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    Solid structures for thermal management
    3.
    发明授权
    Solid structures for thermal management 有权
    固体结构用于热管理

    公开(公告)号：US09312200B1

    公开(公告)日：2016-04-12

    申请号：US13801406

    申请日：2013-03-13

    Applicant: Amazon Technologies, Inc.

    Inventor： David Eric Peters ,  Ross Kenneth Thayer ,  John Avery Howard

    IPC: H01L23/373 ,  H05K7/20

    CPC classification number: H01L23/3733 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/42 ,  H01L2924/0002 ,  H05K7/2039 ,  H01L2924/00

    Abstract: Solid structures for thermal management are provided. In one aspect, the solid structures can comprise a metal-ceramic composite member assembled to be in thermal contact with a heat source. The metal-ceramic composite member can be mechanically coupled to an assembly (e.g., an electronic assembly) containing the heat source, and can provide mechanical stability to such assembly. In another aspect, the solid structures can comprise an oxide member that covers a surface of the metal-ceramic composite member, forming a metal-ceramic-oxide interface at the surface. The thickness of the oxide member combined with the magnitude of its thermal conductivity relative to the thermal conductivity of the metal-ceramic composite member can permit heat transport substantially along a direction substantially parallel to the metal-ceramic-oxide interface, and can reduce heat transfer through such interface.

    Abstract translation: 提供了用于热管理的固体结构。 一方面，固体结构可以包括组装成与热源热接触的金属 - 陶瓷复合构件。 金属 - 陶瓷复合构件可以机械地联接到包含热源的组件（例如，电子组件），并且可以为这种组件提供机械稳定性。 另一方面，固体结构可以包括覆盖金属 - 陶瓷复合构件的表面的氧化物构件，在表面​​形成金属 - 陶瓷 - 氧化物界面。 氧化物构件的厚度与其导热系数相对于金属 - 陶瓷复合构件的热导率的大小相结合可以允许基本上沿着基本上平行于金属 - 陶瓷 - 氧化物界面的方向进行热传递，并且可以减少热传递 通过这样的界面。

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