公开(公告)号：US11769712B2

公开(公告)日：2023-09-26

申请号：US17334564

申请日：2021-05-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiao-Yen Lee ,  Hung-Yi Lin

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/522 ,  H01L23/00 ,  H01L25/10 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/481 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5223 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/107 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/182

Abstract: A semiconductor package structure includes a first electronic component, a conductive element and a first redistribution structure. The first electronic component has a first surface and a second surface opposite to the first surface, and includes a first conductive via. The first conductive via has a first surface exposed from the first surface of the first electronic component. The conductive element is disposed adjacent to the first electronic component. The conductive element has a first surface substantially coplanar with the first surface of the first conductive via of the first electronic component. The first redistribution structure is configured to electrically connect the first conductive via of the first electronic component and the conductive element.

公开(公告)号：US11806710B2

公开(公告)日：2023-11-07

申请号：US16893150

申请日：2020-06-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiao-Yen Lee ,  Ying-Te Ou ,  Chin-Cheng Kuo ,  Chung Hao Chen

IPC: B01L3/00 ,  H01L23/538 ,  H01L21/02

CPC classification number: B01L3/502738 ,  H01L21/02 ,  H01L23/5386

Abstract: A semiconductor package structure includes a substrate, a die and a conductive structure. The die is disposed on or within the substrate. The die has a first surface facing away from the substrate and includes a sensing region and a pad at the first surface of the die. The first surface of the die has a first edge and a second edge opposite to the first edge. The sensing region is disposed adjacent to the first edge. The pad is disposed away from the first edge. The conductive structure electrically connects the pad and the substrate. The sensing region has a first end distal to the first edge of the first surface of the die. A distance from the first end of the sensing region to a center of the pad is equal to or greater than a distance from the first end of the sensing region to the first edge of the first surface of the die.