Microchip reservoir devices and facilitated corrosion of electrodes
    1.
    发明授权
    Microchip reservoir devices and facilitated corrosion of electrodes 有权
    Microchip储存器件和电极易腐蚀

    公开(公告)号:US06773429B2

    公开(公告)日:2004-08-10

    申请号:US09975786

    申请日:2001-10-11

    IPC分类号: A61K922

    摘要: Methods and devices are provided for enhancing corrosion of an electrode in a biocompatible fluid. The method comprises (1) placing a primary electrode and a counter electrode in an electroconductive biocompatible fluid to form an electrochemical cell; and (2) applying a time-varying potential, through the electrochemical cell, to the primary electrode. In a preferred embodiment, the primary electrode is metal and comprises a reservoir cap of a microchip device for the release of molecules or exposure of device reservoir contents. The potential preferably is characterized by a waveform having a maximum potential effectively anodic to meet or exceed the corrosion potential of the primary electrode. Also, the minimum potential preferably is effectively cathodic to be below the value where re-deposition of metal ions on the metal electrode can substantially occur, thereby corroding the metal electrode.

    摘要翻译: 提供了用于增强生物相容性流体中的电极的腐蚀的方法和装置。 该方法包括(1)将主电极和对电极放置在导电生物相容性流体中以形成电化学电池; 和(2)通过电化学电池将时变电位施加到初级电极。 在优选实施例中,主电极是金属并且包括用于释放分子的微芯片装置的储存器盖或装置储存器内容物的暴露。 该电位优选的特征在于具有有效地阳极以满足或超过初级电极的腐蚀电位的最大电位的波形。 此外,最小电位优选有效地为阴极,低于金属电极上的金属离子的重新沉积基本上可以发生的值,从而腐蚀金属电极。

    Methods for conformal coating and sealing microchip reservoir devices
    2.
    发明授权
    Methods for conformal coating and sealing microchip reservoir devices 失效
    用于保形涂层和密封微芯片储存器件的方法

    公开(公告)号:US06973718B2

    公开(公告)日:2005-12-13

    申请号:US10158811

    申请日:2002-05-30

    IPC分类号: A61K9/00 H05K3/02 H05K3/10

    摘要: Methods are provided for conformally coating microchip devices and for sealing reservoirs containing molecules or devices in a microchip device. One method comprises (i) providing a substrate having a plurality of reservoirs having reservoir openings in need of sealing; (ii) loading reservoir contents comprising molecules, a secondary device, or both, into the reservoirs; and (iii) applying a conformal coating barrier layer, such as a vapor depositable polymeric material, e.g., parylene, onto the reservoir contents over at least the reservoir openings to seal the reservoir openings. Another method comprises vapor depositing a conformal coating material onto a microchip device having at least two reservoirs and reservoir caps positioned over molecules or devices stored in the reservoirs, and providing that the conformal coating does not coat or is removed from the reservoir caps.

    摘要翻译: 提供了用于保密地涂覆微芯片器件并且用于密封在微芯片器件中含有分子或器件的储存器的方法。 一种方法包括(i)提供具有多个具有需要密封的储存器开口的储存器的基板; (ii)将包含分子,二次装置或两者的储存器容器装载到储存器中; 和(iii)将至少存储器开口上的保形涂层阻挡层(诸如可聚合聚合物材料,例如聚对二甲苯)施加到储存器内容物上以密封储存器开口。 另一种方法包括将保形涂层材料气相沉积到具有至少两个储存器和储存器盖的微芯片装置上,储存器盖位于储存在储存器中的分子或装置上,并且提供保形涂层不会从储存器盖上涂布或从储存器盖中移出。