公开(公告)号：US20220377161A1

公开(公告)日：2022-11-24

申请号：US17324958

申请日：2021-05-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Chung Ju YU ,  Jui-Hsien WANG ,  Chai-Chi LIN ,  Hong Jie CHEN

IPC: H04M1/02 ,  H01L23/498 ,  H01L25/16

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.

公开(公告)号：US20220373670A1

公开(公告)日：2022-11-24

申请号：US17324965

申请日：2021-05-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Chung Ju YU ,  Wei-Fan WU ,  Chai-Chi LIN ,  Hong Jie CHEN

IPC: G01S13/58 ,  H01L25/16 ,  H01Q1/27

Abstract: At least some embodiments of the present disclosure relate to a wearable device. The wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically connected to the detecting module. The control module is configured to receive a signal from the detecting module and to control the wearable device in response to the signal.

公开(公告)号：US20240356197A1

公开(公告)日：2024-10-24

申请号：US18137391

申请日：2023-04-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Weifan WU ,  Yong-Chang SYU ,  Chung Ju YU

IPC: H01Q1/22 ,  H01L23/498 ,  H01Q9/04 ,  H01Q21/00

CPC classification number: H01Q1/2283 ,  H01L23/49811 ,  H01Q9/0407 ,  H01Q21/00 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01Q9/0421

Abstract: The present disclosure provides an electronic device, which includes an encapsulant, an electronic component, an antenna structure, and a first conductive element. The electronic component is disposed in the encapsulant. The antenna structure has an antenna pattern exposed to air and facing the encapsulant, and a first supporting element separating the antenna pattern from the encapsulant. At least a portion of the first conductive element is within the encapsulant, and electrically connects the antenna pattern to the electronic component by the first supporting element.

公开(公告)号：US20230216174A1

公开(公告)日：2023-07-06

申请号：US17566573

申请日：2021-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung Ju YU ,  Shao-Lun YANG ,  Chun-Hung YEH ,  Hong Jie CHEN ,  Tsung-Wei LU ,  Wei Shuen KAO

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L23/3128 ,  H01L21/561 ,  H01L2223/6677 ,  H01Q13/18

Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.