Abstract:
Methods and apparatus for determining proper placement of a substrate upon a substrate support in a process chamber are disclosed. In some embodiments, a method for detecting substrate placement in a process chamber includes placing a substrate on a support surface of a substrate support with the process chamber; modifying a pressure within the chamber to create a detection pressure within the chamber; sensing a first temperature of the substrate support; monitoring a thermal response characteristic of the substrate support after placing the substrate on the substrate support; comparing the thermal response characteristic to a predetermined response characteristic; and determining whether the substrate is placed correctly based upon the comparison of the thermal response characteristic to the predetermined response characteristic.
Abstract:
Embodiments of a substrate support for use in a processing chamber are provided herein. In some embodiments, a substrate support includes a pedestal having an upper surface configured to accommodate a lift pin, a first annular region near an edge of the pedestal, and a second annular region disposed between the first annular region and a center of the pedestal, wherein the pedestal includes a first plurality of holes extending from the upper surface at regular intervals along the first annular region and a second plurality of holes extending from the upper surface at regular intervals along the second annular region; and a non-metal ball comprising aluminum oxide disposed in each hole of the first plurality of holes and the second plurality of holes, wherein an upper surface of each of the non-metal balls is raised with respect to the upper surface of the pedestal to define a support surface.