公开(公告)号：US06815828B1

公开(公告)日：2004-11-09

申请号：US09618708

申请日：2000-07-18

Applicant: Ramon Coronel ,  Karen A. Fucik ,  Peter S. Yoon ,  Donald G. Heflinger

Inventor： Ramon Coronel ,  Karen A. Fucik ,  Peter S. Yoon ,  Donald G. Heflinger

IPC: H01L2348

CPC classification number: H01L25/0657 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit device includes a thin semiconductor layer disposed on a surface of a wafer, a plurality of wafer-scale integrated (WSI) circuits formed on the semiconductor layer, and a node formed on the semiconductor layer that provides an optoelectronic interface to an axial optical data bus for high-speed optical interconnectivity between the WSI circuits and other external devices interconnected to the optical data bus.

Abstract translation: 集成电路器件包括设置在晶片表面上的薄半导体层，形成在半导体层上的多个晶片级集成（WSI）电路以及形成在半导体层上的节点，该节点提供与轴向的光电接口 光学数据总线，用于WSI电路和与光数据总线互连的其他外部设备之间的高速光互连。

公开(公告)号：US5961076A

公开(公告)日：1999-10-05

申请号：US771464

申请日：1996-12-20

Applicant: Howard S. Eller ,  Ramon Coronel

Inventor： Howard S. Eller ,  Ramon Coronel

IPC: B64G1/00 ,  B64G1/10 ,  B64G1/42 ,  B64G1/64

CPC classification number: B64G1/10 ,  B64G1/641 ,  B64G1/428 ,  B64G2001/1092

Abstract: A process for designing and producing spacecraft more efficiently, without the excessive time, complexity and expense usually associated with spacecraft design. The process moves the design complexity usually associated with spacecraft design to payload modules whose designs are potentially reusable in other spacecraft missions. Each module is designed to be largely independent of a parent spacecraft structure, the design of which can be simplified to accommodate multiple modules that connect to the parent structure through a standardized backbone interface. Each module is designed for independent structural integrity, and to provide its own thermal management. Modules may also provide their own power regulation and, optionally, their own power storage and generation capabilities. Modules may also provide their own attitude control systems. Attachment of modules to the parent structure is simplified because of the modules' independence. The backbone interface may, for example, simply provide a data bus connection, an unregulated power connection, and possibly a radio-frequency (RF) connection. This simplicity of attachment of the modules results in an extremely simple system-level design and a correspondingly simple integration and test procedure, thereby simplifying the entire design and development process.

Abstract translation: 更有效地设计和制造航天器的过程，而不需要与航天器设计相关的过多时间，复杂性和费用。 该过程将通常与航天器设计相关联的设计复杂度移动到其他设计在其他航天器任务中可重复使用的有效载荷模块。 每个模块的设计大体上独立于父级航天器结构，其设计可以简化为容纳通过标准化主干接口连接到母体结构的多个模块。 每个模块都设计用于独立的结构完整性，并提供自己的热管理。 模块还可以提供它们自己的功率调节和可选地自己的功率存储和发电能力。 模块还可以提供自己的姿态控制系统。 由于模块的独立性，将模块附加到母体结构是简化的。 主干接口可以例如简单地提供数据总线连接，不受调节的电力连接以及可能的射频（RF）连接。 模块的这种简单的连接导致了非常简单的系统级设计和相应简单的集成和测试程序，从而简化了整个设计和开发过程。

公开(公告)号：US6098930A

公开(公告)日：2000-08-08

申请号：US123136

申请日：1998-07-27

Applicant: Howard S. Eller ,  Ramon Coronel

Inventor： Howard S. Eller ,  Ramon Coronel

IPC: B64G1/10 ,  B64G1/28 ,  B64G1/32 ,  B64G1/36 ,  B64G1/40 ,  B64G1/42 ,  B64G1/44 ,  B64G1/22

CPC classification number: B64G1/10 ,  B64G1/28 ,  B64G1/32 ,  B64G1/36 ,  B64G1/40 ,  B64G1/425 ,  B64G1/443

