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公开(公告)号:US20240021986A1
公开(公告)日:2024-01-18
申请号:US17867504
申请日:2022-07-18
Applicant: Apple Inc.
Inventor: Alden T Rush , Soroush Akbarzadeh , Hongfei Hu , Han Wang , Javier Gomez Tagle , Ming Chen , Carlo Di Nallo , Mattia Pascolini , Erdinc Irci , Ali Pourghorban Saghati
Abstract: An electronic device may include an antenna disposed on a substrate. The antenna may include a ring of conductive traces, a fed arm, and an unfed arm. The fed arm and the unfed arm may extend from opposing segments of the ring. The ring may be coupled to ground by fences of conductive vias extending through the substrate. The first arm may have a first radiating edge. The second arm may have a second radiating edge. The first radiating edge may be separated from the second radiating edge by a gap. The first arm may indirectly feed the second arm via near-field electromagnetic coupling across the gap. The first and second arms may collectively radiate in an ultra-wideband (UWB) frequency band.
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公开(公告)号:US11990687B2
公开(公告)日:2024-05-21
申请号:US17867504
申请日:2022-07-18
Applicant: Apple Inc.
Inventor: Alden T Rush , Soroush Akbarzadeh , Hongfei Hu , Han Wang , Javier Gomez Tagle , Ming Chen , Carlo Di Nallo , Mattia Pascolini , Erdinc Irci , Ali Pourghorban Saghati
Abstract: An electronic device may include an antenna disposed on a substrate. The antenna may include a ring of conductive traces, a fed arm, and an unfed arm. The fed arm and the unfed arm may extend from opposing segments of the ring. The ring may be coupled to ground by fences of conductive vias extending through the substrate. The first arm may have a first radiating edge. The second arm may have a second radiating edge. The first radiating edge may be separated from the second radiating edge by a gap. The first arm may indirectly feed the second arm via near-field electromagnetic coupling across the gap. The first and second arms may collectively radiate in an ultra-wideband (UWB) frequency band.
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公开(公告)号:US20250087868A1
公开(公告)日:2025-03-13
申请号:US18464969
申请日:2023-09-11
Applicant: Apple Inc.
Inventor: Alden T Rush , Salih Yarga , Joel Ravi , Woonyong Bae , Laura M Burke , Bhaskara R Rupakula , Haozhan Tian , Erdinc Irci , Hongfei Hu , Carlo Di Nallo
Abstract: An electronic device may be provided with a housing having sidewalls, a dielectric cover, and a conductive plate. A display may be mounted to the sidewalls opposite the dielectric cover. A logic board may be interposed between the display and the plate. The device may include a phased antenna array on a first module and an ultra-wideband (UWB) on a second module. The first and second modules may be surface-mounted to the main body of a flexible printed circuit between the plate and the dielectric cover. The UWB antenna and the array may convey radio-frequency signals through the dielectric cover. The flexible printed circuit may have a tail that carries the transmission lines for the UWB antenna and the array. The tail may be folded through a hole in the mid-chassis and coupled to a radio-frequency connector on the logic board.
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公开(公告)号:US20240079761A1
公开(公告)日:2024-03-07
申请号:US18458835
申请日:2023-08-30
Applicant: Apple Inc.
Inventor: Jingni Zhong , Ming Chen , Han Wang , Alden T Rush , Behnam Ghassemiparvin , Bhaskara R Rupakula , Yiren Wang , Yuan Tao , Hao Xu , Jennifer M Edwards , Hongfei Hu , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/48 , H01Q9/0407
Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.
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公开(公告)号:US20250112374A1
公开(公告)日:2025-04-03
申请号:US18477974
申请日:2023-09-29
Applicant: Apple Inc.
Inventor: Sai Kiran Doddalla , Alden T Rush , Han Wang , Yiren Wang , Thomas W Yang , Hao Xu , Carlo Di Nallo , Mattia Pascolini
Abstract: An electronic device may be provided with an antenna that radiates through a rear housing wall in multiple frequency bands. The antenna may have one or more directly fed patches and one or more indirectly fed patches that are indirectly fed by the directly fed patch(es). One or more of the patches may be shorted to ground traces through the substrate using conductive vias. The antenna may be provided with a dielectric block mounted to the substrate. The patches may be sandwiched between the substrate and the dielectric block. The dielectric block may have a higher dielectric constant than the substrate. The dielectric block may contribute one or more dielectric resonator antenna (DRA) modes to the resonances of the antenna. In these implementations, the patches in the antenna resonating element may form a feed probe for the dielectric block.
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公开(公告)号:US20250112354A1
公开(公告)日:2025-04-03
申请号:US18477872
申请日:2023-09-29
Applicant: Apple Inc.
Inventor: Seyed Mohammad Amjadi , Yiren Wang , Sidharath Jain , Victor C Lee , Mattia Pascolini , Alden T Rush , Yuan Tao , Hao Xu , Carlo Di Nallo
Abstract: An electronic device may be provided with peripheral conductive housing structures and a rear housing wall. The electronic device may have a display mounted to the peripheral conductive housing structures opposite the rear housing wall. The rear housing wall may have a dielectric cover layer and a conductive support plate that extends along the dielectric cover layer. The electronic device may have an antenna that radiates through the dielectric cover layer. The antenna may have a slot antenna resonating element that includes a first slot between the support plate and the peripheral structures and may include a second slot extending from the first slot into the support plate. A conductive interconnect may couple the support plate to the peripheral conductive housing structures at an end of the first slot. The antenna may be fed at a feed protrusion that extends into the second slot.
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