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公开(公告)号：US20240352174A1
公开(公告)日：2024-10-24
申请号：US18604216
申请日：2024-03-13
Applicant: Align Technology, Inc.
Inventor： Umesh Upendra Choudhary , Raymond Bao Thai
IPC: C08F291/00 , A61C7/08 , B29C64/124 , B29K96/02 , B29L31/00 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C08F2/50 , C08J5/18 , C08K5/23
CPC classification number: C08F291/00 , A61C7/08 , B29C64/124 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C08F2/50 , C08J5/18 , C08K5/23 , B29K2096/02 , B29L2031/753 , C08J2351/00
Abstract: The present disclosure provides cross-linker compounds that can produce desirable polymeric materials, polymer compositions, and/or photo-curable resins. Further provided herein are methods of producing cross-linker compounds, compositions, resins, devices, and polymeric materials. Also provided herein are methods of using cross-linker compounds, resins, and polymeric materials for the fabrication (e.g., via 3D printing) of medical devices, such as orthodontic appliances.
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公开(公告)号：US20230121648A1
公开(公告)日：2023-04-20
申请号：US17963958
申请日：2022-10-11
Applicant: Align Technology, Inc.
Inventor： Viswanath Meenakshisundaram , Peter Dorfinger , Umesh Upendra Choudhary , Michael Christopher Cole
IPC: B29C64/214 , B29C64/124 , B29C64/245 , B29C64/393 , B33Y30/00 , B33Y50/02
Abstract: A system includes a carrier film including an outer surface and an inner surface. The inner surface is configured to contact rollers. The system further includes a first blade configured to form a layer of resin on the outer surface of the carrier film. The system further includes a second blade configured to prevent printed features from contacting the first blade. The system further includes a build platform. A portion of the layer of resin is to be added to an object being formed on the build platform.
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公开(公告)号：US20250108562A1
公开(公告)日：2025-04-03
申请号：US18902485
申请日：2024-09-30
Applicant: Align Technology, Inc.
IPC: B29C64/30 , B29C64/124 , B29C64/188 , B29C71/00 , B29C71/04 , B29L31/00 , B33Y10/00 , B33Y40/20 , B33Y80/00
Abstract: Methods for stabilizing additively manufactured objects are provided. In some embodiments, a method includes fabricating an object from at least one curable material using an additive manufacturing process, where the object has a maximum thickness no greater than 5 mm. The method can include surrounding the object with a packing material, where the packing material spatially constrains the object to inhibit deformation of the object. The method can further include applying energy to the object while the object is surrounded by the packing material, where the energy alters at least one material property of the object.
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公开(公告)号：US12049528B2
公开(公告)日：2024-07-30
申请号：US17728900
申请日：2022-04-25
Applicant: Align Technology, Inc.
Inventor： Umesh Upendra Choudhary , Jessica Kalay Su , Michael Christopher Cole , Jennifer Marie Chavez
IPC: C08F2/46 , C08F2/50 , C08F220/12 , C08F220/30 , C08G61/04 , A61C7/00 , B33Y70/00 , B33Y80/00
CPC classification number: C08F220/12 , C08F2/50 , C08F220/301 , C08F220/302 , A61C7/00 , B33Y70/00 , B33Y80/00
Abstract: Provided herein are curable compositions for use in a high temperature lithography-based photopolymerization process, and telechelic block polymers and methods of using such polymers in curable compositions to produce medical devices such as orthodontic appliances comprising the polymeric compositions comprising the telechelic block polymers.
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公开(公告)号：US12208577B2
公开(公告)日：2025-01-28
申请号：US17963964
申请日：2022-10-11
Applicant: Align Technology, Inc.
