公开(公告)号：US20090136748A1

公开(公告)日：2009-05-28

申请号：US12292874

申请日：2008-11-28

申请人： Han Nim Choi ,  Ki Tae Song ,  Chi Seok Hwang ,  Hea Kyung Kim ,  Chang Beom Chung

发明人： Han Nim Choi ,  Ki Tae Song ,  Chi Seok Hwang ,  Hea Kyung Kim ,  Chang Beom Chung

IPC分类号： B32B33/00

CPC分类号： H01L24/27 ,  C08L2666/14 ,  C09J7/20 ,  C09J133/062 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/181 ,  Y10T428/2848 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.

摘要翻译： 粘合膜组合物包括聚合物粘合剂; 可固化树脂; 和约40至约60wt。 ％的溶剂，其中溶剂是基本上由至少第一溶剂组成的二元溶剂，沸点为约40℃至约100℃，和至少第二溶剂的沸点为约140℃ 至约200℃

公开(公告)号：US20120029117A1

公开(公告)日：2012-02-02

申请号：US13267225

申请日：2011-10-06

申请人： Han Nim CHOI ,  Ki Tae Song ,  Chi Seok Hwang ,  Hea Kyung Kim ,  Chang Beom Chung

发明人： Han Nim CHOI ,  Ki Tae Song ,  Chi Seok Hwang ,  Hea Kyung Kim ,  Chang Beom Chung

IPC分类号： C09J163/02 ,  C09J133/14 ,  C09J161/10

CPC分类号： H01L24/27 ,  C08L2666/14 ,  C09J7/20 ,  C09J133/062 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/181 ,  Y10T428/2848 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.

摘要翻译： 粘合膜组合物包括聚合物粘合剂; 可固化树脂; 和约40至约60wt。 ％的溶剂，其中溶剂是基本上由至少第一溶剂组成的二元溶剂，沸点为约40℃至约100℃，和至少第二溶剂的沸点为约140℃ 至约200℃