公开(公告)号：US4893404A

公开(公告)日：1990-01-16

申请号：US244050

申请日：1988-09-13

申请人： Isao Shirahata ,  Shoji Shiga ,  Hisako Hori ,  Takamasa Jinbo

发明人： Isao Shirahata ,  Shoji Shiga ,  Hisako Hori ,  Takamasa Jinbo

IPC分类号： H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/4664 ,  H05K1/056 ,  H05K3/4647 ,  H05K1/0366 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/072 ,  H05K3/246 ,  H05K3/382 ,  H05K3/4069 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for producing a multilayer printed wiring board by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) over a first insulating laminate (12), and second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern over through studs (15) and a second insulating laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.

公开(公告)号：US4791239A

公开(公告)日：1988-12-13

申请号：US55706

申请日：1987-05-29

申请人： Isao Shirahata ,  Shoji Shiga ,  Hisako Hori ,  Takamasa Jinbo

发明人： Isao Shirahata ,  Shoji Shiga ,  Hisako Hori ,  Takamasa Jinbo

IPC分类号： H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/00

CPC分类号： H05K3/4664 ,  H05K1/056 ,  H05K3/4647 ,  H05K1/0366 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/072 ,  H05K3/246 ,  H05K3/382 ,  H05K3/4069 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A multilayer printed wiring board produced by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.

摘要翻译： 通过堆积工艺生产的多层印刷线路板。 通过第一绝缘层压板（12）在金属芯（11）上形成第一层印刷布线图案（13），并且在第一层印刷布线图案上形成第二层印刷布线图案（16） 15）和第二绝缘层压板（14）。 第一层印刷布线图案（13）的表面被粗糙化，并且通过使用在粗糙化表面上的导电浆料的聚集方法形成贯穿柱（15）。