公开(公告)号：US20210122008A1

公开(公告)日：2021-04-29

申请号：US16803223

申请日：2020-02-27

Applicant: Applied Materials, Inc.

Inventor： Robert D. TOLLES ,  Kirk LIEBSCHER

IPC: B24B57/02 ,  B24B37/20

Abstract: In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers. Here, fluid communication between the first chamber and the second chamber is controlled by the valve disposed therebetween. Polishing fluid components are flowed into the first chamber through the plurality of first delivery lines fluidly coupled thereto to form a batch of polishing fluid. Once formed, the batch of polishing fluid is transferred to the second chamber by opening the valve. Typically, the valve is then closed and the transferred batch can be delivered to a polishing pad through the dispense nozzle fluidly coupled to the second chamber, often by pressurizing the second chamber using pressurized gas delivered thereinto through the second delivery line.

公开(公告)号：US20190030677A1

公开(公告)日：2019-01-31

申请号：US16037783

申请日：2018-07-17

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  David J. LISCHKA ,  Erik RONDUM ,  Jay GURUSAMY ,  Robert D. TOLLES ,  Steven M. ZUNIGA ,  Steven M. REEDY ,  Wai- Ming KAN

IPC: B24B37/24 ,  B24B37/005

Abstract: Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.

公开(公告)号：US20180207770A1

公开(公告)日：2018-07-26

申请号：US15875867

申请日：2018-01-19

Applicant: Applied Materials, Inc.

Inventor： Robert D. TOLLES ,  Gregory E. MENK ,  Eric DAVEY ,  You WANG ,  Huyen Karen TRAN ,  Fred C. REDEKER ,  Veera Raghava Reddy KAKIREDDY ,  Ekaterina MIKHAYLICHENKO ,  Jay GURUSAMY

IPC: B24D11/00 ,  H01L21/306 ,  C09K3/14 ,  B24D3/22 ,  B24B37/26 ,  B24B37/20

Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

公开(公告)号：US20180009079A1

公开(公告)日：2018-01-11

申请号：US15546068

申请日：2016-01-29

Applicant: Applied Materials, Inc.

Inventor： Robert D. TOLLES ,  Mahendra C. ORILALL ,  Fred C. REDEKER ,  Rajeev BAJAJ

IPC: B24B37/22 ,  B24B37/24

Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.