公开(公告)号：US20230408636A1

公开(公告)日：2023-12-21

申请号：US17876799

申请日：2022-07-29

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Kesav Kumar Sridharan ,  Navneet Gupta ,  Scott Brandenburg ,  David Zimmerman

IPC: G01S7/02 ,  B29C45/14 ,  G01S13/931 ,  H05K7/20

CPC classification number: G01S7/027 ,  B29C45/14467 ,  B29C45/14778 ,  G01S13/931 ,  H05K7/20854 ,  B29K2995/0013 ,  B29L2031/3481

Abstract: Thermal management and shielding techniques for a radar device of a vehicle, the radar device having a radar transceiver circuit and a radar-transmissive radome, include a housing formed of a thermally-conductive plastic material and configured to receive and provide shield grounding to the radar transceiver circuit, and a metal layer applied to an inner surface of the housing to provide for thermal spreading of heat energy generated by the radar transceiver circuit.

公开(公告)号：US20220304139A1

公开(公告)日：2022-09-22

申请号：US17805444

申请日：2022-06-03

Applicant: Aptiv Technologies Limited

Inventor： Scott Brandenburg ,  David Wayne Zimmerman

IPC: H05K1/02

Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.

公开(公告)号：US11382205B2

公开(公告)日：2022-07-05

申请号：US17023258

申请日：2020-09-16

Applicant: Aptiv Technologies Limited

Inventor： Scott Brandenburg ,  David Wayne Zimmerman

IPC: H05K1/02 ,  G01S7/02 ,  G01S13/931

Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.

公开(公告)号：US11825593B2

公开(公告)日：2023-11-21

申请号：US17701767

申请日：2022-03-23

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Navneet Gupta ,  Kesav Kumar Sridharan ,  Scott Brandenburg

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20 ,  H01L23/498

CPC classification number: H05K1/0206 ,  H05K1/113 ,  H05K1/181 ,  H05K7/20154 ,  H01L23/49816 ,  H05K2201/066 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.

公开(公告)号：US20220087006A1

公开(公告)日：2022-03-17

申请号：US17023258

申请日：2020-09-16

Applicant: Aptiv Technologies Limited

Inventor： Scott Brandenburg ,  David Wayne Zimmerman

IPC: H05K1/02 ,  G01S7/02 ,  G01S13/931

Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.

公开(公告)号：US12183972B2

公开(公告)日：2024-12-31

申请号：US17712359

申请日：2022-04-04

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Scott Brandenburg ,  David Zimmerman

IPC: H01Q13/02

Abstract: A three-dimensional (3D) horn air waveguide antenna assembly and its method of manufacture include a bottom stamped metal layer defining a set of electrical connection ports and a plurality of top stamped metal layers arranged atop the bottom stamped metal layer with a brazing material deposited between each stamped metal layer, the plurality of top stamped metal layers defining a channel area proximate to the bottom stamped metal layer, a horn air waveguide antenna area that widens from a bottom portion to a top portion, and a slot area fluidly connecting the channel and horn air waveguide antenna areas.

公开(公告)号：US20230318190A1

公开(公告)日：2023-10-05

申请号：US17712359

申请日：2022-04-04

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Scott Brandenburg ,  David Zimmerman

IPC: H01Q13/02 ,  H01Q1/12

CPC classification number: H01Q13/02 ,  H01Q1/12 ,  H01Q13/0283

Abstract: A three-dimensional (3D) horn air waveguide antenna assembly and its method of manufacture include a bottom stamped metal layer defining a set of electrical connection ports and a plurality of top stamped metal layers arranged atop the bottom stamped metal layer with a brazing material deposited between each stamped metal layer, the plurality of top stamped metal layers defining a channel area proximate to the bottom stamped metal layer, a horn air waveguide antenna area that widens from a bottom portion to a top portion, and a slot area fluidly connecting the channel and horn air waveguide antenna areas.

公开(公告)号：US11737203B2

公开(公告)日：2023-08-22

申请号：US17805444

申请日：2022-06-03

Applicant: Aptiv Technologies Limited

Inventor： Scott Brandenburg ,  David Wayne Zimmerman

IPC: H05K1/02 ,  H05K7/20 ,  G01S7/02

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  G01S7/027

Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.