Low-stress compressive heatsink structure
    1.
    发明授权
    Low-stress compressive heatsink structure 有权
    低应力压缩散热器结构

    公开(公告)号:US06654250B1

    公开(公告)日:2003-11-25

    申请号:US10254886

    申请日:2002-09-25

    CPC classification number: H05K1/189 H05K2201/10734 H05K2201/2009

    Abstract: A structure and technique for forming an I/C chip module and circuit card construction is provided. An I/C chip module having a flexible substrate, with first and second opposite sides concave, results from the CTE mismatch between the I/C chip and substrate. The I/C chip module is mounted on a flexible circuit card by solderball connection. The curvature of the I/C chip module causes the circuit card to curve correspondingly. A heatsink in thermal contact with the I/C chip places pressure on the I/C chip module in a direction to decrease the curvature. A rigid backing member retains the circuit card, generating a curved space between the backing member and the circuit card. A leaf spring applies pressure to the I/C chip module against the backing member. A compliant member is interposed between the backing member and the circuit board filling a portion of the curved space therebetween.

    Abstract translation: 提供了用于形成I / C芯片模块和电路卡结构的结构和技术。 具有柔性衬底的I / C芯片模块,其具有第一和第二相对侧凹陷,由I / C芯片和衬底之间的CTE不匹配产生。 I / C芯片模块通过焊球连接安装在柔性电路卡上。 I / C芯片模块的曲率使电路卡相应地曲线。 与I / C芯片热接触的散热片沿着减小曲率的方向对I / C芯片模块施加压力。 刚性背衬构件保持电路卡,在背衬构件和电路卡之间产生弯曲的空间。 板簧对I / C芯片模块施加压力抵靠背衬构件。 柔性构件插入在衬垫构件和电路板之间,填充其间的弯曲空间的一部分。

    Electronic component test apparatus with rotational probe and conductive
spaced apart means
    2.
    发明授权
    Electronic component test apparatus with rotational probe and conductive spaced apart means 失效
    具有旋转探针和导电间隔装置的电子部件测试装置

    公开(公告)号:US6051982A

    公开(公告)日:2000-04-18

    申请号:US826962

    申请日:1997-04-09

    CPC classification number: G01R1/07314 G01R1/06733 G01R1/07392

    Abstract: A test apparatus including at least one probe member precisely aligned using two spaced apart means (e.g., thin layers) such that the probe can effectively engage a conductor (e.g., solder ball) on an electronic module (e.g., ball grid array package). A compressible member (e.g., elastomeric body) is used to bias the probe toward the conductor. Various probe cross-sectional configurations are also provided. As taught herein, the probe electrically contacts one of the spaced apart means, also conductive, to thus form a circuit which can extend externally of the apparatus (e.g., for connecting to appropriate testing equipment).

    Abstract translation: 一种测试装置,其包括使用两个间隔开的装置(例如薄层)精确对准的至少一个探针构件,使得探针可以有效地接合电子模块(例如,球栅阵列封装)上的导体(例如,焊球)。 使用可压缩构件(例如,弹性体)将探针偏压到导体。 还提供了各种探针横截面构造。 如本文所教导的,探针电接触一个间隔开的装置,也是导电的,从而形成可延伸到设备外部(例如,用于连接到适当的测试设备)的电路。

    Elastomeric structure with multi-layered elastomer and constraining base
    3.
    发明授权
    Elastomeric structure with multi-layered elastomer and constraining base 失效
    具有多层弹性体和约束基体的弹性体结构

    公开(公告)号:US5947750A

    公开(公告)日:1999-09-07

    申请号:US848949

    申请日:1997-04-30

    CPC classification number: H01R12/62 H05K3/365

    Abstract: An elastomeric structure including two layers, the first having patterned openings therein and adjacent web members, the second including a patterned array of upstanding projections. The openings and projections may be of cylindrical, rectangular, or other configurations and are oriented in highly dense patterns. The elastomeric is positioned with and attached to a base member having a sidewall substantially as high as the corresponding external side surface of the elastomeric's first layer. The sidewall constrains the elastomeric during compression. The invention thereby substantially prevents lateral expansion of the elastomeric's side surface and lateral deflection of both layers, resulting in a uniform distribution of compressive forces on the upstanding projections.

    Abstract translation: 包括两层的弹性体结构,其中第一层具有图案化的开口和相邻的腹板构件,第二层包括直立突起的图案化阵列。 开口和突起可以是圆柱形,矩形或其它构造,并且以高致密图案取向。 弹性体被定位并且附接到具有基本上与弹性体的第一层的对应外侧表面一样高的侧壁的基底构件。 侧壁在压缩过程中约束弹性体。 因此,本发明基本上防止了弹性体的侧面的横向膨胀和两层的横向偏转,从而导致对直立突起的压缩力的均匀分布。

    Electronic component test apparatus with rotational probe
    4.
    发明授权
    Electronic component test apparatus with rotational probe 失效
    带旋转探头的电子部件测试装置

    公开(公告)号:US5804984A

    公开(公告)日:1998-09-08

    申请号:US691732

    申请日:1996-08-02

    CPC classification number: G01R1/06733 G01R1/07314 G01R1/07392

    Abstract: A test apparatus including at least one probe member precisely aligned using two spaced apart means (e.g., thin dielectric layers having copper thereon) such that the probe can effectively engage a conductor (e.g., solder ball) on an electronic module (e.g., ball grid array package). A compressible member (e.g., elastomeric body) is used to bias the probe toward the conductor. Various probe cross-sectional configurations are also provided.

    Abstract translation: 一种测试装置,其包括使用两个间隔开的装置(例如,其上具有铜的薄介电层)精确对准的至少一个探针构件,使得探针可以有效地接合电子模块(例如,球栅)上的导体(例如,焊球) 阵列包)。 使用可压缩构件(例如,弹性体)将探针偏压到导体。 还提供了各种探针横截面构造。

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