公开(公告)号：US11973029B2

公开(公告)日：2024-04-30

申请号：US17667734

申请日：2022-02-09

Applicant: SUZHOU QING XIN FANG ELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Jerry Zhijun Zhai

IPC: H01L23/522 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/5227 ,  H01L21/56 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/05 ,  H01L24/13 ,  H01L24/81

Abstract: Techniques for providing vertical integrations of semiconductor chips, magnetic chips, and lead frames. The techniques can include fabricating an integrated circuit (IC) device as a multi-layer IC structure that includes, within a sealed protective enclosure, a first layer including at least one magnetic chip, a second layer including at least one semiconductor chip or die, and a lead frame. The techniques can further include vertically bonding the magnetic chip in the first layer onto the topside of the lead frame, and vertically bonding the semiconductor chip or die in the second layer on top of the magnetic chip to form a multi-layer IC structure.

公开(公告)号：US11532430B2

公开(公告)日：2022-12-20

申请号：US16905107

申请日：2020-06-18

Applicant: SUZHOU QING XIN FANG ELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Jerry Zhijun Zhai

IPC: H01F27/36 ,  H01F27/28

Abstract: A laminated transformer-type transmitter-receiver device for transmitting or delivering electrical signals and/or power. The laminated device can include two metal shielding layers disposed between transmit and receive windings, which, in turn, are disposed between two magnetic layers. The laminated device further includes a dielectric isolation layer disposed between the two metal shielding layers. In the laminated device, no (or very little) common mode capacitance is distributed within the dielectric isolation layer, and no (or very little) common mode or “leakage” current flows across the dielectric isolation layer. As a result, various adverse effects of the common mode capacitance and the leakage current during operation of the laminated device are avoided.

公开(公告)号：US11315873B2

公开(公告)日：2022-04-26

申请号：US16738412

申请日：2020-01-09

Applicant: SUZHOU QING XIN FANG ELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Jerry Zhijun Zhai

IPC: H01L23/522 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

Abstract: Techniques for providing vertical integrations of semiconductor chips, magnetic chips, and lead frames. The techniques can include fabricating an integrated circuit (IC) device as a multi-layer IC structure that includes, within a sealed protective enclosure, a first layer including at least one magnetic chip, a second layer including at least one semiconductor chip or die, and a lead frame. The techniques can further include vertically bonding the magnetic chip in the first layer onto the topside of the lead frame, and vertically bonding the semiconductor chip or die in the second layer on top of the magnetic chip to form a multi-layer IC structure.

公开(公告)号：USD937241S1

公开(公告)日：2021-11-30

申请号：US29765837

申请日：2021-01-12

Applicant: Xin Fang Liu

Designer： Xin Fang Liu

公开(公告)号：US20150380738A1

公开(公告)日：2015-12-31

申请号：US14697511

申请日：2015-04-27

Applicant: Chongwu Zhou ,  Xin Fang ,  Mingyuan Ge ,  Jiepeng Rong

Inventor： Chongwu Zhou ,  Xin Fang ,  Mingyuan Ge ,  Jiepeng Rong

IPC: H01M4/62 ,  H01M4/525 ,  H01M4/505 ,  H01M10/0525 ,  H01M4/75 ,  H01M4/1391 ,  H01M4/04 ,  H01M4/131 ,  H01M4/66

CPC classification number: H01M4/621 ,  H01M4/0404 ,  H01M4/131 ,  H01M4/1391 ,  H01M4/505 ,  H01M4/525 ,  H01M4/625 ,  H01M4/663 ,  H01M4/75 ,  H01M10/0525 ,  H01M2004/028 ,  H01M2220/20 ,  H01M2220/30 ,  Y02E60/122

Abstract: An electrode includes a first free-standing carbon network, an active material deposited above the first free-standing carbon network, and a second free-standing carbon network covering the active material. The first and second carbon networks are a binder, a conductive additive and a current collector to the electrode.

Abstract translation: 电极包括第一自支撑碳网络，沉积在第一自支撑碳网络上方的活性材料和覆盖活性材料的第二自支撑碳网络。 第一和第二碳网络是粘合剂，导电添加剂和集电器到电极。

公开(公告)号：US08610003B2

公开(公告)日：2013-12-17

申请号：US13327467

申请日：2011-12-15

Applicant: Xin Fang ,  Guang-Fei Cao

Inventor： Xin Fang ,  Guang-Fei Cao

IPC: H05K9/00

CPC classification number: H05K9/0026

Abstract: A shielding structure includes a frame and a removable plate. The frame includes a peripheral wall, and the removable plate located in the opening may be fixed to the connecting board, the removable plate defining an access hole. A scored line is defined between the removable plate and the connecting board. The shielding structure further defines an arcuate gap between the removable plate and the connecting board and communicating with the scored line, and a mating hole, the arcuate gap is for increasing the shearing stresses on shielding structure the scored line when the removable plate must be removed.

Abstract translation: 屏蔽结构包括框架和可拆卸板。 框架包括周壁，并且位于开口中的可拆卸板可以固定到连接板，该可移动板限定一个进入孔。 在可拆卸板和连接板之间限定划线。 屏蔽结构进一步限定了可拆卸板和连接板之间的弧形间隙，并且与刻痕线和配合孔连通，弓形间隙用于增加屏蔽结构上的剪切应力，当可移除板必须被移除时，刻痕线 。

公开(公告)号：US07348373B2

公开(公告)日：2008-03-25

申请号：US10782326

申请日：2004-02-19

Applicant: Thomas E. Dueber ,  John D. Summers ,  Xin Fang

Inventor： Thomas E. Dueber ,  John D. Summers ,  Xin Fang

IPC: C08G73/10

CPC classification number: C08G73/1032 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1064 ,  C08K5/0008 ,  C08L79/08 ,  H05K1/0346

Abstract: Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250° C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.