Abstract: A compact spacecraft (10, 22) having a potentially long life in orbit as a result of its use of non-moving and solid-state components entirely or wherever possible. Amorphous silicon arrays (14, 24, 44) are used for solar energy collection. Because the arrays are not limited to a flat panel configuration, no movement is needed except for possible initial deployment. Phased arrays (12, 26) are used wherever possible for antenna arrays, in combination with torque rods (18, 3) for coarse attitude control of the spacecraft. Avionics modules (30, 50) are fabricated using large wafer-scale techniques and energy storage using long life battery or a solid-state capattery (52) technology. Propulsion is also effected with no moving parts, using waffle propulsion modules (20, 28, 54), which use elemental containers of propellant that is selectively ignited to supply propulsive force. This combination of features extends the useful life of the spacecraft beyond limits imposed primarily by mechanical moving parts, and by high levels of redundancy.

Abstract translation: 由于其全部或任何可能的地方使用非移动和固态部件，所以具有潜在的长寿命的紧凑型航天器（10,22）。 非晶硅阵列（14,24,44）用于太阳能收集。 因为阵列不限于平板配置，除了可能的初始部署之外，不需要移动。 天线阵列（12,26）尽可能地用于天线阵列，结合用于航天器的粗略姿态控制的扭矩杆（18,3）。 使用大型晶片级技术和使用长寿命电池或固态电容（52）技术的能量存储来制造航空电子模块（30,50）。 使用华夫饼推进模块（20,28,54）也可以使用无选择性点燃的推进剂元素容器来提供推进力，推动力也不受运动部件的影响。 这种特征的组合延长了航天器的使用寿命，超出了主要由机械运动部件施加的限制，以及高度的冗余。

公开(公告)号：US06330093B1

公开(公告)日：2001-12-11

申请号：US09176718

申请日：1998-10-21

Applicant: Howard S. Eller ,  Ramon Coronel ,  Gary T. Harkness

Inventor： Howard S. Eller ,  Ramon Coronel ,  Gary T. Harkness

IPC: H04B1002

CPC classification number: B64G1/641 ,  B64G1/10 ,  B64G1/428 ,  B64G2001/1092

Abstract: A standardized interface between a spacecraft backbone structure (48) and multiple spacecraft modules (26) that are coupled to the backbone structure mechanically, electrically and optically. The interface structure includes power connection pins (42 or 50) that connect to a power bus in the backbone structure, data signal pins (44) that connect to a conventional data bus in the backbone structure, and an optical connection (46 or 56) that connects to an optical data bus (60) in the backbone structure. Optionally, the interface also includes a wireless data bus (54) using infrared propagation along the backbone structure, and a radio-frequency (RF) microstrip connector (52) for transmission of data at radio frequencies. The optical data connection employs an optical interface unit (62) in each spacecraft module (26) to convert optical signals from the optical data bus (60) to corresponding electrical signals, and a cross-point switch (74) to distribute the signals to appropriate destinations on the module. The optical interface unit (62) also converts electrical signals to optical signals for transmission back onto the optical data bus (60). Optical signals may be wavelength division multiplexed onto the optical data bus (60), for which purpose the interface unit (62) also includes an optical demultiplexer (68) and an optical multiplexer (84).

