摘要:
An inspection system can support operation in multiple states. For instance, when inspecting an article, such as a semiconductor wafer, the tool can switch between imaging multiple locations using respective detectors to another operating state wherein multiple detectors operating in multiple imaging modes inspect a single location. An inspection system may combine the use of multiple detectors for multiple locations and the use of multiple viewing angles or modes for the same locations and thereby achieve high throughput. The different imaging modes can comprise, for example, different collection angles, polarizations, different spectral bands, different attenuations, different focal positions relative to the wafer, and other different types of imaging.
摘要:
A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.
摘要:
An inspection system can support operation in multiple states. For instance, when inspecting an article, such as a semiconductor wafer, the tool can switch between imaging multiple locations using respective detectors to another operating state wherein multiple detectors operating in multiple imaging modes inspect a single location. An inspection system may combine the use of multiple detectors for multiple locations and the use of multiple viewing angles or modes for the same locations and thereby achieve high throughput. The different imaging modes can comprise, for example, different collection angles, polarizations, different spectral bands, different attenuations, different focal positions relative to the wafer, and other different types of imaging.
摘要:
A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.
摘要:
A method and system for defect localization including (i) receiving a test structure that includes at least one conductor that is at least partially covered by an electro-optically active material; (ii) providing an electrical signal to the conductor, so as to charge at least a portion of the conductor; and (iii) imaging the test structure to locate a defect.
摘要:
The invention provides a method and printer for printing an image that comprises at least one group of highly dense shapes, the method includes: (i) determining multiple intermediate schemes such as to allow printing corresponding intermediate images on an object; whereas at least one intermediate scheme comprises directing at least one interference pattern toward at least one location corresponding to at least one group of highly dense shapes; (ii) generating an array of light entities in response to an intermediate scheme; (iii) directing the array of light entities towards the object to form the intermediate image; and (iv) moving the object relative to the light entities while repeating the steps of generating and directing to expose the object with the image. The invention provides a system that includes: (i) means for determining multiple intermediate schemes such as to allow printing corresponding intermediate images on an object; whereas at least one intermediate scheme comprises directing at least one interference pattern towards at least one location corresponding to at least one group of highly dense shapes; (ii) a programmable optical radiation source for generating an array of light entities in response to an intermediate scheme; (iii) optics for directing the array of light entities towards the object to form the intermediate image; and (iv) a translator for moving the object relative to the light entities while repeating the steps of generating and directing to expose the object with the image.
摘要:
A method and an apparatus for an optical inspection of an object, having upper and lower faces, so as to detect defects existing on the object. First and second beams of an incident radiation are produced and directed onto the object. A light component of the first incident beam, which is reflected from one face of the object, and a light component of the second incident beam, which is transmitted through the upper and lower faces of the object, are simultaneously sensed. First and second images, formed, respectively by reflected and transmitted light components are acquired and analyzed so as to provide data indicative of the defects.
摘要:
An automated optical inspection system includes a pulsed light source illuminating an article to be inspected thereby to generate at least one image thereof, at least one camera having a field of view, and a relative motion provider operative to provide relative motion between the camera and at least one image of at least a portion of the article. The relative motion provider may include a first continuous motion provider and a second, velocity-during-imaging-lessening motion provider. The relative motion is a superposition of a first continuous component of motion provided by the first motion provider and a second, smaller component of motion provided by the second motion provider which lessens the velocity of the at least one image relative to the camera, during imaging.
摘要:
Apparatus and techniques for automated optical inspection (AOI) utilizing image scanning modules with multiple objectives for each camera are provided. A scanning mechanism includes optical components to sequentially steer optical signals from each of the multiple objectives to the corresponding camera.
摘要:
A method and system for defect localization includes: (i) receiving a test structure that includes at least one conductor that is at least partially covered by an electro-optically active material; (ii) providing an electrical signal to the conductor, so as to charge at least a portion of the conductor; and (iii) imaging the test structure to locate a defect.