Electronic Device with Folded Antenna Module

    公开(公告)号:US20250087868A1

    公开(公告)日:2025-03-13

    申请号:US18464969

    申请日:2023-09-11

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a housing having sidewalls, a dielectric cover, and a conductive plate. A display may be mounted to the sidewalls opposite the dielectric cover. A logic board may be interposed between the display and the plate. The device may include a phased antenna array on a first module and an ultra-wideband (UWB) on a second module. The first and second modules may be surface-mounted to the main body of a flexible printed circuit between the plate and the dielectric cover. The UWB antenna and the array may convey radio-frequency signals through the dielectric cover. The flexible printed circuit may have a tail that carries the transmission lines for the UWB antenna and the array. The tail may be folded through a hole in the mid-chassis and coupled to a radio-frequency connector on the logic board.

    Impedance Transitions Between Boards for Antennas

    公开(公告)号:US20240079761A1

    公开(公告)日:2024-03-07

    申请号:US18458835

    申请日:2023-08-30

    Applicant: Apple Inc.

    CPC classification number: H01Q1/243 H01Q1/48 H01Q9/0407

    Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.

    Antennas with Directly and Indirectly Fed Patches

    公开(公告)号:US20250112374A1

    公开(公告)日:2025-04-03

    申请号:US18477974

    申请日:2023-09-29

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with an antenna that radiates through a rear housing wall in multiple frequency bands. The antenna may have one or more directly fed patches and one or more indirectly fed patches that are indirectly fed by the directly fed patch(es). One or more of the patches may be shorted to ground traces through the substrate using conductive vias. The antenna may be provided with a dielectric block mounted to the substrate. The patches may be sandwiched between the substrate and the dielectric block. The dielectric block may have a higher dielectric constant than the substrate. The dielectric block may contribute one or more dielectric resonator antenna (DRA) modes to the resonances of the antenna. In these implementations, the patches in the antenna resonating element may form a feed probe for the dielectric block.

    Electronic Device Having Support Plate Antenna

    公开(公告)号:US20250112354A1

    公开(公告)日:2025-04-03

    申请号:US18477872

    申请日:2023-09-29

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with peripheral conductive housing structures and a rear housing wall. The electronic device may have a display mounted to the peripheral conductive housing structures opposite the rear housing wall. The rear housing wall may have a dielectric cover layer and a conductive support plate that extends along the dielectric cover layer. The electronic device may have an antenna that radiates through the dielectric cover layer. The antenna may have a slot antenna resonating element that includes a first slot between the support plate and the peripheral structures and may include a second slot extending from the first slot into the support plate. A conductive interconnect may couple the support plate to the peripheral conductive housing structures at an end of the first slot. The antenna may be fed at a feed protrusion that extends into the second slot.

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