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公开(公告)号：US20070268672A1
公开(公告)日：2007-11-22
申请号：US11435903
申请日：2006-05-16
Applicant: Stephan Barsun , Kin Tam , Byan Bolich , Matt Neumann , Richard Augustus Miner
Inventor： Stephan Barsun , Kin Tam , Byan Bolich , Matt Neumann , Richard Augustus Miner
IPC: H05K7/20
CPC classification number: H05K7/1007
Abstract: A socket activation assembly is configured to close over a component and drive a gear during closure that activates a socket to engage the component.
Abstract translation: 插座激活组件被配置为在闭合期间闭合部件并驱动齿轮，其激活插座以接合部件。
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公开(公告)号：US20060139886A1
公开(公告)日：2006-06-29
申请号：US11027337
申请日：2004-12-29
Applicant: Stephan Barsun
Inventor： Stephan Barsun
IPC: H05K7/20
CPC classification number: H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
Abstract: An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.
Abstract translation: 组件包括适于安装厚度在厚度范围内的电子设备的框架。 该框架适于在安装电子装置之后组装到散热器组件。 组件还包括适于将电子设备固定到框架的至少一个弹簧。
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公开(公告)号：US20050128708A1
公开(公告)日：2005-06-16
申请号：US10737377
申请日：2003-12-16
Applicant: Stephan Barsun , Michael Wortman , Bryan Bolich
Inventor： Stephan Barsun , Michael Wortman , Bryan Bolich
CPC classification number: H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
Abstract: An apparatus in one example comprises a plurality of levers that convert a lesser input force to a greater output force for support of a heatsink component coupled with an electronic component.
Abstract translation: 一个示例中的装置包括多个杠杆，其将较小的输入力转换为更大的输出力，以支撑与电子部件耦合的散热器部件。
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公开(公告)号：US06659168B1
公开(公告)日：2003-12-09
申请号：US10192124
申请日：2002-07-09
Applicant: Stephan Barsun
Inventor： Stephan Barsun
IPC: H05K720
CPC classification number: H01L23/3672 , H01L23/3675 , H01L2924/0002 , H01L2924/00
Abstract: A heat sink includes a base having first and second regions, a first fin of a first type disposed on the first region of the base, and a second fin of a second type disposed on the second region of the base. The first and second regions of the base may be integral with or attached to one another. Such a heat sink can dissipate heat from multiple electronic components with the respective fin type that is most cost effective for each respective component. Using such a heat sink often reduces manufacturing time and costs as compared to using a separate heat sink for each component. In addition, such a heat sink can dissipate heat from multiple regions of a single electronic component with the respective fin type that is most cost effective for each region.
Abstract translation: 散热器包括具有第一和第二区域的基座，设置在基座的第一区域上的第一类型的第一翅片和设置在基座的第二区域上的第二类型的第二翅片。 基座的第一和第二区域可以彼此成一体或彼此附接。 这样的散热器可以从具有对于每个相应部件最具成本效益的相应散热片类型的多个电子部件散热。 与每个部件使用单独的散热器相比，使用这种散热器通常减少制造时间和成本。 此外，这样的散热器可以从单个电子部件的多个区域散发具有对于每个区域最具成本效益的相应散热片类型的热量。
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公开(公告)号：US20060139885A1
公开(公告)日：2006-06-29
申请号：US11026367
申请日：2004-12-29
Applicant: Stephan Barsun
Inventor： Stephan Barsun
IPC: H05K7/20
CPC classification number: H01L23/4093 , H01L2924/0002 , Y10T24/309 , Y10T24/42 , H01L2924/00
Abstract: An assembly comprises a frame configured to mount an electronic device and assemble to a heat sink. The assembly further comprises at least one self-locking fastener adapted to lock into place and secure the heat sink to the frame on aligned compression of the heat sink toward the framed.
