摘要:
A rinsing liquid adheres to a substrate subjected to a cleaning process. The rinsing liquid on the substrate is first replaced with IPA liquid. While the substrate covered with the IPA liquid is held in a dryer chamber, liquid carbon dioxide is supplied to the surface of the substrate. Liquid nitrogen is supplied to cool down the interior of the dryer chamber. This solidifies the liquid carbon dioxide on the substrate into solid carbon dioxide. Thereafter, the pressure in the dryer chamber is returned to atmospheric pressure, and gaseous nitrogen is supplied into the dryer chamber. Thus, the temperature in the dryer chamber increases. The solid carbon dioxide on the surface of the substrate is sublimated, and is hence removed from the substrate. All of the steps are performed while carbon dioxide is not in a supercritical state but in a non-supercritical state.
摘要:
A printing apparatus performing printing to a print medium includes a printer having at least two line heads with a plurality of recording modules; a scanner configured to scan an image printed with the printer to obtain a scanned image; a correcting-chart printing unit configured to print first and second correcting charts in first and second line head printing areas, respectively; a scanned image collecting unit configured to collect first and second scanned images; a correction-data calculating device configured to calculate correction data by determining a reference head difference from the first scanned image, determining an individual head difference from the second scanned image, summing up the reference head difference and the individual head difference to obtain a total, the reference head difference and the total being regarded as the correction data for the first and second line heads, respectively; and an adjusting device configured to adjust a timing
摘要:
After the completion of the transport of a semiconductor wafer into a chamber, the flow rate of nitrogen gas supplied into the chamber is decreased. In this state, a preheating treatment and flash irradiation are performed. The flow rate of nitrogen gas supplied into the chamber is increased when the temperature of the front surface of the semiconductor wafer is decreased to become equal to the temperature of the back surface thereof after reaching its maximum temperature by the irradiation of the substrate with a flash of light. Thereafter, the supply flow rate of nitrogen gas is maintained at a constant value until the semiconductor wafer is transported out of the chamber. This achieves the reduction in particles deposited on the semiconductor wafer while suppressing adverse effects resulting from the nonuniform in-plane temperature distribution of the semiconductor wafer.
摘要:
In an inkjet printer, an ejecting part for K color is previously selected as an ejecting part for outputting three values used for formation of a large dot, formation of a medium dot, and non-ejection (step S12). In the course of image recording (steps S13, S14, and S15), three values are output regarding K color, and four values used for formation of a large dot, formation of a medium dot, formation of a small dot, and non-ejection are output regarding C, M, and Y colors. Thus, even if the quality of a dot in K color is reduced at the time of outputting four values, a high-quality dot can be formed regarding K color, so that the quality of a recorded image can be improved in a case where line drawing or a character or the like is recorded.
摘要:
A liquid supply apparatus includes a reservoir for storing a liquid therein, a supply path for supplying the liquid from the reservoir to a liquid consuming apparatus, a pump for feeding the liquid from the reservoir to the supply path, and a controller for outputting a driving signal to the pump to control the supply of the liquid. The controller acquires a target feed volume of the liquid from the pump to gradually change a feed volume of the liquid from the pump from a current feed volume to the target feed volume, based on a request signal from the liquid consuming apparatus serving as a destination to which the liquid is supplied. This suppresses an abrupt change in pressure in the liquid consuming apparatus serving as the destination to which the liquid is supplied.
摘要:
In a head (21) of an inkjet printer, a plurality of outlet rows are arranged in a scanning direction, the plurality of outlet rows each having a plurality of outlets arranged in a direction intersecting the scanning direction. The plurality of outlets are each capable of forming dots of a plurality of sizes on printing paper upon receiving different driving signals from an ejection control part (44). In the inkjet printer, under control of the ejection control part (44), some of the outlet rows form dots of only one size out of the plurality of sizes, and the other outlet rows form dots of only another size. In this way, causing the plurality of outlets in each outlet row to form dots of only one size makes it possible to reduce the occurrence of satellite droplets or the like and improve print quality.
摘要:
Provided is an inkjet printing apparatus configured to perform printing by discharging ink droplets onto a print medium. The apparatus includes a printing head having a plurality of inkjet heads and configured to perform printing by discharging the ink droplets from the plurality of inkjet heads onto the print medium; a chart printing device configured to print a step-shift correcting chart with the printing head; a reading device configured to read the step-shift correcting chart printed on the print medium; a print medium-processed portion detecting device configured to detect a processed portion of the print medium; an uninfluenced step-shift correcting-chart generating device configured to generate an uninfluenced step-shift correcting chart; and a shift-amount calculating device configured to calculate a shift amount for correcting the step shift in accordance with the uninfluenced step-shift correcting chart.
摘要:
A tip section of a discharge nozzle 31 is shaped like a wedge, and projections 310 which further protrude are formed at the tip of the wedge. Lower surfaces 310b of the projections 310 define a substrate-facing-surface which is brought into proximity to the substrate, and discharge outlet bearing surfaces 310c, which gradually retract back from the substrate W, are formed as if to rise from the edges of the lower surfaces 310b. At adjacent positions within the discharge outlet bearing surface 310c which are adjacent to the substrate-facing-surface 310b, discharge outlets 311 for discharging an application liquid are opened. Areas around the discharge outlets 311 and a wall around a fluid feeding path 312 are integrated with each other.
摘要:
A photodiode excellent in responsivity receives flashes of light emitted from flash lamps in the process of heating a semiconductor wafer by irradiation with flashes of light, and the waveform of the intensity of the flashes of light versus time is acquired using voltage data obtained from an output from the photodiode. Then, a temperature calculating part performs a heat conduction simulation using the acquired data to calculate the temperature of the semiconductor wafer irradiated with the flashes of light from the flash lamps. The temperature of the semiconductor wafer is computed using data corresponding to the intensity of the flashes of light obtained from the output from the photodiode. This allows the determination of the surface temperature of the semiconductor wafer irradiated with the flashes of light, irrespective of the waveform of the emission intensity of the flash lamps.
摘要:
A rinsing liquid adheres in a piled up state to the entire front surface of the substrate which is rinsed with the rinsing liquid discharged from a rinse nozzle, thereby forming a so-called puddle-like rinse layer. An opposed surface of a proximity block is positioned in the vicinity of a front surface of a substrate and a liquid-tight layer is formed in a gap space between the opposed surface and the front surface of the substrate. In a condition that the liquid-tight layer is formed, the proximity block moves in the moving direction, and a solvent gas containing a solvent component, which dissolves in the liquid to reduce a surface tension, is supplied toward an upstream-side edge of the liquid-tight layer.