Methods for producing an at least partially cured layer
    3.
    发明授权
    Methods for producing an at least partially cured layer 有权
    制备至少部分固化层的方法

    公开(公告)号:US09534133B2

    公开(公告)日:2017-01-03

    申请号:US14955151

    申请日:2015-12-01

    Abstract: Methods for producing an at least partially cured layer by applying a layer including a (meth)acrylate-functional siloxane to a surface of a substrate, and irradiating the layer in a substantially inert atmosphere with a short wavelength polychromatic ultraviolet light source having a peak intensity at a wavelength of from about 160 nanometers to about 240 nanometers to at least partially cure the layer. Optionally, the layer is at a curing temperature greater than 25° C. In some embodiments, the layer has a thickness of about 0.1 micrometers to about 1 micrometer. In certain embodiments, the layer is substantially free of a photoinitiator and/or an organic solvent. In some particular embodiments, irradiating the layer with a short wavelength polychromatic ultraviolet light source takes place in an inert atmosphere including no greater than 50 ppm oxygen. The substantially cured layer may be a release layer or a low adhesion backsize (LAB).

    Abstract translation: 用于通过将包含(甲基)丙烯酸酯官能化硅氧烷的层施加在基材的表面上并在基本惰性气氛中用具有峰强度的短波长多色紫外光源照射该层来制造至少部分固化的层的方法 在约160纳米至约240纳米的波长处至少部分地固化该层。 任选地,该层处于大于25℃的固化温度。在一些实施方案中,该层具有约0.1微米至约1微米的厚度。 在某些实施方案中,该层基本上不含光引发剂和/或有机溶剂。 在一些具体实施方案中,用短波长多色紫外光源照射该层,在包含不超过50ppm氧气的惰性气氛中进行。 基本上固化的层可以是脱模层或低粘合性尺寸(LAB)。

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