Abstract translation: 航天器主干结构（48）和多个航天器模块（26）之间的机械，电气和光学耦合到主干结构的标准接口。 接口结构包括连接到主干结构中的电源总线的电源连接引脚（42或50），连接到主干结构中的常规数据总线的数据信号引脚（44）和光学连接（46或56） 其连接到主干结构中的光学数据总线（60）。 可选地，接口还包括使用沿主干结构的红外传播的无线数据总线（54）和用于在射频频率传输数据的射频（RF）微带连接器（52）。 光学数据连接在每个航天器模块（26）中使用光学接口单元（62）来将来自光学数据总线（60）的光学信号转换成相应的电信号，以及交叉点开关（74）以将信号分配到 模块上的适当目的地。 光接口单元（62）还将电信号转换为光信号以便传输回光数据总线（60）。 光信号可以被波分复用到光数据总线（60）上，为此，接口单元（62）还包括光解复用器（68）和光复用器（84）。

公开(公告)号：US06353264B1

公开(公告)日：2002-03-05

申请号：US09618771

申请日：2000-07-18

Applicant: Ramon Coronel ,  Karen A. Fucik ,  Peter S. Yoon ,  David W. Y. Lee ,  Richard B. Sherwood ,  Donald G. Heflinger

Inventor： Ramon Coronel ,  Karen A. Fucik ,  Peter S. Yoon ,  David W. Y. Lee ,  Richard B. Sherwood ,  Donald G. Heflinger

IPC: H01L2348

CPC classification number: G02B6/43 ,  G02B6/2848 ,  G02B6/34 ,  G02B6/4246 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2224/48

Abstract: A wafer-scale module includes a plurality of stacked wafers, each having a thin semiconductor layer disposed on a surface of the wafer, a plurality of wafer-scale integrated (WSI) circuits formed on the semiconductor layer and a plurality of nodes formed on the semiconductor layer. Each node provides an optoelectronic interface to an axial optical waveguide for high-speed optical interconnectivity between the WSI circuits and other integrated wafer circuit devices of the stack. A top plate is included and is disposed on the plurality of stacked wafer devices. A base plate, included for purposes of thermal dissipation, is disposed opposite the top plate such that the plurality of stacked wafers are sandwiched between the top plate and the base plate and all are assembled.

Abstract translation: 晶片级模块包括多个堆叠的晶片，每个晶片具有设置在晶片的表面上的薄半导体层，形成在半导体层上的多个晶片级集成（WSI）电路和形成在该半导体层上的多个节点 半导体层。 每个节点为轴向光波导提供光电接口，用于WSI电路和堆叠的其他集成晶片电路器件之间的高速光学互连。 包括顶板并设置在多个堆叠的晶片装置上。 包括用于散热目的的底板与顶板相对设置，使得多个叠置的晶片夹在顶板和底板之间，并且全部组装。

公开(公告)号：US6027077A

公开(公告)日：2000-02-22

申请号：US123135

申请日：1998-07-27

Applicant: Howard S. Eller ,  Ramon Coronel ,  John W. Spargo ,  Larry R. Eaton ,  Andrew D. Smith

Inventor： Howard S. Eller ,  Ramon Coronel ,  John W. Spargo ,  Larry R. Eaton ,  Andrew D. Smith

IPC: B64G1/22 ,  B64G1/50 ,  B64G1/10

CPC classification number: B64G1/50 ,  B64G1/22

Abstract: A spacecraft (10) having a cryogenic cooler (24) that maintains different temperatures in thermally insulated and nested enclosures (26, 28, 12). In the coldest enclosure (26), which is maintained, for example, approximately 10.degree. K, low-temperature superconducting (LTS) processors (32, 34) perform bus and payload processing functions at very high speed. The next-coldest enclosure (28) is maintained at approximately 77.degree. K and houses high-temperature superconducting (HTS) electronic modules, such as for power regulation and distribution (40) and a payload sensor processing module (38). The third of the enclosures (12) is maintained at approximately 300.degree. K and houses other modules operating at room temperature, including a transponder (44), power control (46), energy storage (48), a propulsion subsystem (22), a downlink data processing module (49) and the cryogenic cooler (24) itself. Thermal functions of the spacecraft are effectively centralized in the cryogenic cooler (24) and the bus and payload functions of the spacecraft are provided very efficiently in a small, compact an potentially low-cost configuration.

