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1.发明授权公开(公告)号：US08017449B2
公开(公告)日：2011-09-13
申请号：US10565916
申请日：2004-07-29
IPC分类号： H01L21/56
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/06136 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01054 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。
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2.发明申请公开(公告)号：US20110221060A1
公开(公告)日：2011-09-15
申请号：US13116063
申请日：2011-05-26
IPC分类号： H01L23/498 , H01L21/50 , H01L21/56
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/06136 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01054 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。
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3.发明授权公开(公告)号：US08609472B2
公开(公告)日：2013-12-17
申请号：US13116063
申请日：2011-05-26
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/06136 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01054 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。
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4.发明申请公开(公告)号：US20080090332A1
公开(公告)日：2008-04-17
申请号：US10565916
申请日：2004-07-29
IPC分类号： H01L21/56
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/06136 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01054 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.
摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。
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