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1.发明授权
公开(公告)号：US4461610A
公开(公告)日：1984-07-24
申请号：US396491
申请日：1982-07-08
Applicant: Kotaro Harigane , Kenichi Takahashi , Hirokazu Shudo , Shuichi Tando
Inventor： Kotaro Harigane , Kenichi Takahashi , Hirokazu Shudo , Shuichi Tando
CPC classification number: H05K13/0408 , H05K13/0413
Abstract: Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be conveyed intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.
Abstract translation: 用于将芯片型电路元件安装在印刷电路板上的装置包括用于供应芯片型电路元件的供应单元，适于沿纵向间歇地输送的多个托盘，适于将电路元件移动到托盘上的顺序头， 适于接收和支撑印刷电路板的XY台，具有适于将芯片型电路元件安装在由XY工作台承载的印刷电路板上的安装头的安装机构和用于将芯片型电路元件从 托盘到安装机构的安装头。 安装机构构成多个安装头位于其上的可旋转的分度盘，顺序头，变速头和安装头各自利用吸引销，芯片型电路元件在从供给单元移动到其中时固定到 印刷电路板。
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Patent Agency Ranking2.发明授权
公开(公告)号：US4372802A
公开(公告)日：1983-02-08
申请号：US266109
申请日：1981-05-21
Applicant: Kotaro Harigane , Kenichi Takahashi , Hirokazu Shudo , Shuichi Tando
Inventor： Kotaro Harigane , Kenichi Takahashi , Hirokazu Shudo , Shuichi Tando
CPC classification number: H05K13/0413 , H05K13/0408 , Y10S156/942 , Y10T156/17 , Y10T156/1702 , Y10T156/1744 , Y10T156/1768 , Y10T156/1771 , Y10T156/1978 , Y10T29/5313 , Y10T29/5317 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261 , Y10T29/53435
Abstract: Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be connected intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.
Abstract translation: 用于将芯片型电路元件安装在印刷电路板上的装置包括用于提供芯片型电路元件的供应单元，适于沿纵向间歇连接的多个托盘，适于将电路元件移动到托盘上的顺序头， 适于接收和支撑印刷电路板的XY台，具有适于将芯片型电路元件安装在由XY工作台承载的印刷电路板上的安装头的安装机构和用于将芯片型电路元件从 托盘到安装机构的安装头。 安装机构构成多个安装头位于其上的可旋转的分度盘，顺序头，变速头和安装头各自利用吸引销，芯片型电路元件在从供给单元移动到其中时固定到 印刷电路板。
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公开(公告)号：US4353481A
公开(公告)日：1982-10-12
申请号：US198232
申请日：1980-10-17
Applicant: Shuichi Tando
Inventor： Shuichi Tando
CPC classification number: H05K13/0084
Abstract: Magazine for storing and supplying chip type circuit elements includes a tube having a bore formed therethrough in which the circuit elements are situated in stacked relationship for feeding toward an open supply end and wherein an elastic member is provided on the tube in the region of the supply end having a surface facing inwardly into the bore and wherein a keeper pawl extends inwardly from the free end of the elastic member into the bore at the supply end region, preferably slightly below the supply end, adapted to hold the leading circuit element under pressure prior to the same being supplied in one-by-one fashion and to prevent simultaneous supply of more than one circuit element from the supply end of the magazine and, additionally, to precisely locate each circuit element at the supply end. In one embodiment, longitudinally extending ribs protruding inwardly into the bore are formed on the bore defining surface of the tube which maintain the chip elements in precise mutual alignment.
Abstract translation: 用于存储和供应芯片型电路元件的杂物包括具有穿过其中形成的孔的管，其中电路元件位于堆叠关系中，用于朝向开放供应端进给，并且其中在供应区域中的管上设置弹性构件 端部具有面向内部进入孔的表面，并且其中保持器棘爪从弹性构件的自由端向内延伸到供给端区域的孔中，优选地略低于供给端，适于将先导电路元件保持在压力之前 以同样的方式提供，并且防止从盒的供应端同时供应多于一个的电路元件，另外，精确地定位供应端处的每个电路元件。 在一个实施例中，向内突出到孔中的纵向延伸肋形成在管的孔限定表面上，其保持芯片元件精确相互对准。
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4.发明授权
公开(公告)号：US4731923A
公开(公告)日：1988-03-22
申请号：US23117
申请日：1987-03-06
Applicant: Hiroshi Yagi , Shuichi Tando , Yoshihito Oba , Toshihisa Nakamura
Inventor： Hiroshi Yagi , Shuichi Tando , Yoshihito Oba , Toshihisa Nakamura
CPC classification number: H05K13/0413 , Y10T29/49131 , Y10T29/49133 , Y10T29/53183
Abstract: An automatic circuit element mounting apparatus includes a lead wire detection mechanism for detecting lead wires of a circuit element held on a mounting head by suction and a substrate mark detection mechanism for detecting a mounting reference mark of a printed circuit board on which the circuit element is mounted by means of the mounting head, so that the amount of movement of the mounting head may be corrected depending on a result of detection by each of the detection mechanisms to precisely mount the circuit element on the printed circuit board. Also, a method for mounting a circuit element on a printed circuit board is disclosed.
