公开(公告)号：US20230408636A1

公开(公告)日：2023-12-21

申请号：US17876799

申请日：2022-07-29

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Kesav Kumar Sridharan ,  Navneet Gupta ,  Scott Brandenburg ,  David Zimmerman

IPC: G01S7/02 ,  B29C45/14 ,  G01S13/931 ,  H05K7/20

CPC classification number: G01S7/027 ,  B29C45/14467 ,  B29C45/14778 ,  G01S13/931 ,  H05K7/20854 ,  B29K2995/0013 ,  B29L2031/3481

Abstract: Thermal management and shielding techniques for a radar device of a vehicle, the radar device having a radar transceiver circuit and a radar-transmissive radome, include a housing formed of a thermally-conductive plastic material and configured to receive and provide shield grounding to the radar transceiver circuit, and a metal layer applied to an inner surface of the housing to provide for thermal spreading of heat energy generated by the radar transceiver circuit.

公开(公告)号：US11825593B2

公开(公告)日：2023-11-21

申请号：US17701767

申请日：2022-03-23

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Navneet Gupta ,  Kesav Kumar Sridharan ,  Scott Brandenburg

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20 ,  H01L23/498

CPC classification number: H05K1/0206 ,  H05K1/113 ,  H05K1/181 ,  H05K7/20154 ,  H01L23/49816 ,  H05K2201/066 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.

公开(公告)号：US20230415680A1

公开(公告)日：2023-12-28

申请号：US17808758

申请日：2022-06-24

Applicant: Aptiv Technologies Limited

Inventor： Shrikant Bhadri ,  Ravindra Kulkarni ,  Kesav Kumar Sridharan

IPC: B60R16/023

CPC classification number: B60R16/0239

Abstract: Described herein is an enclosure comprising at least one planar portion with an array of extruded holes disposed thereon. The holes are extruded along an axis normal to a plane of the planar portion and configured as apertures for heat transfer through the enclosure. The holes have an inner diameter and have a height along the axis relative to the plane, which provide greater stiffness to the planar portion compared to non-extruded holes. Techniques for producing enclosures with extruded holes such as this are also described. A schematic of an array of extruded holes can be generated by determining, based on a predetermined pilot hole diameter, a thickness of an associated portion of sheet metal, and a hole diameter, an extruded height usable for the extruded holes in the schematic. This may allow for simple conversion from an array of non-extruded thru holes to an array of extruded holes.