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1.
公开(公告)号:US06773429B2
公开(公告)日:2004-08-10
申请号:US09975786
申请日:2001-10-11
IPC分类号: A61K922
CPC分类号: A61K9/0024 , A61K9/0009 , A61K9/0097 , A61M5/14276 , A61M2205/0244
摘要: Methods and devices are provided for enhancing corrosion of an electrode in a biocompatible fluid. The method comprises (1) placing a primary electrode and a counter electrode in an electroconductive biocompatible fluid to form an electrochemical cell; and (2) applying a time-varying potential, through the electrochemical cell, to the primary electrode. In a preferred embodiment, the primary electrode is metal and comprises a reservoir cap of a microchip device for the release of molecules or exposure of device reservoir contents. The potential preferably is characterized by a waveform having a maximum potential effectively anodic to meet or exceed the corrosion potential of the primary electrode. Also, the minimum potential preferably is effectively cathodic to be below the value where re-deposition of metal ions on the metal electrode can substantially occur, thereby corroding the metal electrode.
摘要翻译: 提供了用于增强生物相容性流体中的电极的腐蚀的方法和装置。 该方法包括(1)将主电极和对电极放置在导电生物相容性流体中以形成电化学电池; 和(2)通过电化学电池将时变电位施加到初级电极。 在优选实施例中,主电极是金属并且包括用于释放分子的微芯片装置的储存器盖或装置储存器内容物的暴露。 该电位优选的特征在于具有有效地阳极以满足或超过初级电极的腐蚀电位的最大电位的波形。 此外,最小电位优选有效地为阴极,低于金属电极上的金属离子的重新沉积基本上可以发生的值,从而腐蚀金属电极。
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2.
公开(公告)号:US06973718B2
公开(公告)日:2005-12-13
申请号:US10158811
申请日:2002-05-30
CPC分类号: A61K9/0009 , A61K9/0097 , Y10T29/49146 , Y10T29/49155
摘要: Methods are provided for conformally coating microchip devices and for sealing reservoirs containing molecules or devices in a microchip device. One method comprises (i) providing a substrate having a plurality of reservoirs having reservoir openings in need of sealing; (ii) loading reservoir contents comprising molecules, a secondary device, or both, into the reservoirs; and (iii) applying a conformal coating barrier layer, such as a vapor depositable polymeric material, e.g., parylene, onto the reservoir contents over at least the reservoir openings to seal the reservoir openings. Another method comprises vapor depositing a conformal coating material onto a microchip device having at least two reservoirs and reservoir caps positioned over molecules or devices stored in the reservoirs, and providing that the conformal coating does not coat or is removed from the reservoir caps.
摘要翻译: 提供了用于保密地涂覆微芯片器件并且用于密封在微芯片器件中含有分子或器件的储存器的方法。 一种方法包括(i)提供具有多个具有需要密封的储存器开口的储存器的基板; (ii)将包含分子,二次装置或两者的储存器容器装载到储存器中; 和(iii)将至少存储器开口上的保形涂层阻挡层(诸如可聚合聚合物材料,例如聚对二甲苯)施加到储存器内容物上以密封储存器开口。 另一种方法包括将保形涂层材料气相沉积到具有至少两个储存器和储存器盖的微芯片装置上,储存器盖位于储存在储存器中的分子或装置上,并且提供保形涂层不会从储存器盖上涂布或从储存器盖中移出。
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公开(公告)号:US07114312B2
公开(公告)日:2006-10-03
申请号:US10894265
申请日:2004-07-19
申请人: Jonathan R. Coppeta , Scott A. Uhland , Benjamin F. Polito , Norman F. Sheppard, Jr. , Christina M. Feakes , Douglas B. Snell , John T. Santini, Jr.
发明人: Jonathan R. Coppeta , Scott A. Uhland , Benjamin F. Polito , Norman F. Sheppard, Jr. , Christina M. Feakes , Douglas B. Snell , John T. Santini, Jr.
IPC分类号: B65B7/28
CPC分类号: B01L3/5085 , A61K9/0009 , A61K9/0097 , B01L3/5027 , B01L2400/0677 , B81B2201/058 , B81C1/00269 , B81C2203/0145 , H01L21/50
摘要: Methods are provided for hermetically sealing an opening in a reservoir of a containment device. The method comprises applying a polymeric material to an opening in a reservoir of a containment device, the reservoir comprising reservoir contents (such as a drug or a sensor) to be hermetically isolated within the reservoir, the applied polymeric material closing off the opening and forming a temporary seal; and adhering a hermetic sealing material onto the polymeric material to hermetically seal the opening. The reservoir can be a micro-reservoir. The containment device can comprises an array of two or more of reservoirs, and the method comprises hermetically sealing each of the two or more reservoirs.
摘要翻译: 提供了用于气密地密封容纳装置的储存器中的开口的方法。 该方法包括将聚合物材料施加到容纳装置的储存器中的开口中,所述储存器包括要在储存器内气密隔离的储存器内容物(例如药物或传感器),所施加的聚合物材料封闭开口并形成 临时印章 并将气密密封材料粘附到聚合物材料上以气密地密封开口。 储层可以是微储层。 容纳装置可以包括两个或更多个储存器的阵列,并且该方法包括气密地密封两个或更多储存器中的每一个。
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