LITHOGRAPHIC APPARATUS, METROLOGY SYSTEMS, ILLUMINATION SOURCES AND METHODS THEREOF

    公开(公告)号:US20230058714A1

    公开(公告)日:2023-02-23

    申请号:US17790344

    申请日:2020-12-08

    Abstract: A system includes an illumination system, an optical element, and a detector. The optical system is implemented on a substrate. The illumination system includes first and second sources and first and second generators. The illumination system generates a beam of radiation. The first and second sources generate respective first and second different wavelength bands. The first and second resonators are optically coupled to respective ones of the first and second sources and narrow respective ones of the first and second wavelength bands. The optical element directs the beam toward a target structure. The detector receives radiation from the target structure and to generate a measurement signal based on the received radiation.

    ON CHIP SENSOR FOR WAFER OVERLAY MEASUREMENT

    公开(公告)号:US20240361703A1

    公开(公告)日:2024-10-31

    申请号:US18769032

    申请日:2024-07-10

    CPC classification number: G03F7/70633 G02B6/1225 G02B26/0833

    Abstract: A sensor apparatus includes a sensor chip, an illumination system, a first optical system, a second optical system, and a detector system. The illumination system is coupled to the sensor chip and transmits an illumination beam along an illumination path. The first optical system is coupled to the sensor chip and includes a first integrated optic to configure and transmit the illumination beam toward a diffraction target on a substrate, disposed adjacent to the sensor chip, and generate a signal beam including diffraction order sub-beams generated from the diffraction target. The second optical system is coupled to the sensor chip and includes a second integrated optic to collect and transmit the signal beam from a first side to a second side of the sensor chip. The detector system is configured to measure a characteristic of the diffraction target based on the signal beam transmitted by the second optical system.

    MONOLITHIC PARTICLE INSPECTION DEVICE
    5.
    发明公开

    公开(公告)号:US20230266255A1

    公开(公告)日:2023-08-24

    申请号:US18012801

    申请日:2021-06-09

    CPC classification number: G01N21/956 G01N2021/95676

    Abstract: Systems, apparatuses, and methods are provided for detecting a particle on a substrate surface. An example method can include receiving, by a grating structure, coherent radiation from a radiation source. The method can further include generating, by the grating structure, a focused coherent radiation beam based on the coherent radiation. The method can further include transmitting, by the grating structure, the focused coherent radiation beam toward a region of a surface of a substrate. The method can further include receiving, by the grating structure, photons scattered from the region in response to illuminating the region with the focused coherent radiation beam. The method can further include measuring, by a photodetector, the photons received by the grating structure. The method can further include generating, by the photodetector and based on the measured photons, an electronic signal for detecting a particle located in the region of the surface of the substrate.

    LITHOGRAPHIC APPARATUS, METROLOGY SYSTEMS, ILLUMINATION SWITCHES AND METHODS THEREOF

    公开(公告)号:US20230213868A1

    公开(公告)日:2023-07-06

    申请号:US18012308

    申请日:2021-06-04

    CPC classification number: G03F7/70258 G03F7/7085 G03F7/70275

    Abstract: A system includes an illumination system, an optical element, a switching element and a detector. The illumination system includes a broadband light source that generates a beam of radiation. The dispersive optical element receives the beam of radiation and generates a plurality of light beams having a narrower bandwidth than the broadband light source. The optical switch receives the plurality of light 5 beams and transmits each one of the plurality of light beams to a respective one of a plurality of alignment sensor of a sensor array. The detector receives radiation returning from the sensor array and to generate a measurement signal based on the received radiation.

    OVERLAY MEASUREMENT SYSTEM USING LOCK-IN AMPLIFIER TECHNIQUE

    公开(公告)号:US20230008139A1

    公开(公告)日:2023-01-12

    申请号:US17782622

    申请日:2020-11-18

    Abstract: A detection system (200) includes an illumination system (210), a first optical system (232), a phase modulator (220), a lock-in detector (255), and a function generator (230). The illumination system is configured to transmit an illumination beam (218) along an illumination path. The first optical system is configured to transmit the illumination beam toward a diffraction target (204) on a substrate (202). The first optical system is further configured to transmit a signal beam including diffraction order sub-beams (222, 224, 226) that are diffracted by the diffraction target. The phase modulator is configured to modulate the illumination beam or the signal beam based on a reference signal. The lock-in detector is configured to collect the signal beam and to measure a characteristic of the diffraction target based on the signal beam and the reference signal. The function generator is configured to generate the reference signal for the phase modulator and the lock-in detector.

    INTENSITY MEASUREMENTS USING OFF-AXIS ILLUMINATION

    公开(公告)号:US20250130512A1

    公开(公告)日:2025-04-24

    申请号:US18682678

    申请日:2022-07-21

    Abstract: Systems, apparatuses, and methods are provided for measuring intensity using off-axis illumination. An example method can include illuminating a region of a surface of a substrate with a first radiation beam at a first incident angle and, in response, measuring a first set of photons diffracted from the region. The example method can further include illuminating the region with a second radiation beam at a second incident angle and, in response, measuring a second set of photons diffracted from the region. The example method can further include generating measurement data for the region based on the measured first set of photons and the measured second set of photons.

    ON CHIP SENSOR FOR WAFER OVERLAY MEASUREMENT

    公开(公告)号:US20220283516A1

    公开(公告)日:2022-09-08

    申请号:US17637942

    申请日:2020-08-05

    Abstract: A sensor apparatus includes a sensor chip, an illumination system, a first optical system, a second optical system, and a detector system. The illumination system is coupled to the sensor chip and transmits an illumination beam along an illumination path. The first optical system is coupled to the sensor chip and includes a first integrated optic to configure and transmit the illumination beam toward a diffraction target on a substrate, disposed adjacent to the sensor chip, and generate a signal beam including diffraction order sub-beams generated from the diffraction target. The second optical system is coupled to the sensor chip and includes a second integrated optic to collect and transmit the signal beam from a first side to a second side of the sensor chip. The detector system is configured to measure a characteristic of the diffraction target based on the signal beam transmitted by the second optical system.

Patent Agency Ranking