够的耐热性，并在高温下获得高可靠性。 构成：耐热粘合剂组合物包含1-400重量份的环氧树脂，1-200重量份的酚醛树脂，0.01-50重量份的抗氧化剂，0.01-10重量份的防腐剂 ，0.01-50重量份的硬化剂和0.001-10重量份的固化促进剂。 丙烯腈丁二烯橡胶的羧基含量为0.1-10.0重量％。

公开(公告)号：KR1020060108508A

公开(公告)日：2006-10-18

申请号：KR1020060033020

申请日：2006-04-12

Applicant: 신에쓰 가가꾸 고교 가부시끼가이샤

Inventor： 나까니시,도루 ,  곤도,가즈노리 ,  호시다,시게히로 ,  아마노,다다시

IPC: C09J163/00 ,  C09J109/02 ,  C09J133/06

CPC classification number: H05K3/386 ,  B32B7/12 ,  B32B15/06 ,  B32B15/092 ,  B32B15/16 ,  B32B15/20 ,  B32B25/08 ,  B32B25/16 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  B32B2264/104 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2405/00 ,  B32B2457/00 ,  C08J5/125 ,  C08K5/3462 ,  C08K5/34922 ,  C08K5/5205 ,  C08L33/08 ,  C08L33/20 ,  C08L55/02 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/10 ,  C09J11/06 ,  C09J113/00 ,  C09J133/08 ,  C09J133/20 ,  C09J155/02 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2455/00 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09K21/12 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2203/122 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31721

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates.

公开(公告)号：KR1020060108506A

公开(公告)日：2006-10-18

申请号：KR1020060033018

申请日：2006-04-12

Applicant: 신에쓰 가가꾸 고교 가부시끼가이샤

Inventor： 나까니시,도루 ,  곤도,가즈노리 ,  호시다,시게히로 ,  아마노,다다시

IPC: C09J163/00 ,  C09J109/02 ,  C09J133/06

CPC classification number: H05K3/386 ,  C08J5/125 ,  C08K3/016 ,  C08K5/5313 ,  C08L33/08 ,  C08L33/20 ,  C08L55/02 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/14 ,  C09J11/06 ,  C09J113/00 ,  C09J133/08 ,  C09J133/10 ,  C09J133/18 ,  C09J133/20 ,  C09J155/02 ,  C09J163/00 ,  C09K21/12 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2203/122 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.