公开(公告)号：US20160322234A1

公开(公告)日：2016-11-03

申请号：US15142220

申请日：2016-04-29

Applicant: APPLIED MATERIALS, INC.

Inventor： Jen Sern LEW ,  Tuck Foong KOH ,  Sriskantharajah THIRUNAVUKARASU ,  Karthik ELUMALAI ,  ENG SHENG PEH ,  JUN-LIANG SU

IPC: H01L21/324 ,  F27B9/02 ,  F27B9/10 ,  H01L21/67

CPC classification number: H01L21/3247 ,  F27B9/02 ,  F27B9/10 ,  F27B17/0025 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/67288

Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate flattening system includes: a first process chamber having a first substrate support and a first showerhead, wherein the first substrate support does not include a chucking mechanism; a first heater disposed in the first substrate support to heat a substrate placed on a first support surface of the first substrate support; a second heater configured to heat a process gas flowing through the first showerhead into a first processing volume of the first process chamber; and a second process chamber having a second substrate support, wherein the second substrate support is not heated, and wherein the first process chamber and the cooling chamber are both non-vacuum chambers.

Abstract translation: 本文提供了用于校正衬底畸形的方法和装置的实施例。 在一些实施例中，衬底平坦化系统包括：具有第一衬底支撑件和第一喷头的第一处理室，其中所述第一衬底支撑件不包括夹紧机构; 第一加热器，设置在所述第一基板支撑件中以加热放置在所述第一基板支撑件的第一支撑表面上的基板; 第二加热器，被配置为将流过所述第一喷淋头的处理气体加热到所述第一处理室的第一处理容积中; 以及具有第二基板支撑件的第二处理室，其中所述第二基板支撑件不被加热，并且其中所述第一处理室和所述冷却室都是非真空室。

公开(公告)号：US20250054737A1

公开(公告)日：2025-02-13

申请号：US18231655

申请日：2023-08-08

Applicant: Applied Materials, Inc.

Inventor： Karthik ELUMALAI ,  Ananthkrishna JUPUDI ,  Arunkumar TATTI ,  Cheng SUN ,  Ye LIU

IPC: H01J37/32

Abstract: Embodiments of substrate supports having electrostatic chucks (ESCs) for use in substrate process chambers are provided herein. In some embodiments, a substrate support includes: an electrostatic chuck (ESC) having a top surface and a plurality of mesas extending upward from the top surface, wherein an upper surface of the plurality of mesas define a substrate support surface, wherein a total surface area of the substrate support surface is about 18 to about 40 percent a total surface area of the upper surface, and wherein the ESC includes a plurality of backside gas openings extending through the ESC; and one or more chucking electrodes disposed in the ESC.

公开(公告)号：US20180218928A1

公开(公告)日：2018-08-02

申请号：US15811575

申请日：2017-11-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Eng Sheng PEH ,  Sriskantharajah THIRUNAVUKARASU ,  Jun-Liang SU ,  Shoju VAYYAPRON ,  Karthik ELUMALAI ,  Dimantha RAJAPAKSA ,  Arunkumar M Tatti

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/683 ,  H05B3/00

CPC classification number: H01L21/67115 ,  H01L21/67017 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/68757 ,  H05B3/0047

Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate support includes a base having an interior volume formed by walls extending upward from the base; a plurality of infrared lamps disposed within the interior volume; a support plate disposed above the plurality of infrared lamps, wherein the support plate includes a support surface to support a substrate; and a cover plate disposed atop the support plate and having a central opening corresponding to the support surface and an exhaust portion at a periphery of a top surface of the cover plate, wherein the exhaust portion includes a plurality of perforations fluidly coupling a space above the cover plate with an exhaust conduit formed in the cover plate. Embodiments of a showerhead assembly and processing equipment incorporating the inventive substrate support and showerhead assembly are additionally provided herein.