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    Flameproof thermoplastic resin composition
    3.
    发明授权
    Flameproof thermoplastic resin composition 有权
    防火热塑性树脂组合物

    公开(公告)号：US08008382B2

    公开(公告)日：2011-08-30

    申请号：US12644516

    申请日：2009-12-22

    Applicant: Jin Seong Lee ,  Bok Nam Jang ,  In Chul Jung ,  Yun Ku Nam ,  Mi Ran Cho

    Inventor： Jin Seong Lee ,  Bok Nam Jang ,  In Chul Jung ,  Yun Ku Nam ,  Mi Ran Cho

    IPC: C08K5/521

    CPC classification number: C08L69/00 ,  C08K5/523 ,  C08L21/00 ,  C08L67/02 ,  C08L2666/02

    Abstract: The thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a base resin comprising (A) about 5 to about 40% by weight of a rubber modified aromatic vinyl based copolymer resin, (B) about 30 to about 90% by weight of a polycarbonate resin, and (C) about 1 to about 50% by weight of a noncrystalline polyester resin; and (D) about 5 to about 30 parts by weight of an aromatic phosphate ester based compound.

    Abstract translation: 本发明的热塑性树脂组合物包括：约100重量份的基础树脂，其包含（A）约5至约40重量％的橡胶改性的芳族乙烯基类共聚物树脂，（B）约30至约90重量％ 重量的聚碳酸酯树脂，和（C）约1-约50％重​​量的非结晶性聚酯树脂; 和（D）约5至约30重量份的芳族磷酸酯基化合物。

    Semiconductor memory devices
    5.
    发明授权
    Semiconductor memory devices 有权
    半导体存储器件

    公开(公告)号：US08809930B2

    公开(公告)日：2014-08-19

    申请号：US13742940

    申请日：2013-01-16

    Applicant: Namho Jeon ,  Jun-Su Kim ,  Satoru Yamada ,  Jaehoon Lee ,  Seunguk Han ,  Jiyoung Kim ,  Jin-Seong Lee

    Inventor： Namho Jeon ,  Jun-Su Kim ,  Satoru Yamada ,  Jaehoon Lee ,  Seunguk Han ,  Jiyoung Kim ,  Jin-Seong Lee

    IPC: H01L29/76

    CPC classification number: H01L29/7831 ,  G11C11/403 ,  G11C11/40615 ,  G11C11/4097 ,  G11C2207/2227 ,  H01L27/105 ,  H01L27/115

    Abstract: Semiconductor memory devices may include a write transistor including a first write gate controlling a first source/drain terminal and a second write gate controlling a channel region, and a read transistor including a memory node gate connected to the first source/drain terminal of the write transistor. The first write gate may have a first work function and the second write gate may have a second work function different from the first work function. The first source/drain terminal of the write transistor may not have a PN junction.

    Abstract translation: 半导体存储器件可以包括写入晶体管，其包括控制第一源极/漏极端子的第一写入栅极和控制沟道区域的第二写入栅极，以及读取晶体管，其包括连接到写入的第一源极/漏极端子的存储器节点栅极 晶体管。 第一写入门可以具有第一工作功能，并且第二写入门可以具有与第一工作功能不同的第二工作功能。 写晶体管的第一源极/漏极端子可以不具有PN结。

    SEMICONDUCTOR MEMORY DEVICES
    6.
    发明申请
    SEMICONDUCTOR MEMORY DEVICES 有权
    半导体存储器件

    公开(公告)号：US20130256774A1

    公开(公告)日：2013-10-03

    申请号：US13742940

    申请日：2013-01-16

    Applicant: Namho JEON ,  Jun-Su KIM ,  Satoru YAMADA ,  Jaehoon LEE ,  Seunguk HAN ,  Jiyoung KIM ,  Jin-Seong LEE

    Inventor： Namho JEON ,  Jun-Su KIM ,  Satoru YAMADA ,  Jaehoon LEE ,  Seunguk HAN ,  Jiyoung KIM ,  Jin-Seong LEE

    IPC: H01L29/78

    CPC classification number: H01L29/7831 ,  G11C11/403 ,  G11C11/40615 ,  G11C11/4097 ,  G11C2207/2227 ,  H01L27/105 ,  H01L27/115

    Abstract: Semiconductor memory devices may include a write transistor including a first write gate controlling a first source/drain terminal and a second write gate controlling a channel region, and a read transistor including a memory node gate connected to the first source/drain terminal of the write transistor. The first write gate may have a first work function and the second write gate may have a second work function different from the first work function. The first source/drain terminal of the write transistor may not have a PN junction.

