APPARATUS AND METHOD FOR CONTROLLING A FLOW PROCESS MATERIAL TO A DEPOSITION CHAMBER

    公开(公告)号:US20190382890A1

    公开(公告)日:2019-12-19

    申请号:US16442527

    申请日:2019-06-16

    Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber. In embodiments, the apparatus includes a deposition chamber in fluid communication with one or more sublimators through one or more delivery lines, wherein the one or more sublimators each include an ampoule in fluid communication with the one or more delivery lines through an opening, and at least a first heat source and a second heat source, wherein the first heat source is a radiant heat source adjacent the ampoule and a second heat source is adjacent the opening, wherein the one or more delivery lines include one or more conduits between the deposition chamber and the one or more sublimators, and wherein the one or more conduits include one or more valves to open or close the one or more conduits, wherein the one or more valves in an open position prevents the flow of process material into the deposition chamber, and wherein the one or more valves in a closed position directs the flow of process material into the deposition chamber.

    MAGNETRON ASSEMBLY FOR PHYSICAL VAPOR DEPOSITION CHAMBER
    5.
    发明申请
    MAGNETRON ASSEMBLY FOR PHYSICAL VAPOR DEPOSITION CHAMBER 有权
    用于物理蒸气沉积室的MAGNETRON装配

    公开(公告)号:US20160035547A1

    公开(公告)日:2016-02-04

    申请号:US14725527

    申请日:2015-05-29

    Abstract: Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a shunt plate having a central axis and rotatable about the central axis, a closed loop magnetic pole coupled to a first surface of the shunt plate and disposed 360 degrees along a peripheral edge of the shunt plate, and an open loop magnetic pole coupled at a the first surface of the shunt plate wherein the open loop magnetic pole comprises two rows of magnets disposed about the central axis.

    Abstract translation: 本文提供了磁控管组件的方法和装置。 在一些实施例中,磁控管组件包括具有中心轴线并可围绕中心轴线旋转的分流板,耦合到分流板的第一表面并沿分流板的周边边缘设置360度的闭环磁极,以及 耦合在分流板的第一表面处的开环磁极,其中开环磁极包括围绕中心轴设置的两排磁体。

    SHOWERHEAD FOR PROVIDING MULTIPLE MATERIALS TO A PROCESS CHAMBER

    公开(公告)号:US20200048767A1

    公开(公告)日:2020-02-13

    申请号:US16533357

    申请日:2019-08-06

    Abstract: Embodiments of a showerhead are described herein. In some embodiments, a showerhead assembly includes: a first gas delivery portion having a first body, a first inlet, and a plurality of first tubes extending from the first body and defining a first plenum, wherein each tube of the plurality of first tubes includes a plurality of first holes; and a second gas delivery portion having a second body, a second inlet, and a plurality of second tubes extending from the second body and defining a second plenum fluidly independent from the first plenum, wherein each tube of the plurality of second tubes includes a plurality of second holes, and wherein the plurality of first tubes are disposed in an alternating pattern with the plurality of second tubes across a width of the showerhead assembly and a heat sink disposed between the plurality of first tubes and the plurality of second tubes.

    APPARATUS AND METHOD FOR CONTROLLING A FLOW PROCESS MATERIAL TO A DEPOSITION CHAMBER

    公开(公告)号:US20220351988A1

    公开(公告)日:2022-11-03

    申请号:US17867589

    申请日:2022-07-18

    Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber. In embodiments, the apparatus includes a deposition chamber in fluid communication with one or more sublimators through one or more delivery lines, wherein the one or more sublimators each include an ampoule in fluid communication with the one or more delivery lines through an opening, and at least a first heat source and a second heat source, wherein the first heat source is a radiant heat source adjacent the ampoule and the second heat source is adjacent the opening, wherein the one or more delivery lines include one or more conduits between the deposition chamber and the one or more sublimators, and wherein the one or more conduits include one or more valves to open or close the one or more conduits, wherein the one or more valves in an open position prevents the flow of process material into the deposition chamber, and wherein the one or more valves in a closed position directs the flow of process material into the deposition chamber.

    MULTI-ZONE COLLIMATOR FOR SELECTIVE PVD
    9.
    发明申请

    公开(公告)号:US20190353919A1

    公开(公告)日:2019-11-21

    申请号:US16414975

    申请日:2019-05-17

    Abstract: Multi-zone collimators and process chambers including multi-zone collimators for use with a multi-zone magnetron source are provided herein. In some embodiments, a multi-zone collimator for use with a multi-zone magnetron source, comprising a first collimator plate, a second collimator plate, wherein a first collimator zone having a first width is formed between the first collimator plate and the second collimator plate; and a third collimator plate, wherein a second collimator zone having a second width is formed between the second first collimator plate and the third collimator plate, wherein a length of each of the first, second and third collimator plates are different from each other.

    APPARATUS FOR PVD DIELECTRIC DEPOSITION
    10.
    发明申请
    APPARATUS FOR PVD DIELECTRIC DEPOSITION 有权
    PVD电介质沉积设备

    公开(公告)号:US20160172168A1

    公开(公告)日:2016-06-16

    申请号:US14616895

    申请日:2015-02-09

    Abstract: Apparatus for physical vapor deposition of dielectric material is provided herein. In some embodiments, a chamber lid of a physical vapor deposition chamber includes an inner magnetron assembly coupled to an inner target assembly, and an outer magnet assembly coupled to an outer target assembly, wherein the inner magnetron assembly and the inner target assembly are electrically isolated from the outer magnet assembly and the outer target assembly.

    Abstract translation: 本文提供介电材料的物理气相沉积设备。 在一些实施例中,物理气相沉积室的室盖包括耦合到内部目标组件的内部磁控管组件和联接到外部目标组件的外部磁体组件,其中内部磁控管组件和内部目标组件被电隔离 从外部磁体组件和外部目标组件。

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