公开(公告)号：US20080157326A1

公开(公告)日：2008-07-03

申请号：US11872810

申请日：2007-10-16

申请人： Hyun Joo HAN ,  Tao Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

发明人： Hyun Joo HAN ,  Tao Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

IPC分类号： H01L23/538 ,  H01L21/60

CPC分类号： H05K3/3436 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

摘要翻译： 一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球 封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到 第一个BGA IC封装。

公开(公告)号：US07755181B2

公开(公告)日：2010-07-13

申请号：US11872810

申请日：2007-10-16

申请人： Hyun Joo Han ,  Tae Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

发明人： Hyun Joo Han ,  Tae Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

IPC分类号： H01L23/538

CPC分类号： H05K3/3436 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

摘要翻译： 一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球 封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到 第一个BGA IC封装。