조성물
    3.
    发明公开
    조성물 审中-公开
    组成

    公开(公告)号:KR20180034406A

    公开(公告)日:2018-04-04

    申请号:KR20187001761

    申请日:2016-07-28

    CPC classification number: C08F2/44 C09J11/00 C09J109/02 C09J157/04

    Abstract: 저온에서의박리강도가우수하고강한충격에도견딜수 있는 (메타)아크릴계접착제조성물의제공. (1) 중합성비닐모노머, (2) 중합개시제, (3) 환원제, (4) 말단에중합성불포화이중결합을가지지않고 (메타)아크릴로니트릴함유량이 10~30몰%인엘라스토머를함유하여이루어지는조성물. (1) 중합성비닐모노머, (2) 중합개시제, (3) 환원제, (4) 말단에중합성불포화이중결합을가지고 (메타)아크릴로니트릴함유량이 10~30몰%인엘라스토머, (5) 말단에중합성불포화이중결합을가지지않는엘라스토머를함유하여이루어지는조성물.

    Abstract translation: (甲基)丙烯酸类粘合剂组合物,其在低温下的剥离强度优异并且能够承受强烈的冲击。 (1)聚合性乙烯基单体,(2)聚合引发剂,(3)还原剂,(4)(甲基)丙烯腈含量为10〜30摩尔% 等等。 (1)聚合性乙烯基单体,(2)聚合引发剂,(3)还原剂,(4)(甲基)丙烯腈含量为10〜30摩尔% 并且没有末端多不饱和双键的弹性体。

    Adhesive compound and adhesive tape for electronic accessories
    7.
    发明公开
    Adhesive compound and adhesive tape for electronic accessories 审中-公开
    电子附件胶粘剂胶带

    公开(公告)号:KR20120044199A

    公开(公告)日:2012-05-07

    申请号:KR20100105634

    申请日:2010-10-27

    Abstract: PURPOSE: An adhesive composition is provided to have excellent adhesion and flowability, thereby not needing high temperatures attaching process, and decrease failure ratio due to stress of high temperature attaching process. CONSTITUTION: An adhesive tape comprises material(1), and adhesive layer(2), which is formed on one side or both sides of the substrate, of which glass transition temperature(Tg) is 40-80 °C. The adhesive layer is formed from an adhesive composition. The adhesive composition comprises 100.0 parts by weight of epoxy resin and 1-5,000 parts by weight of phenol resin. The epoxy equivalent of the epoxy resin is 155-300 g/eq, and the hydroxy equivalent is 95-300 g/eq.

    Abstract translation: 目的:提供粘合剂组合物以具有优异的粘合性和流动性,从而不需要高温附着工艺,并且由于高温附着工艺的应力而降低失效率。 构成:粘合带包括材料(1)和粘合剂层(2),其形成在基材的一侧或两侧,其玻璃化转变温度(Tg)为40-80℃。 粘合剂层由粘合剂组合物形成。 粘合剂组合物包含100.0重量份的环氧树脂和1-5,000重量份的酚醛树脂。 环氧树脂的环氧当量为155-300g / eq,羟基当量为95-300g / eq。

    신뢰성이 우수한 내열성 접착제 조성물
    8.
    发明公开
    신뢰성이 우수한 내열성 접착제 조성물 无效
    高可靠耐热粘合剂组合物

    公开(公告)号:KR1020100082181A

    公开(公告)日:2010-07-16

    申请号:KR1020090001545

    申请日:2009-01-08

    Abstract: PURPOSE: A heat resistant adhesive composition is provided to have excellent adhesive force and workability, to obtain enough heat resistance when electronic parts are combined on a lead frame of a semiconductor device, and to obtain high reliability at a high temperature. CONSTITUTION: A heat resistant adhesive composition includes 1-400 parts by weight of an epoxy resin, 1-200 parts by weight of a phenolic resin, 0.01-50 parts by weight of an antioxidant, 0.01-10 parts by weight of an anticorrosive agent, 0.01-50 parts by weight of a hardener, and 0.001-10 parts by weight of a curing accelerator. The acrylonitrile butadiene rubber has the content of a carboxylic group of 0.1-10.0 weight%.

    Abstract translation: 目的:提供耐热粘合剂组合物以具有优异的粘合力和可加工性,以在电子部件组合在半导体器件的引线框架上时获得足够的耐热性,并在高温下获得高可靠性。 构成:耐热粘合剂组合物包含1-400重量份的环氧树脂,1-200重量份的酚醛树脂,0.01-50重量份的抗氧化剂,0.01-10重量份的防腐剂 ,0.01-50重量份的硬化剂和0.001-10重量份的固化促进剂。 丙烯腈丁二烯橡胶的羧基含量为0.1-10.0重量%。

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