Abstract translation: 一种自动电路元件安装装置，包括：引线检测机构，用于检测通过抽吸保持在安装头上的电路元件的引线;以及基板标记检测机构，用于检测印刷电路板的安装基准标记，电路元件 通过安装头安装，从而可以根据每个检测机构的检测结果校正安装头的移动量，以精确地将电路元件安装在印刷电路板上。 另外，公开了一种将电路元件安装在印刷电路板上的方法。
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5.发明授权
公开(公告)号：US4520557A
公开(公告)日：1985-06-04
申请号：US409184
申请日：1982-08-18
Applicant: Kotaro Harigane , Shuichi Tando , Kenichi Takahashi , Hirokazu Shudo
Inventor： Kotaro Harigane , Shuichi Tando , Kenichi Takahashi , Hirokazu Shudo
CPC classification number: H05K13/0404 , H05K13/0452 , Y10T29/49144 , Y10T29/53178 , Y10T29/53261
Abstract: Apparatus for mounting chip type circuit elements on printed circuit boards in one-by-one fashion with increased speed and precision includes a supply unit adapted to supply chip type circuit elements, a plurality of pallets conveyed in an intermittent fashion, a first shifting member adapted to shift the chip type circuit elements from the supply unit onto the pallet, an X-Y table adapted to support a printed circuit board, a mounting mechanism having mounting heads associated therewith for mounting the chip type circuit elements on the printed circuit board supported by the X-Y table and a second shifting member adapted to shift the chip type circuit elements from the pallet to the mounting heads where they are received and positively gripped for subsequent mounting onto the printed circuit board.
Abstract translation: 用于以增加的速度和精度以一个一个方式将芯片型电路元件安装在印刷电路板上的装置包括适于提供芯片型电路元件的供应单元，以间歇方式输送的多个托盘，适于 将芯片型电路元件从供电单元移动到托盘上，XY台适于支撑印刷电路板，安装机构具有与其相关的安装头，用于将芯片型电路元件安装在由XY支撑的印刷电路板上 工作台和第二移动构件，其适于将芯片型电路元件从托盘移动到安装头，在那里它们被接收并被牢固地夹持以便随后安装到印刷电路板上。
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6.发明授权
公开(公告)号：US4292116A
公开(公告)日：1981-09-29
申请号：US28924
申请日：1979-04-10
Applicant: Tetsuo Takahashi , Yoshinobu Taguchi , Shuichi Tando , Kenichi Saito
Inventor： Tetsuo Takahashi , Yoshinobu Taguchi , Shuichi Tando , Kenichi Saito
CPC classification number: H05K13/0482 , Y10T156/1089 , Y10T156/1763 , Y10T156/1768 , Y10T156/1783 , Y10T29/53178 , Y10T29/53191 , Y10T29/53252 , Y10T29/53478
Abstract: A method whereby chip type circuit elements are mounted at predetermined locations on a printed circuit board by a suction means and apparatus for performing the method are disclosed. The suction means picks up each circuit element from a respective stack supported in a vertical magazine and transfers and positions them above the predetermined locations on the printed circuit board which can have a predetermined pattern of laminar conductors on the upper surface thereof. The circuit elements are then released by termination of the applied suction and adhered to the board by a thermoplastic adhesive setting operation.
Abstract translation: 公开了一种芯片型电路元件通过抽吸装置和用于执行该方法的装置安装在印刷电路板上的预定位置上的方法。 抽吸装置从支撑在垂直仓库中的相应堆叠件拾取每个电路元件，并将它们传送并定位在印刷电路板上的预定位置上方，该印刷电路板在其上表面上可以具有预定图案的层状导体。 然后通过终止所施加的抽吸来释放电路元件，并通过热塑性粘合剂设置操作将其粘附到板上。
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