Abstract:
An interposer element in a multidimensional integrated circuit with stacked elements has one or more conductors, especially power supply lines, coupled through decoupling networks defining low impedance shunts for high frequency signals to ground. The interposer has successive tiers including silicon, metal and dielectric deposition layers. The decoupling network for a conductor has at least one and preferably two reactive transmission lines. A transmission line has an inductor in series with the conductor and parallel capacitances at the inductor terminals. The inductors are formed by traces in spaced metal deposition layers forming coil windings and through vias connecting between layers to permit conductor crossovers. The capacitances are formed by MOScaps in the interposer layers. An embodiment has serially coupled coils with capacitances at the input, output and junction between the coils, wherein the coils are magnetically coupled to form a transformer.
Abstract:
The present invention relates to an electrostatic discharge (ESD) protection circuit, and more particularly to a band-pass structure electrostatic discharge protection circuit. An ESD protection circuit is disposed at the input of a radio frequency (RF) core circuit. The ESD protection circuit comprises a plurality of diodes and inductors constructing a plurality of discharging paths, wherein the diodes and inductors forms a band-pass filter structure. Such that, the RF core circuit with the ESD protection circuit of the present invention feature much higher ESD robustness and better RF performance than the conventional design.
Abstract:
The present invention relates to an electrostatic discharge (ESD) protection circuit, and more particularly to a low parasitic capacitance electrostatic discharge protection circuit. An ESD protection circuit is established with the structure in accordance with the present invention comprising a plurality of discharging paths. The ESD protection circuit is connected to the input/output pad of a radio frequency (RF) core circuit. Such that, the RF core circuit with the ESD protection circuit of the present invention feature much higher ESD robustness. And the parasitic capacitance of the ESD protection is reduced because of the structure of the present invention.
Abstract:
The present invention relates to a low noise cascode amplifier comprising a first transistor, a second transistor, a third transistor, a first inductor, and a second inductor. Furthermore, the first transistor can connect with the second transistor via the first inductor, and the second transistor can connect with the third transistor via the second inductor; thereby, a cascode device can be formed. The inductor and the parasitic capacitances can resonate at high frequency, so that the noise figure of the cascode amplifier can be reduced.
Abstract:
The present invention relates to a low noise cascode amplifier comprising a first transistor, a second transistor, a third transistor, a first inductor, and a second inductor. Furthermore, the first transistor can connect with the second transistor via the first inductor, and the second transistor can connect with the third transistor via the second inductor; thereby, a cascode device can be formed. The inductor and the parasitic capacitances can resonate at high frequency, so that the noise figure of the cascode amplifier can be reduced.
Abstract:
An interposer element in a multidimensional integrated circuit with stacked elements has one or more conductors, especially power supply lines, coupled through decoupling networks defining low impedance shunts for high frequency signals to ground. The interposer has successive tiers including silicon, metal and dielectric deposition layers. The decoupling network for a conductor has at least one and preferably two reactive transmission lines. A transmission line has an inductor in series with the conductor and parallel capacitances at the inductor terminals. The inductors are formed by traces in spaced metal deposition layers forming coil windings and through vias connecting between layers to permit conductor crossovers. The capacitances are formed by MOScaps in the interposer layers. An embodiment has serially coupled coils with capacitances at the input, output and junction between the coils, wherein the coils are magnetically coupled to form a transformer.
Abstract:
The present invention relates to an electrostatic discharge (ESD) protection circuit, and more particularly to a low parasitic capacitance electrostatic discharge protection circuit. An ESD protection circuit is established with the structure in accordance with the present invention comprising a plurality of discharging paths. The ESD protection circuit is connected to the input/output pad of a radio frequency (RF) core circuit. Such that, the RF core circuit with the ESD protection circuit of the present invention feature much higher ESD robustness. And the parasitic capacitance of the ESD protection is reduced because of the structure of the present invention.
Abstract:
A V-band radio frequency (RF) electrostatic discharge (ESD) protection circuit uses meander inductors and diodes connecting in series to provide ESD protection. When operated in low frequency, the static electricity input from a RF pad may discharge to ground or to a voltage VDD through the meander inductor and the diode, so that a core circuit is not damaged by ESD. When operated in high frequency, the high frequency stray effect of the core circuit is substantially reduced due to impedance isolation generated by the meander inductors. Therefore, a low-noised amplifier (LNA) can receive an accurate high frequency input signal.
Abstract:
A V-band radio frequency (RF) electrostatic discharge (ESD) protection circuit uses meander inductors and diodes connecting in series to provide ESD protection. When operated in low frequency, the static electricity input from a RF pad may discharge to ground or to a voltage VDD through the meander inductor and the diode, so that a core circuit does not be damaged by ESD. When operated in high frequency, the high frequency stray effect of the core circuit is substantially reduced due to impedance isolation generated by the meander inductors. Therefore, a low-noised amplifier (LNA) can receive an accurate high frequency input signal.
Abstract:
The present invention relates to an electrostatic discharge (ESD) protection circuit, and more particularly to a band-pass structure electrostatic discharge protection circuit. An ESD protection circuit is disposed at the input of a radio frequency (RF) core circuit. The ESD protection circuit comprises a plurality of diodes and inductors constructing a plurality of discharging paths, wherein the diodes and inductors forms a band-pass filter structure. Such that, the RF core circuit with the ESD protection circuit of the present invention feature much higher ESD robustness and better RF performance than the conventional design.