公开(公告)号：US20190080975A1

公开(公告)日：2019-03-14

申请号：US15701394

申请日：2017-09-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan LEE ,  Sung-Mao LI ,  Ming-Han WANG ,  Ian HU

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor device package includes a semiconductor device, a conductive bump, a first encapsulant and a second encapsulant. The semiconductor device has a first surface, a second surface and a lateral surface. The second surface is opposite to the first surface. The lateral surface extends between the first surface and the second surface. The semiconductor device comprises a conductive pad adjacent to the first surface of the semiconductor device. The conductive bump is electrically connected to the conductive pad. The first encapsulant covers the first surface of the semiconductor device and a first portion of the lateral surface of the semiconductor device, and surrounds the conductive bump. The second encapsulant covers the second surface of the semiconductor device and a second portion of the lateral surface of the semiconductor device.

公开(公告)号：US20160240493A1

公开(公告)日：2016-08-18

申请号：US14625383

申请日：2015-02-18

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Wei-Hsuan LEE ,  Sung-Mao LI ,  Chien-Yeh LIU

IPC: H01L23/66 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L21/76838 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a semiconductor device, a plurality of electronic components, a first package body, a patterned conductive layer and a feeding element. The semiconductor device and the plurality of electronic components are disposed on the substrate. The first package body covers the semiconductor device but exposes the plurality of electronic components. The patterned conductive layer is formed on the first package body. The feeding element electrically connects the patterned conductive layer to the plurality of electronic components.

Abstract translation: 本公开涉及半导体器件封装。 半导体器件封装包括衬底，半导体器件，多个电子部件，第一封装体，图案化导电层和馈电元件。 半导体器件和多个电子部件设置在基板上。 第一封装体覆盖半导体器件，但暴露多个电子部件。 图案化的导电层形成在第一封装主体上。 馈电元件将图案化导电层电连接到多个电子部件。