公开(公告)号：US06740959B2

公开(公告)日：2004-05-25

申请号：US09921062

申请日：2001-08-01

Applicant: David James Alcoe ,  Jeffrey Thomas Coffin ,  Michael Anthony Gaynes ,  Harvey Charles Hamel ,  Mario J. Interrante ,  Brenda Lee Peterson ,  Megan J. Shannon ,  William Edward Sablinski ,  Christopher Todd Spring ,  Randall Joseph Stutzman ,  Renee L. Weisman ,  Jeffrey Allen Zitz

Inventor： David James Alcoe ,  Jeffrey Thomas Coffin ,  Michael Anthony Gaynes ,  Harvey Charles Hamel ,  Mario J. Interrante ,  Brenda Lee Peterson ,  Megan J. Shannon ,  William Edward Sablinski ,  Christopher Todd Spring ,  Randall Joseph Stutzman ,  Renee L. Weisman ,  Jeffrey Allen Zitz

IPC: H01L23552

CPC classification number: H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

Abstract translation: 包括EMI屏蔽的电子封装，特别是包含嵌入其中具有接地带的半导体芯片 - 载体结构的半导体器件，其适于减少高速开关电子封装的输出和入射EMI发射。