Mini-interconnect capacitor
    1.
    发明授权

    公开(公告)号:US11366332B2

    公开(公告)日:2022-06-21

    申请号:US16702639

    申请日:2019-12-04

    Applicant: Apple Inc.

    Abstract: An optical module includes an enclosure and an optical output assembly mounted on the enclosure. An emitter mounted in the enclosure is configured to emit a beam of light toward the optical output assembly. A connector, which includes two conductive layers separated by a dielectric layer, has a first side connected to the enclosure and a second side connected to the optical output assembly. An electrical trace disposed on the enclosure is connected to the first side of the connector so as to define a test circuit having a capacitance. Control circuitry is coupled to sense the capacitance of the test circuit, and configured to inhibit operation of the emitter upon sensing a change in the capacitance that exceeds a predetermined threshold.

    Circuit substrate with embedded heat sink

    公开(公告)号:US10470307B2

    公开(公告)日:2019-11-05

    申请号:US16016610

    申请日:2018-06-24

    Applicant: Apple Inc.

    Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.

    Capacitive DOE integrity monitor
    3.
    发明申请

    公开(公告)号:US20190162691A1

    公开(公告)日:2019-05-30

    申请号:US16244127

    申请日:2019-01-10

    Applicant: Apple Inc.

    Abstract: An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

    RGBIR CAMERA MODULE
    4.
    发明公开
    RGBIR CAMERA MODULE 审中-公开

    公开(公告)号:US20240107186A1

    公开(公告)日:2024-03-28

    申请号:US18372047

    申请日:2023-09-22

    Applicant: Apple Inc.

    CPC classification number: H04N25/11 H04N25/531 H04N25/58 H04N25/75

    Abstract: Embodiments are disclosed for a single RGBIR camera module that is capable of imaging at both the visible and IR wavelengths. In some embodiments, a camera module comprises: an image sensor comprising: a microlens array; a color filter array (CFA) comprising a red filter, a blue filter, a green filter and at least one infrared (IR) filter; and a pixel array comprising pixels to convert light received through the color filter array into electrical signals; and an image signal processor (ISP) configured to: initiate capture of a first frame by reading signal pixels from the pixel array; initiate capture of a second frame by reading IR pixels from the pixel array; align the first and second frames; and extract the second frame from the first frame to generate a third enhanced frame.

    Flip-chip mounting of optoelectronic chips

    公开(公告)号:US11699715B1

    公开(公告)日:2023-07-11

    申请号:US17013599

    申请日:2020-09-06

    Applicant: Apple Inc.

    Abstract: An optoelectronic assembly includes an integrated circuit (IC) chip including, on its front side, a photoconversion region and first electrical contact pads disposed alongside the photoconversion region. A circuit substrate contains a cavity into which the IC chip is inserted through the lower side and has a window opening through the upper side in communication with the cavity such that the photoconversion region of the IC chip is exposed through the window. The circuit substrate includes electrical circuit traces, which include second electrical contact pads disposed within the cavity alongside the window so as to contact the first electrical contact pads on the front side of the IC chip within the cavity. A base includes a stiff, heat-conducting material, to which the lower side of the circuit substrate is fixed. A malleable heat-conducting layer is compressed between the rear side of the IC chip and the base.

    Mini-interconnect capacitor
    6.
    发明申请

    公开(公告)号:US20200292839A1

    公开(公告)日:2020-09-17

    申请号:US16702639

    申请日:2019-12-04

    Applicant: Apple Inc.

    Abstract: An optical module includes an enclosure and an optical output assembly mounted on the enclosure. An emitter mounted in the enclosure is configured to emit a beam of light toward the optical output assembly. A connector, which includes two conductive layers separated by a dielectric layer, has a first side connected to the enclosure and a second side connected to the optical output assembly. An electrical trace disposed on the enclosure is connected to the first side of the connector so as to define a test circuit having a capacitance. Control circuitry is coupled to sense the capacitance of the test circuit, and configured to inhibit operation of the emitter upon sensing a change in the capacitance that exceeds a predetermined threshold.

    TESTING DIFFRACTION OR DIFFUSION OF A LIGHT BEAM

    公开(公告)号:US20170160209A1

    公开(公告)日:2017-06-08

    申请号:US14957643

    申请日:2015-12-03

    Applicant: Apple Inc.

    CPC classification number: G01N21/958 G01N2201/06113

    Abstract: An apparatus for testing diffraction or diffusion of a light beam is provided. The apparatus includes a photosensitive semiconductor, shaped to define an aperture. At least one anode, and a plurality of cathodes, are coupled to the semiconductor. An optical element, configured to modify an angular spread of a light beam that traverses the optical element, is disposed within the aperture. A detector is configured to detect electric currents that pass between the cathodes and the anode in response to a portion of the light beam exiting the optical element and hitting the semiconductor. Other embodiments are also described.

    Laser Emitters with Integrated Thermal Sensors

    公开(公告)号:US20240106203A1

    公开(公告)日:2024-03-28

    申请号:US18078819

    申请日:2022-12-09

    Applicant: Apple Inc.

    CPC classification number: H01S5/423 H01S5/024 H01S5/125 H01S5/183

    Abstract: Embodiments of the disclosure relate to an optoelectronic device having an epitaxial stack, an array of laser emitters, and a thermal sensor. The epitaxial stack includes a set of epitaxial layers. The array of laser emitters is formed in the set of epitaxial layers. The thermal sensor is coupled to the epitaxial stack at a location adjacent to a laser emitter of the array of laser emitters. The optoelectronic device further includes a controller configured to receive an output of the thermal sensor and determine a temperature at a junction between an active region and an inactive region in the laser emitter by in-situ measurements.

    Active Optical Sensor Providing Near and Far Field Target Detection

    公开(公告)号:US20240004034A1

    公开(公告)日:2024-01-04

    申请号:US18195867

    申请日:2023-05-10

    Applicant: Apple Inc.

    CPC classification number: G01S7/4813 G01S17/08 G01S7/4816 G01S7/4815

    Abstract: An optical sensor module includes a module housing defining a first compartment having a first aperture and a second compartment having a second aperture, with the second aperture spaced apart from the first aperture. A set of optical emitters is disposed in the first compartment and configured to emit light through the first aperture. A first set of optical detectors is disposed in the first compartment and configured to receive a first redirected portion of the emitted light through the first aperture. A set of optical elements is disposed in the first compartment and configured to direct at least a portion of the emitted light or the first redirected portion of the emitted light. A second set of optical detectors is disposed in the second compartment and configured to receive a second redirected portion of the emitted light through the second aperture.

    Depth mapping with MPI mitigation using reference illumination pattern

    公开(公告)号:US11763472B1

    公开(公告)日:2023-09-19

    申请号:US17200832

    申请日:2021-03-14

    Applicant: Apple Inc.

    CPC classification number: G06T7/521 G01S17/894 G06T2207/10028

    Abstract: Apparatus for optical sensing includes an illumination assembly, which directs first optical radiation toward a target scene over a first range of angles and second optical radiation over at least one second range of angles, which is smaller than and contained within the first range, while modulating the optical radiation with a carrier wave having at least one predetermined carrier frequency. A detection assembly includes an array of sensing elements, which output respective signals in response to the first and the second optical radiation. Processing circuitry drives the illumination assembly to direct the first and the second optical radiation toward the target scene in alternation, and processes the signals output by the sensing elements in response to the first optical radiation in order to compute depth coordinates of points in the target scene, while correcting the computed depth coordinates in response to the second optical radiation.

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