摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a projection formed along a perimeter of a first surface of the substrate; mounting an integrated circuit over the first surface; forming a protruding interconnect over the first surface between the projection and the integrated circuit; and forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection.
摘要:
The present invention provides a phosphoric and acrylic copolymer resin that can have good transparency, scratch resistance and flame retardancy and a composition including the same. The phosphoric and acrylic copolymer resin includes repeat units of (A-1) at least one vinyl monomer and (A-2) at least one phosphoric monomer.
摘要:
A semiconductor device has a semiconductor die with a plurality of bumps formed over an active surface of the semiconductor die. A plurality of first conductive traces with interconnect sites is formed over a substrate. The bumps are wider than the interconnect sites. A surface treatment is formed over the first conductive traces. A plurality of second conductive traces is formed adjacent to the first conductive traces. An oxide layer is formed over the second conductive traces. A masking layer is formed over an area of the substrate away from the interconnect sites. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surface of the interconnect sites. The oxide layer maintains electrical isolation between the bump and second conductive trace. An encapsulant is deposited around the bumps between the semiconductor die and substrate.
摘要:
A photosensitive resin composition for a color filter includes (A) an acrylic-based binder resin including a structural unit represented by the following Chemical Formula 1, wherein the definitions of R1, R2, R3 and R4 are the same as set forth in specification; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent.
摘要:
Disclosed herein is a thermoplastic (meth)acrylate copolymer, which includes a derivative unit obtained from a monomer mixture including: (A) an aromatic (meth)acrylate having an index of refraction from about 1.580 to about 1.700; and (B) a monofunctional unsaturated monomer.
摘要:
A semiconductor device has a semiconductor die with a plurality of bumps formed over an active surface of the semiconductor die. A plurality of first conductive traces with interconnect sites is formed over a substrate. The bumps are wider than the interconnect sites. A surface treatment is formed over the first conductive traces. A plurality of second conductive traces is formed adjacent to the first conductive traces. An oxide layer is formed over the second conductive traces. A masking layer is formed over an area of the substrate away from the interconnect sites. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surface of the interconnect sites. The oxide layer maintains electrical isolation between the bump and second conductive trace. An encapsulant is deposited around the bumps between the semiconductor die and substrate.
摘要:
Disclosed is a photosensitive resin composition for a color filter that includes (A) an acrylic-based binder resin including a structural unit represented by the following Chemical Formula 1; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent. In the above Chemical Formula, each definition of R1, R2, R3 and R4 is the same as defined in the detailed description.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a projection formed along a perimeter of a first surface of the substrate; mounting an integrated circuit over the first surface; forming a protruding interconnect over the first surface between the projection and the integrated circuit; and forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection.
摘要:
A stackable integrated circuit package system including mounting an integrated circuit device over a package carrier, mounting a stiffener over the package carrier and mounting a mountable package carrier over the stiffener with a vertical gap between the integrated circuit device and the mountable package carrier.
摘要:
The present invention is a package-in-package system, comprising: providing a bottom internal stacking module incorporating a semiconductor die and a package substrate, attaching an internal stiffening module with a die receptacle on the bottom internal stacking module, and attaching a top internal stacking module incorporating a semiconductor die and a package substrate upside-down on the internal stiffening module.