公开(公告)号：US11804461B2

公开(公告)日：2023-10-31

申请号：US17473829

申请日：2021-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Ping Tsai ,  Ming-Chi Liu ,  Yu-Ting Lu ,  Kai-Chiang Hsu ,  Che-Ting Liu

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L23/538

CPC classification number: H01L24/24 ,  H01L21/565 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/19 ,  H01L24/25 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68381 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/19102 ,  H01L2924/35121

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.