Control knob
    2.
    发明授权
    Control knob 失效
    控制旋钮

    公开(公告)号:US5050269A

    公开(公告)日:1991-09-24

    申请号:US634947

    申请日:1990-12-28

    IPC分类号: G05G1/12 H01H3/10

    摘要: A knob (100) comprises an inner portion (105) made of a nonmetallic material and an outer portion (102) molded over the inner portion (105). The outer portion (102) comprises a material having a reduced hardness factor with respect to the inner portion (105).

    摘要翻译: 旋钮(100)包括由非金属材料制成的内部部分(105)和在内部部分(105)上模制的外部部分(102)。 外部部分(102)包括相对于内部部分(105)具有降低的硬度因子的材料。

    Programmable electronic device
    3.
    发明授权
    Programmable electronic device 失效
    可编程电子设备

    公开(公告)号:US4984295A

    公开(公告)日:1991-01-08

    申请号:US483973

    申请日:1990-02-20

    IPC分类号: H04B1/38 H04M1/725

    摘要: The programmable electronic device, such as a radio, includes a memory for storing program information. A controller, such as a microprocessor, is connected to the memory for programming and reading the memory. A keypad is provided for data entry and is connected to the microprocessor. A magnetic switch, such as a Hall effect switch, is located within the radio and controls the program enable line of the microprocessor. The Hall effect switch is actuated by an externally supplied magnetic field for enabling programming of the memory of the radio.

    摘要翻译: 诸如无线电的可编程电子设备包括用于存储节目信息的存储器。 诸如微处理器的控制器连接到存储器,用于对存储器进行编程和读取。 提供用于数据输入的键盘并连接到微处理器。 诸如霍尔效应开关的磁性开关位于无线电内,并控制微处理器的程序使能线。 霍尔效应开关由外部提供的磁场启动,用于对无线电的存储器进行编程。

    Shielded low-profile electronic component assembly
    4.
    发明授权
    Shielded low-profile electronic component assembly 失效
    屏蔽薄型电子元器件组件

    公开(公告)号:US5153379A

    公开(公告)日:1992-10-06

    申请号:US594448

    申请日:1990-10-09

    摘要: A shielded low-profile electronic component assembly 100 providing shielding for electronic components is disclosed which includes a substrate 124, and shield 102. In a first embodiment the shield 102 is chamfered at each shield corner 110 and is attached to the substrate 124 at ground pad patterns 114, which are found at each corner of the substrate 124 on surface 128. A ground paddle 120 is also located in substrate 124 which lies substantially underneath the electronic component 112, and is utilized in maximizing shielding. In an alternate embodiment a substrate 124 is overmolded with encapsulation material 302 after the electronic component 112 is affixed to the substrate 124, with each of the encapsulation material corners 306 being chamfered exposing ground pads 114. The metallized shield 310 is then placed over the overmolded encapsulant and attached to the substrate 124 at ground pad patterns 114. The overmolded encapsulant 302 adding protection to the electronic component 112. In a third embodiment the metallized shield is slightly smaller in area than the substrate 124 and is attached at each of the four ground pads 114, with the shield edges 204 resting on substrate 124.

    摘要翻译: 公开了一种屏蔽薄型电子部件组件100,其提供用于电子部件的屏蔽,其包括基板124和屏蔽102.在第一实施例中,屏蔽102在每个屏蔽角110处被倒角,并且在接地垫处附接到基板124 图案114,其位于表面128上的基底124的每个角落处。接地片120还位于基本上位于电子部件112下方的衬底124中,并且用于使屏蔽最大化。 在替代实施例中,在电子部件112固定到基板124上之后,衬底124被包封模制,其中每个封装材料角306被倒角暴露接地焊盘114.金属化屏蔽310然后被放置在包覆成型 密封剂并且在接地焊盘图案114处附接到基板124上。包覆成型的密封剂302将保护附加到电子部件112.在第三实施例中,金属化屏蔽件的面积比衬底124稍小一些,并且附接在四个地面 垫114,其中屏蔽边缘204搁置在基底124上。