Inventor： Viswanath Meenakshisundaram , Peter Dorfinger , Umesh Upendra Choudhary , Michael Christopher Cole
IPC: B29C64/214 , A61C7/08 , A61C7/10 , B29C64/124 , B29C64/223 , B29C64/245 , B29C64/255 , B29C64/321 , B29C64/393 , B33Y30/00 , B33Y40/00 , B33Y50/02 , B29L31/00 , B33Y80/00
Abstract: A system includes a partial enclosure configured to hold resin. The system further includes one or more structures configured to at least partially cover the resin. The one or more structures are configured to prevent evaporation of the resin. The system further includes a build platform configured to support an object that is being formed from layers of the resin. A first blade is configured to provide the layers of the resin to form the object on the build platform.
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Patent Agency Ranking
公开(公告)号：US11939287B2
公开(公告)日：2024-03-26
申请号：US17849171
申请日：2022-06-24
Applicant: Align Technology, Inc.
Inventor： Umesh Upendra Choudhary
Abstract: The present disclosure provides methods and processes for the recovery of compounds (e.g., pendant groups) from polymeric materials, as well as methods for recycling and reusing such compounds by synthetically converting a recovered compound to building blocks that can be used in, e.g., curable resins for the fabrication of new devices, such as medical devices (e.g., orthodontic appliances).
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公开(公告)号：US20250017695A1
公开(公告)日：2025-01-16
申请号：US18771664
申请日：2024-07-12
Applicant: Align Technology, Inc.
Inventor： Jun Sato , Yuxiang Wang , Umesh Upendra Choudhary , Viswanath Meenakshisundaram , Chunhua Li
IPC: A61C7/00 , B22F10/14 , B22F10/18 , B22F10/80 , B29C64/124 , B29C64/386 , B29L31/00 , B33Y10/00 , B33Y50/00 , B33Y80/00
Abstract: Methods for additive manufacturing of polymer and metal dental appliances are provided. In some embodiments, a method includes receiving a digital representation of a dental appliance including a first portion to be formed from a polymeric material and a second portion to be formed from a metallic material. The method can include fabricating the dental appliance using an additive manufacturing process. The additive manufacturing process can include depositing a first composition including a precursor of the polymeric material at the first portion of the dental appliance, and depositing a second composition including a plurality of metal particles at the second portion of the dental appliance.
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公开(公告)号：US20230123480A1
公开(公告)日：2023-04-20
申请号：US17963964
申请日：2022-10-11
Applicant: Align Technology, Inc.
Inventor： Viswanath Meenakshisundaram , Peter Dorfinger , Umesh Upendra Choudhary , Michael Christopher Cole
IPC: B29C64/255 , B29C64/245 , B29C64/214 , B29C64/223 , B29C64/321 , B33Y30/00 , B33Y40/00
Abstract: A system includes a partial enclosure configured to hold resin. The system further includes one or more structures configured to at least partially cover the resin. The one or more structures are configured to prevent evaporation of the resin. The system further includes a build platform configured to support an object that is being formed from layers of the resin. A first blade is configured to provide the layers of the resin to form the object on the build platform.
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公开(公告)号：US20220363792A1
公开(公告)日：2022-11-17
申请号：US17728900
申请日：2022-04-25
Applicant: Align Technology, Inc.
Inventor： Umesh Upendra Choudhary , Jessica Kalay Su , Michael Christopher Cole , Jennifer Marie Chavez
IPC: C08F220/12
Abstract: Provided herein are curable compositions for use in a high temperature lithography-based photopolymerization process, and telechelic block polymers and methods of using such polymers in curable compositions to produce medical devices such as orthodontic appliances comprising the polymeric compositions comprising the telechelic block polymers.
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公开(公告)号：US20250009476A1
公开(公告)日：2025-01-09
申请号：US18654887
申请日：2024-05-03
Applicant: Align Technology, Inc.
Inventor： Michael Christopher Cole , Xiance Wang , Umesh Upendra Choudhary , Kejia Yang
Abstract: The present disclosure provides polymeric materials comprising semicrystalline sulfur-containing polymers, methods and curable compositions for making the same, and orthodontic appliances made from said polymeric materials.
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