公开(公告)号：US6070782A

公开(公告)日：2000-06-06

申请号：US113044

申请日：1998-07-09

申请人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

发明人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

IPC分类号： H01L23/498 ,  H05K3/34 ,  B23K101/38 ,  H01L23/48 ,  H05K1/00

CPC分类号： H01L23/49816 ,  H05K3/3478 ,  H01L2924/0002 ,  H05K2201/10234 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3436

摘要： An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of openings corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

摘要翻译： 具有包括成形焊料涂覆的金属球体的可插座凸块网格阵列的电子部件通过一种方法提供，该方法包括将焊接涂覆的金属球定位在具有对应于阵列的多个开口的对准装置中，所述开口优选地呈锥形 锥体的底部位于对准装置的上表面并且具有大于焊料涂覆的金属球的直径的直径。 开口构造成使得定位在开口中的球体部分地在对准装置的上表面上方延伸。 然后将衬底的焊盘与定位的球体接触，并且当焊料回流时，焊料在与焊料涂覆的金属球接触的衬底上的导电层之间形成结合，并且采取对准装置的形状和 其在金属球体的整个表面上保持焊料涂层。 还提供了一种用于制造这种可插座凸块网格阵列的装置。

公开(公告)号：US5868304A

公开(公告)日：1999-02-09

申请号：US674559

申请日：1996-07-02

申请人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

发明人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

IPC分类号： H01L23/12 ,  B23K3/06 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34 ,  B23K31/02

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H01L23/49816 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/11334 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/0557 ,  H05K3/3478 ,  Y02P70/613

摘要： An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of opening corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

摘要翻译： 具有包括成型焊料涂覆的金属球体的可插座凸块网格阵列的电子部件通过一种方法提供，该方法包括将焊接涂覆的金属球定位在具有对应于阵列的多个开口的对准装置中，所述开口优选地呈锥形 锥体的底部位于对准装置的上表面并且具有大于焊料涂覆的金属球的直径的直径。 开口构造成使得定位在开口中的球体部分地在对准装置的上表面上方延伸。 然后将衬底的焊盘与定位的球体接触，并且当焊料回流时，焊料在与焊料涂覆的金属球接触的衬底上的导电层之间形成结合，并且采取对准装置的形状和 其在金属球体的整个表面上保持焊料涂层。 还提供了一种用于制造这种可插座凸块网格阵列的装置。

公开(公告)号：US06740959B2

公开(公告)日：2004-05-25

申请号：US09921062

申请日：2001-08-01

申请人： David James Alcoe ,  Jeffrey Thomas Coffin ,  Michael Anthony Gaynes ,  Harvey Charles Hamel ,  Mario J. Interrante ,  Brenda Lee Peterson ,  Megan J. Shannon ,  William Edward Sablinski ,  Christopher Todd Spring ,  Randall Joseph Stutzman ,  Renee L. Weisman ,  Jeffrey Allen Zitz

发明人： David James Alcoe ,  Jeffrey Thomas Coffin ,  Michael Anthony Gaynes ,  Harvey Charles Hamel ,  Mario J. Interrante ,  Brenda Lee Peterson ,  Megan J. Shannon ,  William Edward Sablinski ,  Christopher Todd Spring ,  Randall Joseph Stutzman ,  Renee L. Weisman ,  Jeffrey Allen Zitz

IPC分类号： H01L23552

CPC分类号： H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

摘要： Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

摘要翻译： 包括EMI屏蔽的电子封装，特别是包含嵌入其中具有接地带的半导体芯片 - 载体结构的半导体器件，其适于减少高速开关电子封装的输出和入射EMI发射。