公开(公告)号：US20220388116A1

公开(公告)日：2022-12-08

申请号：US17339699

申请日：2021-06-04

申请人： Applied Materials, Inc.

发明人： Jeonghoon OH ,  Christopher Heung-Gyun LEE

IPC分类号： B24B53/017 ,  B24B37/005

摘要： A method and apparatus for determining a polishing pad thickness profile are described herein. A set of displacement sensors, including an arm displacement sensor and one or more conditioning disk displacement sensors are utilized to determine the orientation of a conditioning disk and the thickness of the polishing pad. The displacement sensors are non-contact sensors, such as a laser sensor, a capacitive sensor, or an inductive sensor. Once the thickness profile of the polishing pad is determined, one or more process conditions is altered to improve substrate polishing.

公开(公告)号：US20240042571A1

公开(公告)日：2024-02-08

申请号：US18381223

申请日：2023-10-18

申请人： Applied Materials, Inc.

发明人： Chih Chung CHOU ,  Anand Nilakantan IYER ,  Ekaterina A. MIKHAYLICHENKO ,  Christopher Heung-Gyun LEE ,  Erik RONDUM ,  Tiffany Yu-nung CHEUNG ,  Shou-Sung CHANG

IPC分类号： B24B37/04 ,  H01L21/306

CPC分类号： B24B37/042 ,  H01L21/30625

摘要： Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP apparatus for processing a substrate including a pad disposed on a platen. The pad has a pad radius and a central axis from which the pad radius extends. The apparatus also include a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly and a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.

公开(公告)号：US20140273763A1

公开(公告)日：2014-09-18

申请号：US14198560

申请日：2014-03-05

申请人： APPLIED MATERIALS, INC.

发明人： Christopher Heung-Gyun LEE ,  Thomas Ho Fai LI ,  Tianyu YANG

IPC分类号： B24B53/017 ,  B24B53/00

CPC分类号： B24B53/017 ,  B24B53/003

摘要： In one embodiment, a method for cleaning a surface of a polishing pad includes conditioning the polishing pad surface and rotating the conditioned polishing pad surface. The method also includes spraying the polishing pad surface to lift debris from the conditioned polishing pad surface. The method further includes vacuuming the debris from the polishing pad surface downstream from where the condition occurs, wherein downstream is defined by a rotational direction of the polishing pad. In another embodiment, a processing station including a rotatable platen, a substrate carrier head, a polishing fluid delivery system, a conditioner, a spray nozzle, and a vacuum system is provided. The conditioner is disposed between the substrate carrier head and the spray nozzle. The vacuum system is configured to vacuum the polishing pad surface. The vacuum system is downstream from the conditioner, defined by a rotation of the platen.

摘要翻译： 在一个实施例中，用于清洁抛光垫表面的方法包括调整抛光垫表面并旋转经调节的抛光垫表面。 该方法还包括喷涂抛光垫表面以从调理的抛光垫表面提起碎屑。 该方法还包括从发生状况的下游的抛光垫表面抽吸碎屑，其中下游由抛光垫的旋转方向限定。 在另一个实施例中，提供了包括可旋转压板，基板载体头，抛光流体输送系统，调节器，喷嘴和真空系统的处理站。 调理剂设置在基板载体头部和喷嘴之间。 真空系统被配置成对抛光垫表面进行真空。 真空系统在调节器的下游，由压盘的旋转限定。

公开(公告)号：US20220097206A1

公开(公告)日：2022-03-31

申请号：US17035504

申请日：2020-09-28

申请人： Applied Materials, Inc.

发明人： Christopher Heung-Gyun LEE ,  Anand Nilakantan IYER ,  Hyuen Karen TRAN ,  Ghunbong CHEUNG

IPC分类号： B24B53/00 ,  B24B29/04

摘要： Embodiments herein generally relate to chemical mechanical polishing (CMP) systems and methods for reducing non-uniform material removal rate at or near the peripheral edge of a substrate when compared to radially inward regions therefrom. In one embodiment, a polishing system includes a substrate carrier comprising an annular retaining ring which is used to surround a to-be-processed substrate during a polishing process and a polishing platen. The polishing platen includes cylindrical metal body having a pad-mounting surface. The pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone. A surface of the second zone is recessed from surfaces of the first and third zones adjacent thereto, and a width of the second zone is less than an outer diameter of the annular retaining ring.

公开(公告)号：US20160167195A1

公开(公告)日：2016-06-16

申请号：US14919406

申请日：2015-10-21

申请人： Applied Materials, Inc.

发明人： Jie DIAO ,  Erik S. RONDUM ,  Thomas Ho Fai LI ,  Bum Jick KIM ,  Christopher Heung-Gyun LEE

IPC分类号： B24B53/017 ,  B24B37/04

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/31051 ,  H01L2224/118 ,  H01L2224/27616 ,  H01L2224/27845

摘要： Polishing pad cleaning systems and related methods are disclosed. A rotatable platen comprising a polishing pad in combination with a fluid, such as a polishing fluid, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system introduces a spray system to remove debris from the polishing pad to prevent substrate damage and improve efficiency, a waste removal system for removing used spray, used polishing fluid, and debris from the polishing pad, and a polishing fluid delivery system for providing fresh polishing fluid to the polishing pad, such that the substrate only receives fresh polishing fluid upon each complete rotation of the platen. In this manner, within die performance is enhanced, the range of certain CMP processes is improved, scratches and contamination are avoided for each polished substrate and for later-polished substrates, and platen temperatures are reduced.

摘要翻译： 公开了抛光垫清洁系统及相关方法。 包括与流体（例如抛光流体）组合的抛光垫的可旋转压板接触基底以在其表面平坦化材料并且导致碎屑。 清洁系统引入喷射系统以从抛光垫去除碎屑以防止基材损坏并提高效率，用于从抛光垫移除用过的喷雾，使用的抛光液和碎屑的废物去除系统以及用于提供 新鲜的抛光流体到抛光垫，使得基板在每个压板的完全旋转时仅接收新鲜的抛光液。 以这种方式，在模具性能提高的同时，某些CMP工艺的范围得到改善，避免了每个抛光衬底和后抛光衬底的划伤和污染，并降低了压板温度。