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公开(公告)号：US20140083567A1
公开(公告)日：2014-03-27
申请号：US14119104
申请日：2011-10-07
IPC分类号： B23K35/02 , B23K35/362
CPC分类号： B23K35/025 , B23K35/02 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K35/362 , C08G59/38 , C08K3/08 , C08K5/09 , C08K5/29 , C08L63/00 , C08L79/04 , C22C12/00
摘要： The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.
摘要翻译： 本发明涉及一种焊膏助焊剂，焊膏助焊剂包括（A）热固性预聚物，（B）分子中具有三个以上官能团的多官能环氧单体或低聚物，（C）具有 熔点为80〜170℃，（D）分子中具有2个以上氰基的氰酸酯。
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公开(公告)号：US07452797B2
公开(公告)日：2008-11-18
申请号：US10765931
申请日：2004-01-29
IPC分类号： H01L21/44
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/05573 , H01L2224/1147 , H01L2224/11472 , H01L2224/13011 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H05K3/3484 , H05K2203/043 , H05K2203/0588 , H05K2203/1163 , H01L2224/05599
摘要： The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.
摘要翻译： 本发明提供了一种焊料沉积方法，其包括在基板上形成围绕电极的堤坝的步骤，将焊料沉淀组合物施加到基板上的步骤，以及在焊接表面上沉积焊料的步骤，同时加热 焊锡沉淀组合物应用。 这种焊锡沉积方法适用于以细间距形成大的凸块。 特别地，它能够精确且容易地将焊料沉积在所需的高度，并且防止空隙的发生。
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