公开(公告)号：US11410899B2

公开(公告)日：2022-08-09

申请号：US16751139

申请日：2020-01-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/00 ,  H01Q19/10 ,  H01Q13/10 ,  H01L23/10 ,  H01Q21/06

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

公开(公告)号：US10381300B2

公开(公告)日：2019-08-13

申请号：US15362548

申请日：2016-11-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Chieh Kao ,  Chang-Lin Yeh ,  Yi Chen ,  Sung-Hung Chiang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/02 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538

Abstract: A semiconductor device package includes a substrate, a package body, a via and an interconnect. The substrate includes a surface and a pad on the first surface. The package body covers at least a portion of the surface of the substrate. The via is disposed in the package body and includes a conductive layer and a first intermediate layer. The conductive layer is electrically connected with the pad. The first intermediate layer is adjacent to the conductive layer. The interconnect is disposed on the first intermediate layer.

公开(公告)号：US20180226314A1

公开(公告)日：2018-08-09

申请号：US15884313

申请日：2018-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q13/10 ,  H01Q19/10 ,  H01L23/00

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

公开(公告)号：US12087652B2

公开(公告)日：2024-09-10

申请号：US17884515

申请日：2022-08-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/10 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q13/10 ,  H01Q19/10 ,  H01Q21/06

CPC classification number: H01L23/3114 ,  H01L23/10 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/13 ,  H01L24/73 ,  H01L24/85 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q13/10 ,  H01Q19/10 ,  H01Q21/061 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15321 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

公开(公告)号：US10535612B2

公开(公告)日：2020-01-14

申请号：US15844415

申请日：2017-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor device package includes a substrate, a first electronic component, a first package body, an electrical contact and a first conductive layer. The substrate has a first surface, a second surface and a lateral surface extending between the first surface and the second surface. The first electronic component is disposed on the first surface of the substrate. The first package body encapsulates the first electronic component. The electrical contact is disposed on the second surface of the substrate. The first conductive layer includes a first portion and a second portion. The first portion is disposed on the first package body and the lateral surface of the substrate. The second portion contacts the electrical contact.

公开(公告)号：US11296034B2

公开(公告)日：2022-04-05

申请号：US16905912

申请日：2020-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hao Chang ,  Yi Chen

IPC: H01L23/34 ,  H01L23/48 ,  H01L23/28 ,  H01L21/00 ,  H05K1/00 ,  H05K7/00 ,  H05K1/14 ,  H01L23/538 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065

Abstract: A substrate, a semiconductor package, and a method of manufacturing the same are provided. The substrate includes an interposer element. The interposer element has a first surface and a second surface opposite to the first surface. At least two rows of pads are disposed adjacent to the first surface of the interposer element. The interposer element includes at least one slot disposed between the two rows of pads and extending from the first surface to the second surface, wherein a projection area extending from an edge of the slot to an edge of the first surface of the interpose element is nonoverlapping at least one pad.

公开(公告)号：US10580713B2

公开(公告)日：2020-03-03

申请号：US15884313

申请日：2018-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Chen ,  Chang-Lin Yeh ,  Jen-Chieh Kao

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/00 ,  H01Q19/10 ,  H01Q13/10

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.