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    Lapping method and system for compensating for substrate bow
    1.
    发明授权
    Lapping method and system for compensating for substrate bow 失效
    用于补偿基材弓的研磨方法和系统

    公开(公告)号：US5967878A

    公开(公告)日：1999-10-19

    申请号：US842940

    申请日：1997-04-25

    申请人： Christopher Arcona ,  Robert Owen Barr ,  Alain Michel Desouches ,  Jeffrey Paul Gunder ,  Douglas Jeffery Lucken ,  Michael Zung

    发明人： Christopher Arcona ,  Robert Owen Barr ,  Alain Michel Desouches ,  Jeffrey Paul Gunder ,  Douglas Jeffery Lucken ,  Michael Zung

    IPC分类号： B24B37/04 ,  B24B37/10 ,  B24B49/02 ,  B24B49/10 ,  G11B5/187 ,  G11B5/31 ,  G11B5/39

    CPC分类号： B24B37/102 ,  B24B37/048 ,  B24B49/02 ,  B24B49/10 ,  G11B5/3103 ,  G11B5/3163 ,  G11B5/1871 ,  G11B5/3116 ,  G11B5/3967 ,  G11B5/398

    摘要： A method and system is disclosed for lapping row edges of a substrate work piece with a flat lapping element. The substrate work piece comprises a section of wafer having parallel aligned multiple row edges to be individually lapped. The wafer has different bow characteristics imparted to different substrate work piece. The bow characteristic of the substrate work piece to be lapped is determined, load points are selected on the work piece which will counteract the bow characteristic, and a pusher with push pads located at the selected load points pushes the work piece at those load points so that the pushing flexes the substrate work piece to counteract the bow characteristic to lap the row edge. Upon completion of the lapping step, the row having the lapped row edge is sliced from the work piece to form a new row edge parallel to the lapped row edge, and, repeating the lapping process, the work piece is pushed by the push pads at the same selected load points, whereby, as the substrate is shortened, making said bow characteristic more pronounced, the pushing at the selected load points provides greater flex of the work piece to counteract the more pronounced bow.

    摘要翻译： 公开了一种用于研磨具有平坦研磨元件的基底工件的行边缘的方法和系统。 衬底工件包括具有平行排列的多个行边缘以进行单独研磨的晶片部分。 晶片具有赋予不同衬底工件的不同的弓形特性。 确定要研磨的基板工件的弓形特征，在工件上选择负载点，该负载点将抵消弓形特性，并且具有位于所选加载点处的推动垫的推动器将工件在这些负载点处推动 推动弯曲基板工件以抵消弓形特征以搭接行边缘。 在研磨步骤完成后，具有重叠行边的行从工件切片以形成平行于搭接的行边缘的新的行边，并且重复研磨过程，工件被推垫推动 相同的选择的负载点，由此，当基板被缩短时，使所述弓形特征更加显着，在所选择的载荷点处的推动提供了工件的更大弯曲以抵抗更明显的弓。