公开(公告)号：US08962712B2

公开(公告)日：2015-02-24

申请号：US13517648

申请日：2012-06-14

申请人： Nobuhito Ito ,  Kazuyoshi Yoneda ,  Masao Arima

发明人： Nobuhito Ito ,  Kazuyoshi Yoneda ,  Masao Arima

IPC分类号： C08K3/22 ,  C08K5/5313 ,  C08K5/5399 ,  G03F7/038 ,  H05K1/18 ,  H05K3/28 ,  C08G18/34 ,  C08G18/64 ,  C08G18/73 ,  C08G18/80 ,  C09D175/04 ,  G03F7/027 ,  G03F7/031 ,  G03F7/035 ,  C08L63/04

CPC分类号： H05K3/287 ,  C08G18/348 ,  C08G18/6407 ,  C08G18/73 ,  C08G18/80 ,  C09D175/04 ,  G03F7/027 ,  G03F7/031 ,  G03F7/035 ,  H05K2201/012

摘要： An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating.

摘要翻译： 碱显影性感光性树脂组合物包含具有联苯酚醛清漆结构的含羧基的聚氨酯树脂，光聚合引发剂和氢氧化铝和/或含磷化合物。 组合物可以配制成光固化性和热固性树脂组合物，除了上述组分之外，通过进一步掺入其中具有分子中具有多个环醚基和/或环硫醚基的热固性组分。 感光性树脂组合物还可以含有着色剂。 通过使用感光性树脂组合物或其干膜，可以提供由无卤素组合物形成的具有阻燃固化膜（例如阻焊剂）的印刷线路板，同时对环境施加很小的负担，固化 膜具有阻燃性并且翘曲变小并且具有各种优异的性能，包括弯曲特性，耐焊接热性和耐镀金性。

公开(公告)号：US20120250268A1

公开(公告)日：2012-10-04

申请号：US13517648

申请日：2012-06-14

申请人： Nobuhito ITO ,  Kazuyoshi YONEDA ,  Masao ARIMA

发明人： Nobuhito ITO ,  Kazuyoshi YONEDA ,  Masao ARIMA

IPC分类号： G03F7/004 ,  H05K1/03

CPC分类号： H05K3/287 ,  C08G18/348 ,  C08G18/6407 ,  C08G18/73 ,  C08G18/80 ,  C09D175/04 ,  G03F7/027 ,  G03F7/031 ,  G03F7/035 ,  H05K2201/012

摘要： An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating.

摘要翻译： 碱显影性感光性树脂组合物包含具有联苯酚醛清漆结构的含羧基的聚氨酯树脂，光聚合引发剂和氢氧化铝和/或含磷化合物。 组合物可以配制成光固化性和热固性树脂组合物，除了上述组分之外，通过进一步掺入其中具有分子中具有多个环醚基和/或环硫醚基的热固性组分。 感光性树脂组合物还可以含有着色剂。 通过使用感光性树脂组合物或其干膜，可以提供由无卤素组合物形成的具有阻燃固化膜（例如阻焊剂）的印刷线路板，同时对环境施加很小的负担，固化 膜具有阻燃性并且翘曲变小并且具有各种优异的性能，包括弯曲特性，耐焊接热性和耐镀金性。