Abstract translation: 组件包括构造成安装电子设备并组装到散热器的框架。 该组件还包括至少一个自锁紧固件，其适于锁定到位，并且将散热器朝向框架的对准压缩固定到框架上。
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Patent Agency Ranking
公开(公告)号：US20060037776A1
公开(公告)日：2006-02-23
申请号：US10919998
申请日：2004-08-17
Applicant: Brandon Rubenstein , Stephan Barsun
Inventor： Brandon Rubenstein , Stephan Barsun
IPC: H05K1/18
CPC classification number: H05K7/1428 , H05K1/141 , H05K2201/10189 , H05K2201/10409 , H05K2201/10598
Abstract: Example systems and methods associated with positioning and securing an electronic module to a circuit board are described. In one embodiment, an electronic module comprises at least one connectible portion configured to connect to a circuit board and at least one extended portion having an opening therethrough. In one example, the opening can be configured to maintain a threaded device and to allow the threaded device to move within the opening. The threaded device can be configured to engage a securing device for adjustably securing the at least one extended portion to the circuit board
Abstract translation: 描述了将电子模块定位和固定到电路板相关联的示例系统和方法。 在一个实施例中，电子模块包括被配置为连接到电路板的至少一个可连接部分和具有穿过其中的开口的至少一个延伸部分。 在一个示例中，开口可以被配置为维持螺纹装置并允许螺纹装置在开口内移动。 螺纹装置可以被配置成接合固定装置，用于将至少一个延伸部分可调节地固定到电路板
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公开(公告)号：US20050241799A1
公开(公告)日：2005-11-03
申请号：US10837459
申请日：2004-04-29
Applicant: Christopher Malone , Glenn Simon , Stephan Barsun
Inventor： Christopher Malone , Glenn Simon , Stephan Barsun
CPC classification number: H05K7/20727 , G06F1/20 , G06F2200/201 , H05K7/20772
Abstract: A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movement of the moveable cold plate.
Abstract translation: 液体循环冷却装置包括封闭冷却流体可在其中循环的内孔或内腔的管道，刚性地联接到管道的可移动冷板以及耦合到管道的至少一个柔性波纹管，并且能够灵活地实现可移动冷板的移动 。
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公开(公告)号：US20050186831A1
公开(公告)日：2005-08-25
申请号：US10782700
申请日：2004-02-19
Applicant: Stephan Barsun , Bryan Bolich , Alisa Sandoval , Gregg Meyer , Richard Miner
Inventor： Stephan Barsun , Bryan Bolich , Alisa Sandoval , Gregg Meyer , Richard Miner
Abstract: A computing system includes a circuit board, a first connector portion electrically connected to the circuit board, an electronic component and a plurality of resilient support members. The electronic component includes a first electronic device, a second connector portion electrically coupled to the electronic device and connected to the first connector portion along an axis. The plurality of resilient support members are asymmetrically located about the axis and extend between the device and the circuit board.
Abstract translation: 计算系统包括电路板，电连接到电路板的第一连接器部分，电子部件和多个弹性支撑部件。 电子部件包括第一电子设备，电连接到电子设备并沿轴线连接到第一连接器部分的第二连接器部分。 多个弹性支撑构件围绕轴线不对称地定位并且在装置和电路板之间延伸。
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公开(公告)号：US20050034845A1
公开(公告)日：2005-02-17
申请号：US10641502
申请日：2003-08-14
Applicant: Stephan Barsun , Andrew Barr , Robert Dobbs
Inventor： Stephan Barsun , Andrew Barr , Robert Dobbs
IPC: F28F3/02 , F28F13/06 , H01L23/467 , F28D15/00
CPC classification number: F28F13/06 , F28F3/02 , H01L23/467 , H01L2924/0002 , H01L2924/00
Abstract: Described are devices for cooling a component, and methods thereof. The device includes a base that can be coupled to the component so that heat is transferred from the component to the base. The device also includes fins coupled to the base. The fins are arranged to funnel air from an air intake end of the device toward a location on the base.
Abstract translation: 描述了用于冷却部件的装置及其方法。 该装置包括可以耦合到部件的基部，使得热量从部件传递到基部。 该装置还包括联接到基座的翅片。 散热片布置成将空气从设备的进气端朝向基座上的位置。
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公开(公告)号：US20050030716A1
公开(公告)日：2005-02-10
申请号：US10637138
申请日：2003-08-08
Applicant: Stephan Barsun , Thom Augustin
Inventor： Stephan Barsun , Thom Augustin
CPC classification number: H05K7/20736 , G06F1/20
Abstract: An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is thermally coupled to the heat exchange unit. The heat exhaust exhausts heat from the heat exchange unit to a remote location from the electronic device.
Abstract translation: 电子设备冷却系统包括热交换单元; 设置在电子设备的传热界面处的至少一个冷却界面，其中所述冷却界面热耦合到所述热交换单元; 以及与热交换单元热耦合的散热器。 热排气将热量从热交换单元排出到远离电子设备的位置。
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