Abstract translation: 具有在绝热和嵌套外壳（26,28,12）中保持不同温度的低温冷却器（24）的航天器（10）。 在例如约10K的低温超导（LTS）处理器（32,34）中保持的最冷的外壳（26）以非常高的速度执行总线和有效载荷处理功能。 下一个最冷的外壳（28）保持在大约77°K，并容纳高温超导（HTS）电子模块，例如功率调节和分配（40）和有效载荷传感器处理模块（38）。 外壳（12）中的第三个保持在大约300°K，并且容纳在室温下工作的其他模块，包括应答器（44），功率控制（46），能量存储（48），推进子系统（22） 下行链路数据处理模块（49）和低温冷却器（24）本身。 太空船的热功能有效地集中在低温冷却器（24）中，并且以小型，紧凑的潜在低成本配置非常有效地提供了航天器的总线和有效负载功能。

公开(公告)号：US6005771A

公开(公告)日：1999-12-21

申请号：US771085

申请日：1996-12-20

Applicant: William D. Bjorndahl ,  Paul T. Tsutsumi ,  Ramon Coronel ,  Janice W. Espinosa

Inventor： William D. Bjorndahl ,  Paul T. Tsutsumi ,  Ramon Coronel ,  Janice W. Espinosa

IPC: H01L23/427 ,  H01L23/552 ,  H05K7/20

CPC classification number: H01L23/552 ,  H01L23/427 ,  H05K7/20509 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1627 ,  H01L2924/3025

Abstract: A spacecraft avionics module in which integrated circuit chip packages or chips are mounted in direct contact with the surface of a radiator panel, to enhance dissipation of heat from the integrated circuit and to allow electronics to be packed more densely while still dissipating sufficient heat to allow the electronics to operate at a desirable temperature. Conduction of heat from the electronics to the radiator panel is further enhanced by the use of a thermally conductive adhesive disposed between the integrated circuit chip packages or chips and the radiator panel, which may include heatpipes for more uniform heat distribution across the panel.

Abstract translation: 集成电路芯片封装或芯片与散热器板的表面直接接触的航空电子航空电子模块，以增强集成电路的散热，并允许电子元件更密集地堆积，同时仍然散发足够的热量以允许 电子器件在理想的温度下工作。 通过使用设置在集成电路芯片封装或芯片之间的导热粘合剂和散热器面板，可以进一步增强从电子器件到散热器面板的热传导，散热器面板可包括用于在整个面板上均匀分布的热管。

公开(公告)号：US5979833A

公开(公告)日：1999-11-09

申请号：US113442

申请日：1998-07-10

Applicant: Howard S. Eller ,  Ramon Coronel ,  Lee E. Elliott ,  Alfred Barrett ,  David W. Y. Lee

Inventor： Howard S. Eller ,  Ramon Coronel ,  Lee E. Elliott ,  Alfred Barrett ,  David W. Y. Lee

IPC: B64G1/00 ,  B64G1/10 ,  B64G1/50 ,  B64G1/64 ,  B64G1/44

CPC classification number: B64G1/10 ,  B64G1/503 ,  B64G1/64 ,  B64G2001/1092

Abstract: A spacecraft structure using functionally independent modules assembled around a lightweight core structure to provide a vehicle that is lighter, uses less volume, and is easier to design, manufacture and test than a conventional spacecraft. In the disclosed embodiments, the modules are formed on generally flat panels, which serve as thermal radiators. The modules extend radially from the core structure and are attached to the core structure either in coplanar rows that extend axially along the core structure or in a coplanar set that extends circumferentially around the core structure. Interconnection between modules is achieved through a backbone interface, through which the modules are connected to the core structure. A large number of variant configurations may be implemented using the modular approach, by selecting a core, components and modules of number and size to meet mission requirements. The modular spacecraft may be easily designed and adapted to operate with its radiating modules facing in north-south directions for maximum thermal radiation, or in other orientations as needed for specific missions. All of the configurations have the advantage that they occupy a relatively small volume and allow large components, such as antennas and solar arrays, to be stowed for launch in the ample spaces between rows of modules.