    Abstract translation: 半导体存储器件可以包括写入晶体管，其包括控制第一源极/漏极端子的第一写入栅极和控制沟道区域的第二写入栅极，以及读取晶体管，其包括连接到写入的第一源极/漏极端子的存储器节点栅极 晶体管。 第一写入门可以具有第一工作功能，并且第二写入门可以具有与第一工作功能不同的第二工作功能。 写晶体管的第一源极/漏极端子可以不具有PN结。

    Flame-Retardant Polyester Resin Composition Having Excellent Heat Resistance
    8.
    发明申请
    Flame-Retardant Polyester Resin Composition Having Excellent Heat Resistance 审中-公开
    具有优异耐热性的阻燃聚酯树脂组合物

    公开(公告)号：US20100240814A1

    公开(公告)日：2010-09-23

    申请号：US12792235

    申请日：2010-06-02

    Applicant: Seong Ho KONG ,  Kyung Hoon SHIN ,  Jin Seong LEE

    Inventor： Seong Ho KONG ,  Kyung Hoon SHIN ,  Jin Seong LEE

    IPC: C08K5/5313 ,  C08K3/04 ,  C08K3/40 ,  C08K3/00

    CPC classification number: C08L67/02 ,  C08K3/013 ,  C08K5/5313 ,  C08L23/0876 ,  C08L25/18 ,  C08L2666/06 ,  C08L2666/04

    Abstract: Disclosed herein is a flame retardant polyester resin composition that can have excellent heat resistance comprising (A) about 100 parts by weight of a polyester resin; (B) about 1 to about 50 parts by weight of a metal salt of an organic phosphinic acid; (C) about 0.01 to about 20 parts by weight of an ionomer resin; and (D) about 1 to about 100 parts by weight of a filler. The resin composition of the present invention composition can have excellent heat resistance while maintaining mechanical properties, and also does not produce toxic halide gases.

    Abstract translation: 本发明公开了一种阻燃聚酯树脂组合物，其具有优异的耐热性，其包含（A）约100重量份的聚酯树脂; （B）约1至约50重量份的有机次膦酸金属盐; （C）约0.01至约20重量份的离聚物树脂; 和（D）约1至约100重量份的填料。 本发明组合物的树脂组合物可以在保持机械性能的同时具有优异的耐热性，并且也不产生有毒的卤化物气体。

    Flameproof Thermoplastic Resin Composition
    9.
    发明申请
    Flameproof Thermoplastic Resin Composition 有权
    防火热塑性树脂组合物

    公开(公告)号：US20100168296A1

    公开(公告)日：2010-07-01

    申请号：US12644516

    申请日：2009-12-22

    Applicant: Jin Seong LEE ,  Bok Nam JANG ,  In Chul JUNG ,  Yun Ku NAM ,  Mi Ran CHO

    Inventor： Jin Seong LEE ,  Bok Nam JANG ,  In Chul JUNG ,  Yun Ku NAM ,  Mi Ran CHO

    IPC: C08K5/521

    CPC classification number: C08L69/00 ,  C08K5/523 ,  C08L21/00 ,  C08L67/02 ,  C08L2666/02

    Abstract: The thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a base resin comprising (A) about 5 to about 40% by weight of a rubber modified aromatic vinyl based copolymer resin, (B) about 30 to about 90% by weight of a polycarbonate resin, and (C) about 1 to about 50% by weight of a noncrystalline polyester resin; and (D) about 5 to about 30 parts by weight of an aromatic phosphate ester based compound.

    Abstract translation: 本发明的热塑性树脂组合物包括：约100重量份的基础树脂，其包含（A）约5至约40重量％的橡胶改性的芳族乙烯基类共聚物树脂，（B）约30至约90重量％ 重量的聚碳酸酯树脂，和（C）约1-约50％重​​量的非结晶性聚酯树脂; 和（D）约5至约30重量份的芳族磷酸酯基化合物。

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