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公开(公告)号:US20210001520A1
公开(公告)日:2021-01-07
申请号:US16919736
申请日:2020-07-02
Applicant: APPLIED MATERIALS, INC.
Inventor: Tuck Foong KOH , Chien-Kang HSIUNG , Yueh Sheng OW , Felix DENG , Yue CUI , Nuno Yen-Chu CHEN , Ananthkrishna JUPUDI , Clinton GOH , Vinodh RAMACHANDRAN
Abstract: Methods and apparatus for curing a substrate or polymer using variable microwave frequency are provided herein. In some embodiments, a method of curing a substrate or polymer using variable microwave frequency includes: contacting a substrate or polymer with a plurality of predetermined discontinuous microwave energy bandwidths or a plurality of predetermined discontinuous microwave energy frequencies to cure the substrate or polymer.
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公开(公告)号:US20220384165A1
公开(公告)日:2022-12-01
申请号:US17333732
申请日:2021-05-28
Applicant: Applied Materials, Inc.
Inventor: Mengxue WU , Siew Kit HOI , Jay Min SOH , Yue CUI , Chul Nyoung LEE , Palaniappan CHIDAMBARAM , Jiao SONG
Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises applying a DC target voltage to a target disposed within a processing volume of a plasma processing chamber, rotating a magnet disposed above the target at a default speed to direct sputter material from the target toward a substrate support disposed within the processing volume, measuring in-situ DC voltage in the processing volume, the in-situ DC voltage different from the DC target voltage, determining if a measured in-situ DC voltage is greater than a preset value, if the measured in-situ DC voltage is less than or equal to the preset value, maintaining the magnet at the default speed, and if the measured in-situ DC voltage is greater than the preset value, rotating the magnet at a speed less than the default speed to decrease the in-situ DC voltage.
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