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    VAPOR CHAMBER WITH INTEGRATED BUBBLE PUMP
    1.
    发明公开
    VAPOR CHAMBER WITH INTEGRATED BUBBLE PUMP 审中-公开

    公开(公告)号：US20240334662A1

    公开(公告)日：2024-10-03

    申请号：US18612272

    申请日：2024-03-21

    Applicant: ABB Schweiz AG

    Inventor： Daniele Torresin ,  Andrey Petrov ,  Bruno Agostini

    IPC: H05K7/20

    CPC classification number: H05K7/20936 ,  H05K7/20318

    Abstract: A vapor chamber for cooling a heat source is provided. The vapor chamber includes a cavity between a baseplate and a condenser wall, the cavity containing a cooling medium, wherein the baseplate has an evaporator side towards the cavity and an attachment side opposite to the evaporator side for attaching the heat source, wherein the baseplate is adapted for transferring heat from the attachment side to the cavity, such that cooling medium evaporates at the evaporator side and condenses at the condenser wall, and wherein the vapor chamber further includes a channel, which is at least partially connected to the baseplate, with an inlet below a liquid level of the cooling medium and an outlet above the liquid level and which provides a bubble pump for transporting the liquid medium from the inlet to the outlet.

    Heat dissipation device
    2.
    发明授权
    Heat dissipation device 有权

    公开(公告)号：US12196497B2

    公开(公告)日：2025-01-14

    申请号：US17557485

    申请日：2021-12-21

    Applicant: ABB Schweiz AG

    Inventor： Daniele Torresin ,  Bruno Agostini ,  Andrey Petrov

    IPC: F28D15/04

    Abstract: A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.

    TWO-PHASE HEAT TRANSFER DEVICE FOR HEAT DISSIPATION
    5.
    发明申请
    TWO-PHASE HEAT TRANSFER DEVICE FOR HEAT DISSIPATION 有权

    公开(公告)号：US20210125894A1

    公开(公告)日：2021-04-29

    申请号：US17084009

    申请日：2020-10-29

    Applicant: ABB Schweiz AG

    Inventor： Andrey Petrov ,  Jacim Jacimovic ,  Moritz Boehm ,  Bruno Agostini ,  Daniele Torresin

    IPC: H01L23/373 ,  H01L23/473 ,  H01L21/48

    Abstract: The invention relates to a two-phase heat transfer device for dissipating heat from a heat source, for instance a power semiconductor module, by a heat transfer medium, wherein the two-phase heat transfer device includes a main body, wherein the main body is formed by a body material and includes a multi-dimensional void network, wherein the multi-dimensional void network includes voids and is adapted for containing the heat transfer medium, wherein the multi-dimensional void network is adapted such that a flow of the heat transfer medium along a path through the main body is based on a variation in capillary action exerted by the multi-dimensional void network on the heat transfer medium along the path. Further the invention relates to a power semiconductor module comprising the above two-phase heat transfer device for heat dissipation and to a method for producing the above two-phase heat transfer device.

    VAPOR CHAMBER FOR COOLING AN ELECTRONIC COMPONENT, ELECTRONIC ARRANGEMENT, AND METHOD FOR MANUFACTURING THE VAPOR CHAMBER
    6.
    发明申请
    VAPOR CHAMBER FOR COOLING AN ELECTRONIC COMPONENT, ELECTRONIC ARRANGEMENT, AND METHOD FOR MANUFACTURING THE VAPOR CHAMBER 有权

    公开(公告)号：US20220192050A1

    公开(公告)日：2022-06-16

    申请号：US17551736

    申请日：2021-12-15

    Applicant: ABB Schweiz AG

    Inventor： Bruno Agostini ,  Daniele Torresin ,  Andrey Petrov

    IPC: H05K7/20 ,  F28D15/02

    Abstract: The disclosure relates to a vapor chamber for cooling an electronic component. The vapor chamber includes a bottom cover for receiving waste heat from the electronic component, a top cover, wherein the bottom cover and the top cover are formed such that a vapor cavity for accommodating a liquid is formed between the bottom cover and the top cover, a crate element for providing mechanical strength to the vapor chamber, wherein the crate element has at least one compartment, which is formed by at least three side panels being connected to each other and extending from the bottom cover to the top cover, and a top recess facing the top cover and a bottom recess facing the bottom cover, and at least one porous pillar for transferring the liquid from the top cover to the bottom cover.

    VAPOR CHAMBER FOR COOLING AN ELECTRONIC COMPONENT
    7.
    发明申请
    VAPOR CHAMBER FOR COOLING AN ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210095931A1

    公开(公告)日：2021-04-01

    申请号：US17032025

    申请日：2020-09-25

    Applicant: ABB Schweiz AG

    Inventor： Matteo Bortolato ,  Bruno Agostini ,  Andrey Petrov ,  Daniele Torresin

    IPC: F28F3/12 ,  F28D15/02

    Abstract: The invention relates to a vapor chamber (10), comprising a sealed casing (12) which comprises two main walls, wherein a first main wall is an evaporator wall (14) and a second main wall is a condenser wall (16), wherein the two main walls are connected by side connections (18, 20) to form a sealed volume (21) inside the two main walls and the side connections (18, 20), wherein a plurality of pillars (22) is provided in the sealed volume (21) such, that the pillars (22) connect the evaporator wall (14) and the condenser wall (16), wherein the pillars (22) have a first contact area (24) to the evaporator wall (14) and a second contact area (26) to the condenser wall (16), and wherein the pillars (22) further comprise an intermediate cross section area (28) being arranged between the first contact area (24) and the second contact area (26), wherein the extension of the intermediate cross section area (28) is smaller compared to the extension of both of the first contact area (24) and the second contact area (26).

    Vapor chamber for cooling an electronic component, electronic arrangement, and method for manufacturing the vapor chamber
    8.
    发明授权
    Vapor chamber for cooling an electronic component, electronic arrangement, and method for manufacturing the vapor chamber 有权

    公开(公告)号：US12156378B2

    公开(公告)日：2024-11-26

    申请号：US17551736

    申请日：2021-12-15

    Applicant: ABB Schweiz AG

    Inventor： Bruno Agostini ,  Daniele Torresin ,  Andrey Petrov

    IPC: H05K7/20 ,  F28D15/02

    Abstract: A vapor chamber includes a bottom cover, a top cover, a crate element, and at least one porous pillar. The bottom cover is configured to receive waste heat from an electronic component. The top cover is arranged on the bottom cover, and the bottom cover and the top cover are formed such that a vapor cavity configured to accommodate a liquid is formed between the bottom and top cover. The crate element is configured to provide mechanical strength to the vapor chamber, and has at least one compartment. The compartment(s) are formed by at least three side panels that are connected to each other, where the at least three side panels extend from the bottom cover to the top cover. The porous pillar(s) are configured to transfer the liquid from the top cover to the bottom cover and are arranged in the compartment.

    HEAT DISSIPATION DEVICE
    10.
    发明申请
    HEAT DISSIPATION DEVICE 有权

    公开(公告)号：US20220196337A1

    公开(公告)日：2022-06-23

    申请号：US17557485

    申请日：2021-12-21

    Applicant: ABB Schweiz AG

    Inventor： Daniele Torresin ,  Bruno Agostini ,  Andrey Petrov

    IPC: F28D15/04

    Abstract: A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.

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