Abstract:
유기용매 중에 성분 (a) 아크릴로니트릴-부타디엔 공중합체, 성분 (b) 페놀 수지, 성분 (c) 말레이미드기를 2개 이상 함유하는 화합물을 용해한 액상 접착제이며, 상기 성분 (c)는 식 (1)로 표시되는 화합물, 및 하기 (2)로 표시되는 화합물을 포함하는 것을 특징으로 하는 전자 부품용 액상 접착제.
Abstract:
유기용매 중에 성분 (a) 아크릴로니트릴-부타디엔 공중합체, 성분 (b) 페놀 수지, 성분 (c) 말레이미드기를 2개 이상 함유하는 화합물을 용해한 액상 접착제이며, 상기 성분 (c)는 식 (1)로 표시되는 화합물, 및 하기 (2)로 표시되는 화합물을 포함하는 것을 특징으로 하는 전자 부품용 액상 접착제.
Abstract:
PURPOSE: An adhesive composition is provided to have excellent adhesion and flowability, thereby not needing high temperatures attaching process, and decrease failure ratio due to stress of high temperature attaching process. CONSTITUTION: An adhesive tape comprises material(1), and adhesive layer(2), which is formed on one side or both sides of the substrate, of which glass transition temperature(Tg) is 40-80 °C. The adhesive layer is formed from an adhesive composition. The adhesive composition comprises 100.0 parts by weight of epoxy resin and 1-5,000 parts by weight of phenol resin. The epoxy equivalent of the epoxy resin is 155-300 g/eq, and the hydroxy equivalent is 95-300 g/eq.
Abstract:
PURPOSE: A heat resistant adhesive composition is provided to have excellent adhesive force and workability, to obtain enough heat resistance when electronic parts are combined on a lead frame of a semiconductor device, and to obtain high reliability at a high temperature. CONSTITUTION: A heat resistant adhesive composition includes 1-400 parts by weight of an epoxy resin, 1-200 parts by weight of a phenolic resin, 0.01-50 parts by weight of an antioxidant, 0.01-10 parts by weight of an anticorrosive agent, 0.01-50 parts by weight of a hardener, and 0.001-10 parts by weight of a curing accelerator. The acrylonitrile butadiene rubber has the content of a carboxylic group of 0.1-10.0 weight%.
Abstract:
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates.
Abstract:
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.