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1.发明申请公开(公告)号：US20170089783A1
公开(公告)日：2017-03-30
申请号：US15373360
申请日：2016-12-08
Applicant: Apple Inc.
Inventor： Caleb C. Han , Tongbi Jiang , Jun Zhai
CPC classification number: G01L7/08 , B81B7/0048 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C2203/0792 , G01L9/0045 , G01L9/0048 , G01L19/0618 , G01L19/146 , G01L19/148 , H01L41/094 , H01L41/1136 , H01L2224/16225 , H01L2224/32145 , H01L2224/48095 , H01L2224/73204 , H01L2224/73265 , H01L2224/94 , H01L2924/1461 , H01L2924/16151 , H01L2924/16195
Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
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公开(公告)号：US20160340175A1
公开(公告)日：2016-11-24
申请号：US15226824
申请日：2016-08-02
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
Abstract translation: 描述了MEMS封装，模块和制造方法。 在一个实施例中，MEMS封装包括安装在表面安装基板的正面上的MEMS管芯和IC管芯，以及在表面安装基板的前侧封装IC管芯和MEMS管芯的模塑料。 在一个实施例中，在表面安装基板的背侧上的着陆焊盘布置形成并固定平面区域，用于将表面安装基板粘合到不直接在MEMS管芯下方的模块基板。
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公开(公告)号：US20160137488A1
公开(公告)日：2016-05-19
申请号：US14543468
申请日：2014-11-17
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jun Zhai
CPC classification number: B81B7/0048 , B81B2207/012 , B81C1/00325 , B81C2203/0154
Abstract: MEMS packages and modules are described. In an embodiment, a module includes a package mounted within an opening in a module board. The package includes a flexible wiring board mounted to a back surface of the module board and spanning across the opening in the module board. A die is mounted on the flexible wiring board and is encapsulated within an overmold. An air gap exists laterally between the overmold and side surface of the opening in the module board.
Abstract translation: 描述了MEMS封装和模块。 在一个实施例中，模块包括安装在模块板中的开口内的封装。 该封装包括安装到模块板的背面并横跨模块板的开口的柔性布线板。 模具安装在柔性布线板上并被封装在包覆模制中。 在模块板的开口的包覆模制和侧表面之间横向存在气隙。
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公开(公告)号：US09624093B2
公开(公告)日：2017-04-18
申请号：US14543468
申请日：2014-11-17
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jun Zhai
CPC classification number: B81B7/0048 , B81B2207/012 , B81C1/00325 , B81C2203/0154
Abstract: MEMS packages and modules are described. In an embodiment, a module includes a package mounted within an opening in a module board. The package includes a flexible wiring board mounted to a back surface of the module board and spanning across the opening in the module board. A die is mounted on the flexible wiring board and is encapsulated within an overmold. An air gap exists laterally between the overmold and side surface of the opening in the module board.
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公开(公告)号：US09446941B2
公开(公告)日：2016-09-20
申请号：US14568845
申请日：2014-12-12
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
Abstract translation: 描述了MEMS封装，模块和制造方法。 在一个实施例中，MEMS封装包括安装在表面安装基板的正面上的MEMS管芯和IC管芯，以及在表面安装基板的前侧封装IC管芯和MEMS管芯的模塑料。 在一个实施例中，在表面安装基板的背侧上的着陆焊盘布置形成并固定平面区域，用于将表面安装基板粘合到不直接在MEMS管芯下方的模块基板。
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Patent Agency Ranking
6.发明授权公开(公告)号：US10041847B2
公开(公告)日：2018-08-07
申请号：US15373360
申请日：2016-12-08
Applicant: Apple Inc.
Inventor： Caleb C. Han , Tongbi Jiang , Jun Zhai
IPC: G01L7/08 , B81B7/00 , H01L41/09 , H01L41/113 , B81C1/00
Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
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公开(公告)号：US09656856B2
公开(公告)日：2017-05-23
申请号：US15226824
申请日：2016-08-02
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
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8.发明授权Various stress free sensor packages using wafer level supporting die and air gap technique 有权各种无压力传感器封装采用晶圆级支撑模和气隙技术公开(公告)号：US09574959B2
公开(公告)日：2017-02-21
申请号：US14517387
申请日：2014-10-17
Applicant: Apple Inc.
Inventor： Caleb C. Han , Tongbi Jiang , Jun Zhai
CPC classification number: G01L7/08 , B81B7/0048 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C2203/0792 , G01L9/0045 , G01L9/0048 , G01L19/0618 , G01L19/146 , G01L19/148 , H01L41/094 , H01L41/1136 , H01L2224/16225 , H01L2224/32145 , H01L2224/48095 , H01L2224/73204 , H01L2224/73265 , H01L2224/94 , H01L2924/1461 , H01L2924/16151 , H01L2924/16195
Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
Abstract translation: 描述传感器封装和形成方式。 在一个实施例中，传感器封装包括支撑模具，其特征在于凹部区域和在凹部区域上方突出的支撑锚固件。 传感器模具结合到支撑锚定件，使得在传感器模具和凹部区域之间存在气隙。 传感器模具包括位于空气间隙正上方的传感器。
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公开(公告)号：US20160167949A1
公开(公告)日：2016-06-16
申请号：US14568845
申请日：2014-12-12
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
IPC: B81B7/00
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
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10.发明申请VARIOUS STRESS FREE SENSOR PACKAGES USING WAFER LEVEL SUPPORTING DIE AND AIR GAP TECHNIQUE 有权各种应力消除传感器包装使用水平支持DIE和空气隙技术公开(公告)号：US20160061677A1
公开(公告)日：2016-03-03
申请号：US14517387
申请日：2014-10-17
Applicant: Apple Inc.
Inventor： Caleb C. Han , Tongbi Jiang , Jun Zhai
IPC: G01L7/08
CPC classification number: G01L7/08 , B81B7/0048 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C2203/0792 , G01L9/0045 , G01L9/0048 , G01L19/0618 , G01L19/146 , G01L19/148 , H01L41/094 , H01L41/1136 , H01L2224/16225 , H01L2224/32145 , H01L2224/48095 , H01L2224/73204 , H01L2224/73265 , H01L2224/94 , H01L2924/1461 , H01L2924/16151 , H01L2924/16195
Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
Abstract translation: 描述传感器封装和形成方式。 在一个实施例中，传感器封装包括支撑模具，其特征在于凹部区域和在凹部区域上方突出的支撑锚固件。 传感器模具结合到支撑锚定件，使得在传感器模具和凹部区域之间存在气隙。 传感器模具包括位于空气间隙正上方的传感器。
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