Abstract translation: 一种使用功能独立模块的航天器结构，其组装在轻质核心结构周围，以提供比常规航天器更轻，使用更少的体积，更容易设计，制造和测试的车辆。 在所公开的实施例中，模块形成在用作热辐射器的大体平板上。 模块从芯结构径向延伸并且在沿着芯结构轴向延伸的共面行中或在围绕芯结构周向延伸的共面组中附接到芯结构。 通过骨干接口实现模块之间的互连，模块通过该骨干接口连接到核心结构。 可以使用模块化方法来实现大量变体配置，通过选择核心，数量和大小的组件和模块来满足任务要求。 模块化航天器可以容易地设计和适应于其面向南北方向的辐射模块操作，以实现最大的热辐射，或者根据特定任务所需的其他方向。 所有这些配置都具有这样的优点：它们占据相对较小的体积，并允许将诸如天线和太阳能阵列之类的大型组件存放在模块行之间的大量空间中。

公开(公告)号：US5931418A

公开(公告)日：1999-08-03

申请号：US771084

申请日：1996-12-20

Applicant: Howard S. Eller ,  Ramon Coronel ,  Martin M. Giebler

Inventor： Howard S. Eller ,  Ramon Coronel ,  Martin M. Giebler

IPC: B64G1/66 ,  B64G1/10 ,  B64G1/22 ,  B64G1/50 ,  B64G1/64

CPC classification number: B64G1/10 ,  B64G1/22 ,  B64G1/64 ,  B64G1/503 ,  B64G1/641 ,  B64G2001/1092

Abstract: A spacecraft avionics module that is for the most part functionally independent of a core spacecraft structure, and provides its own structural integrity, thermal management and some level of power management. The illustrative embodiment of the module is formed as a flat panel that also serves as a thermal radiator. Electronic components are mounted directly onto the panel, which is normally attached by mounting hardware to the core spacecraft structure, through a backbone interface that provides data interconnection between modules and, in some cases, supplies unregulated power to the module. The module may include a power regulation function, or may also include power storage and power generation functions. For complete independence, the module may also include its own attitude control system.

Abstract translation: 一个航天器航空电子模块大部分功能上与核心航天器结构无关，并提供自身的结构完整性，热管理和一定程度的电源管理。 模块的说明性实施例形成为也用作散热器的平板。 电子部件直接安装在面板上，该面板通常通过将硬件安装到核心航天器结构上，通过提供模块之间的数据互连的骨干接口，并且在某些情况下向模块提供未调节的电力。 该模块可以包括功率调节功能，或者也可以包括功率储存和发电功能。 为了完全独立，模块还可以包括其自己的姿态控制系统。

公开(公告)号：US5798574A

公开(公告)日：1998-08-25

申请号：US770477

申请日：1996-12-20

Applicant: Ramon Coronel

Inventor： Ramon Coronel

IPC: B64G1/42 ,  B64G1/44 ,  H02J4/00

CPC classification number: H02J4/00 ,  B64G1/428 ,  B64G1/425 ,  B64G1/443 ,  Y10T307/305

Abstract: A spacecraft avionics module having a selected degree of electrical power independence from a core spacecraft structure to which the module is attached. The module of the invention includes at least a power regulator and converter function. Other embodiments of the invention also include an energy storage device and a power generator on the module itself, for complete decentralization of electrical power management for the spacecraft.

Abstract translation: 具有与模块附接到的核心航天器结构独立的选定程度的电力的航天器航空电子模块。 本发明的模块至少包括功率调节器和转换器功能。 本发明的其他实施例还包括能量存储装置和模块本身上的发电机，用于完全分散用于航天器的电力管理。