Abstract translation: 吸水性聚酰亚胺浆料（或溶液）对于制造电子丝网印刷浆料和由这些浆料制成的电子部件特别有用。 发现一组可溶性聚酰亚胺及其溶剂特别耐吸湿性。 这些聚酰亚胺溶液任选地含有也含有可交联单体和/或热交联剂的聚酰亚胺。 此外，这些聚酰亚胺浆料可任选地含有粘合促进剂，封闭的异氰酸酯，金属，金属氧化物和其它无机填料。 本发明的聚酰亚胺膏（或溶液）具有玻璃化转变温度大于250℃的聚酰亚胺，吸水系数小于2％，并且具有正的溶解度测量。

公开(公告)号：US20080030521A1

公开(公告)日：2008-02-07

申请号：US11880903

申请日：2007-07-26

Applicant: Xin Fang

Inventor： Xin Fang

IPC: G09G5/00

CPC classification number: G06T11/20 ,  G01C11/04 ,  G06K9/4638 ,  G06T7/13 ,  G06T2207/10081 ,  G06T2207/30004 ,  G06T2207/30164 ,  G06T2207/30196

Abstract: A method for extracting edge with subpixel accuracy in photogrammetry, comprising steps of: a. capturing into a computer a picture, of which the edge is to be extracted; b. defining as a cell four neighboring pixels that form a square; c. recognizing the type of each cell composed of the four pixels; d. finding out side or sides of the cell that intersect with,the edge and figuring out the subpixel accuracy coordinates of the intersection points by linear interpolation; and e. connecting the intersection points to extract the edge. By this method edge curve is extracted rapidly and accurately. The edge determined in this way can be subpixel accurate.

Abstract translation: 一种用于在摄影测量中提取具有子像素精度的边缘的方法，包括以下步骤：a。 将计算机中的边缘捕获到图像中; b。 定义为形成正方形的四个相邻像素的单元格; C。 识别由四个像素组成的每个单元的类型; d。 找出与边缘相交的单元格的边或边，并通过线性插值计算交点的子像素精度坐标; 和e。 连接交叉点提取边缘。 通过这种方法，边缘曲线被快速准确地提取。 以这种方式确定的边缘可以是子像素准确。

公开(公告)号：US20170162876A1

公开(公告)日：2017-06-08

申请号：US15442308

申请日：2017-02-24

Applicant: Chongwu Zhou ,  Jiepeng Rong ,  Mingyuan Ge ,  Xin Fang

Inventor： Chongwu Zhou ,  Jiepeng Rong ,  Mingyuan Ge ,  Xin Fang

IPC: H01M4/62 ,  H01M10/0525 ,  H01M4/36 ,  H01M4/58

CPC classification number: H01M4/625 ,  H01M4/136 ,  H01M4/366 ,  H01M4/5815 ,  H01M10/0525 ,  H01M2004/028 ,  Y02T10/7011

Abstract: A method includes combining a coating material and an uncoated particulate core material in a solution having a selected ionic strength. The selected ionic strength promotes coating of the uncoated particulate core material with the coating material to form coated particles; and the coated particles can be collected after formation. The coating material has a higher electrical conductivity than the core material.

公开(公告)号：US20160070826A1

公开(公告)日：2016-03-10

申请号：US14662211

申请日：2015-03-18

Applicant: Jin YAO ,  Rujia LIU ,  Decai HE ,  Kun BAI ,  Hao LI ,  Bo WANG ,  Xingnan ZHANG ,  Xin FANG

Inventor： Jin YAO ,  Rujia LIU ,  Decai HE ,  Kun BAI ,  Hao LI ,  Bo WANG ,  Xingnan ZHANG ,  Xin FANG

IPC: G06F17/50

CPC classification number: G06F17/5004 ,  G06F2217/02 ,  G06F2217/04

Abstract: The present invention discloses a method for quickly implementing an interior design scheme, including: step 1) design of a prototype room, dividing and setting a room into functional areas according to a type of a room, designing each of the functional areas in three sizes, that is, a large size, a medium size and a small size, and with a design style by a designer; step 2) designing a prototype room by each designer, forming the functional areas and recording them in an easily-implemented system, according to an easily-implemented protocol and rule, and in an easily-implemented computer description language, functions and formulas; step 3) transforming the designed prototype room into computer description language and formulas, and transferring it to a cloud platform, and synchronizing it to software of any hypostatic store in any place across the world; and step 4) in a hypostatic store, adjusting sizes of the functional areas, arranging positions of the functional areas and selecting a prototype room according to the type of the room, and transforming functions and formulas of a previously designed prototype room scheme into a three-dimensional stereo and presenting the three-dimensional stereo immediately by a computer.

Abstract translation: 本发明公开了一种快速实现室内设计方案的方法，包括：步骤1）根据房间类型设计原型室，将房间划分成功能区域，设计三个尺寸的功能区域 ，大尺寸，中等尺寸，小尺寸，设计师设计风格; 步骤2）每个设计者设计一个原型室，根据易于实施的协议和规则，以易于实现的计算机描述语言，功能和公式，形成功能区域并将其记录在易于实施的系统中; 步骤3）将设计的原型室转换为计算机描述语言和公式，并将其转移到云平台，并将其同步到世界各地任何地方的任何静态商店的软件; 和步骤4），调整功能区域的大小，根据房间的类型来布置功能区域的位置和选择原型室，以及将先前设计的原型室方案的功能和公式转换为三 立体立体声立体声立体立体显示立体立体声