公开(公告)号：US20200051794A1

公开(公告)日：2020-02-13

申请号：US16529211

申请日：2019-08-01

Applicant: APPLIED MATERIALS, INC.

Inventor： ANANTHA K. SUBRAMANI ,  PRABURAM RAJA ,  STEVEN V. SANSONI ,  JOHN FORSTER ,  PHILIP KRAUS ,  YANG GUO ,  PRASHANTH KOTHNUR ,  FARZAD HOUSHMAND ,  BENCHERKI MEBARKI ,  JOHN JOSEPH MAZZOCCO ,  THOMAS BREZOCZKY

IPC: H01J37/34 ,  B08B7/00

Abstract: Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.

公开(公告)号：US20240018646A1

公开(公告)日：2024-01-18

申请号：US17865255

申请日：2022-07-14

Applicant: Applied Materials, Inc.

Inventor： ANANTHA SUBRAMANI ,  YANG GUO ,  JOHN FORSTER ,  WADE HARRELSON ,  ANDREW TOMKO ,  ANTHONY CHAN ,  SATHYA SWAROOP GANTA ,  MIKE MURTAGH ,  SANJEEV BALUJA

IPC: C23C14/50 ,  H01L21/683 ,  H01L21/687

CPC classification number: C23C14/505 ,  H01L21/6833 ,  H01L21/68785

Abstract: Embodiments disclosed herein include semiconductor processing tools. In an embodiment, the semiconductor processing tool comprises a chamber, a chuck within the chamber, where the chuck is configured to rotate, a pedestal holder around the chuck, and a utility column coupled to the chuck. In an embodiment, the utility column comprises a magnetic coupler to enable rotation of portions of the utility column and the chuck, and a rotary electrical feedthrough.

公开(公告)号：US20140262026A1

公开(公告)日：2014-09-18

申请号：US13831285

申请日：2013-03-14

Applicant: APPLIED MATERIALS, INC.

Inventor： JOHN FORSTER ,  ZHENBIN GE ,  ALAN RITCHIE

IPC: C23F1/02 ,  B05C21/00

CPC classification number: B05C21/005 ,  C23C14/35 ,  H01J37/32623 ,  H01J37/32642 ,  H01J37/32651 ,  H01J37/3408

Abstract: Variable geometry process kits for use in semiconductor process chambers have been provided herein. In some embodiments, a process kit for use in a semiconductor process chamber includes: an annular body configured to rest about a periphery of a substrate support; a first ring positioned coaxially with the annular body and supported by the annular body; a second ring positioned coaxially with the first ring and supported by the first ring; and an annular shield comprising a horizontal leg positioned coaxially with the second ring such that a portion of the horizontal leg is aligned with and below portions of the first ring and second ring.

Abstract translation: 本文提供了用于半导体处理室的可变几何工艺套件。 在一些实施例中，用于半导体处理室的处理套件包括：环形体，被配置为围绕衬底支撑件的周边放置; 第一环与环形体同轴地定位并由环形体支撑; 与所述第一环同轴并由所述第一环支撑的第二环; 以及环形护罩，其包括与所述第二环同轴地定位的水平腿，使得所述水平腿的一部分与所述第一环和所述第二环的部分对准。