公开(公告)号：US09955570B2

公开(公告)日：2018-04-24

申请号：US14975581

申请日：2015-12-18

Applicant: Apple Inc.

Inventor： Matthew W. Blum ,  Christine A. Laliberte ,  Corey N. Axelowitz ,  James Y. Yap

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K5/00 ,  H05K1/11 ,  H05K9/00 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/118 ,  H05K1/14 ,  H05K1/147 ,  H05K1/181 ,  H05K1/189 ,  H05K5/0247 ,  H05K2201/05 ,  H05K2201/056 ,  H05K2201/0715

Abstract: The subject matter of this disclosure relates to a flexible circuit for carrying a signal between electrical components that includes boosting circuitry for mitigating the effects of signal degradation. More particularly the flexible circuit can carry a signal between a main logic board and an input/output board supporting input/output ports of a portable electronic device. The flexible circuit can be configured with bends in order to meet packaging constraints such as avoiding contact with components obstructing a direct path between connectors of the electrical components. Additional bends can also be included in the flexible that facilitate the assembly of the portable electronic device.

公开(公告)号：US09991616B2

公开(公告)日：2018-06-05

申请号：US15158389

申请日：2016-05-18

Applicant: Apple Inc.

Inventor： Corey N. Axelowitz ,  William A. Tashman ,  James Y. Yap

IPC: H01R12/00 ,  H01R12/79 ,  H01R12/72 ,  H01R43/02

CPC classification number: H01R12/79 ,  G06F1/1613 ,  H01R12/62 ,  H01R12/721 ,  H01R43/0256 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/094

Abstract: The described embodiments relate generally to methods and apparatus for securely and efficiently joining components together. In some embodiments, a flexible printed circuit board and a rigid printed circuit board can be electrically coupled together by soldering electrical contacts distributed on the flexible printed circuit board to electrical contacts distributed on the rigid printed circuit board. The electrical contacts can be arranged and sized as desired to provide a desired amount of data and power transfer bandwidth.

公开(公告)号：US20170271799A1

公开(公告)日：2017-09-21

申请号：US15158389

申请日：2016-05-18

Applicant: Apple Inc.

Inventor： Corey N. Axelowitz ,  William A. Tashman ,  James Y. Yap

IPC: H01R12/79 ,  H01R43/02 ,  H01R12/72

CPC classification number: H01R12/79 ,  G06F1/1613 ,  H01R12/62 ,  H01R12/721 ,  H01R43/0256 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/094

Abstract: The described embodiments relate generally to methods and apparatus for securely and efficiently joining components together. In some embodiments, a flexible printed circuit board and a rigid printed circuit board can be electrically coupled together by soldering electrical contacts distributed on the flexible printed circuit board to electrical contacts distributed on the rigid printed circuit board. The electrical contacts can be arranged and sized as desired to provide a desired amount of data and power transfer bandwidth.